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PD - 96031A IRF7805PBF HEXFET(R) Chip-Set for DC-DC Converters * * * * * N Channel Application Specific MOSFETs Ideal for Mobile DC-DC Converters Low Conduction Losses Low Switching Losses Lead-Free S S S G 1 2 3 4 8 7 A D D D D 6 5 Description This new device employs advanced HEXFET Power MOSFET technology to achieve an unprecedented balance of on-resistance and gate charge. The reduced conduction and switching losses make this device ideal for high efficiency DC-DC Converters that power the latest generation of mobile microprocessors. The IRF7805PBF offers maximum efficiency for mobile CPU core DC-DC converters. SO-8 Device Features VDS RDS(on) Qg Qsw Qoss T o p V ie w IRF7805PBF 30V 11m 31nC 11.5nC 36nC Absolute Maximum Ratings Parameter VDS VGS ID @ TA = 25C ID @ TA = 70C IDM PD @TA = 25C PD @TA = 70C TJ TSTG Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS Pulsed Drain Current Continuous Drain Current, VGS @ 10V Max. 30 Units V e Power Dissipation e Power Dissipation c e @ 10V e 12 13 10 100 2.5 1.6 0.02 -55 to + 150 W/C C W A Linear Derating Factor Operating Junction and Storage Temperature Range Thermal Resistance RJL RJA g Junction-to-Ambient eg Junction-to-Drain Lead Parameter Typ. --- --- Max. 20 50 Units C/W www.irf.com 1 01/09/08 IRF7805PBF Static @ TJ = 25C (unless otherwise specified) Parameter BVDSS RDS(on) VGS(th) IDSS Drain-to-Source Breakdown Voltageh Static Drain-to-Source On-Resistanceh Gate Threshold Voltage Min. Typ. Max. Units 30 --- 1.0 --- --- --- --- --- --- --- --- --- --- --- 0.5 --- --- --- --- --- 9.2 --- --- --- --- --- --- 22 3.7 1.4 6.8 8.2 3.0 --- 16 20 38 16 --- 11 3.0 70 10 150 100 -100 31 --- --- --- 11.5 3.6 1.7 --- --- --- --- nC ns V m V A Conditions VGS = 0V, ID = 250A VGS = 4.5V, ID = 7.0A VDS = VGS, ID = 250A VDS = 30V, VGS = 0V VDS = 24V, VGS = 0V VDS = 24V, VGS = 0V, TJ = 100C VGS = 12V VGS = -12V VGS = 5.0V VDS = 16V ID = 7.0A h d Drain-to-Source Leakage Current IGSS Qg Qgs1 Qgs2 Qgd Qsw Qoss RG td(on) tr td(off) tf Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge h nA Pre-Vth Gate-to-Source Charge Post-Vth Gate-to-Source Charge Gate-to-Drain Charge Switch Charge (Qgs2 + Qgd) Output Charge nC h h VDS = 16V, VGS = 0V VDD = 16V, VGS = 4.5V ID = 7.0A RG= 2 Resistive Load Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time e Diode Characteristics Parameter IS ISM VSD Qrr Qrr(s) Continuous Source Current (Body Diode)A Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Charge Min. Typ. Max. Units --- --- --- --- --- 88 55 2.5 106 1.2 --- --- A Conditions MOSFET symbol showing the integral reverse p-n junction diode. TJ = 25C, IS = 7.0A, VGS = 0V di/dt = 700A/s VDS = 16V, VGS = 0V, IS = 7.0A di/dt = 700A/s (with 10BQ040) VDS = 16V, VGS = 0V, IS = 7.0A h f --- --- --- V nC nC Reverse Recovery Charge (with Parallel Schottky) f Notes: Repetitive rating; pulse width limited by max. junction temperature. Pulse width 300 s; duty cycle 2%. When mounted on 1 inch square copper board, t < 10 sec. Typ = measured - Qoss R is measured at TJ of approximately 90C. Devices are 100% tested to these parameters. 2 www.irf.com Typical Characteristics IRF7805PBF Fig 1. Normalized On-Resistance vs. Temperature Fig 2. Typical Gate Charge vs. Gate-to-Source Voltage 10 ISD , Reverse Drain Current (A) TJ = 150 C 1 TJ = 25 C 0.1 0.4 V GS = 0 V 0.5 0.6 0.7 0.8 0.9 VSD ,Source-to-Drain Voltage (V) Fig 3. Typical Rds(on) vs. Gate-to-Source Voltage 100 Fig 4. Typical Source-Drain Diode Forward Voltage Thermal Response (Z thJA ) D = 0.50 0.20 0.10 0.05 0.02 0.01 P DM SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJA + TA 0.01 0.1 1 10 100 1000 10 1 0.1 0.001 t1 , Rectangular Pulse Duration (sec) www.irf.com Figure 5. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 3 IRF7805PBF SO-8 Package Details 9 6 ' & % $ 7 9DH 6 6 i p 9 @ r r C F G % @ $ C !$Ab dA 6 ! " # %Y r DI8C@T HDI H6Y $"! %'' # (' " ! &$ (' '( (%' #(& $ $AA76TD8 !$AA76TD8 !!'# !## (( (% % $ A A' HDGGDH@U@ST HDI H6Y "$ &$ !$ "" $ ( !$ #' $ "' # !&AA76TD8 %"$AA76TD8 $' %! !$ $ # !& A' A r 6 FAA#$ 8 Ab#dA 'YAG & 'YAp 'YAi !$Ab dA 6 867 IPU@T) AA9DH@ITDPIDIBAEAUPG@S6I8DIBAQ@SA6TH@A #$H ((# !AA8PIUSPGGDIBA9DH@ITDPI)AHDGGDH@U@S "AA9DH@ITDPITA6S@ATCPXIADIAHDGGDH@U@STAbDI8C@Td #AAPVUGDI@A8PIAPSHTAUPAE@9@8APVUGDI@AHT !66 $AAA9DH@ITDPIA9P@TAIPUADI8GV9@AHPG9AQSPUSVTDPIT AAAAAHPG9AQSPUSVTDPITAIPUAUPA@Y8@@9A $Ab%d %AAA9DH@ITDPIA9P@TAIPUADI8GV9@AHPG9AQSPUSVTDPIT AAAAAHPG9AQSPUSVTDPITAIPUAUPA@Y8@@9A!$Ab d &AAA9DH@ITDPIADTAUC@AG@IBUCAPAAG@69AAPSATPG9@SDIBAUP AAAAA6ATV7TUS6U@ APPUQSDIU 'YA&!Ab!'d %#%Ab!$$d "YA !&Ab$d 'YA &'Ab&d SO-8 Part Marking @Y6HQG@)AUCDTADTA6IADSA& AHPTA@U DIU@SI6UDPI6G S@8UDAD@S GPBP ;;;; ) 96U@A8P9@AXX QA2A9@TDBI6U@TAG@69AS@@ QSP9V8UAPQUDPI6G A2AG6TUA9DBDUAPAAUC@A@6S XXA2AX@@F 6A2A6TT@H7GATDU@A8P9@ GPUA8P9@ Q6SUAIVH7@S Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 4 www.irf.com IRF7805PBF SO-8 Tape and Reel TERMINAL NUMBER 1 12.3 ( .484 ) 11.7 ( .461 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 330.00 (12.992) MAX. 14.40 ( .566 ) 12.40 ( .488 ) NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.01/2008 www.irf.com 5 |
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