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EMIF01-SMIC01F2
Single line IPADTM, EMI filter including ESD protection
Features

High density capacitor 1 line low-pass-filter Lead-free package High efficiency in EMI filtering Very low PCB space consumtion Very thin package: 0.65 mm High efficiency in ESD suppression (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High density capacitor technology
A B C
Flip Chip (8 bumps)
Figure 1.
Pin configuration (bump side)
3 2 1
Complies with the following standards
IEC 61000-4-2 level 4, on output pins - 15 kV (air discharge) - 8 kV (contact discharge IEC 61000-4-2 Level 1, on input pins - 2 kV (air and contact discharge) Figure 2. Schematic
A3
R1
Application
Single ended microphone in mobile phones and portable devices
C3
C1 C2 R3 C5
R2 C3
B1
Description
The EMIF01-SMIC01F2 is a highly integrated device designed to suppress EMI/RFI noise for microphone line filtering. The EMIF01-SMIC01F2 Flip Chip packaging means the package size is equal to the die size. That is why EMIF01-SMIC01F2 is a very small device. Additionally, this filter includes ESD protection circuitry which prevents damage to the appication when subjected to ESD surges up to 15 kV.
B3
B2
C2
C4 R4
C1
R5
A2
B2, B3, C2 are GND bumps
TM: IPAD is a trademark of STMicroelectronics
April 2008
Rev 2
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www.st.com 7
Characteristics
EMIF01-SMIC01F2
1
Characteristics
Table 1.
Symbol
Absolute maximum matings (Tamb = 25 C)
Parameter and test conditions Output lines (C3) ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge Value Unit
15 8 kV
VPP Input lines (A3, A2, B1, C1) ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharg Tj Top Tstg Maximum junction temperature Operating temperature range Storage temperature range 2 2 125 - 40 to + 85 - 55 to + 150
C C C
Table 2.
Symbol VBR IRM VRM VCL Rd IPP
Electrical characteristics (Tamb = 25 C)
Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Test conditions IR = 1 mA VRM = 3 V per line VLINE = 0 V, VOSC = 30 mV, F = 1 MHz, Tolerance 20% VLINE = 0 V, VOSC = 30 mV, F = 1 MHz, Tolerance 20% Tolerance 5% Tolerance 5% 1 150 50 2.2 Min. 14 0.5 Typ. Max. Unit V A nF pF k
Symbol VBR IRM C1, C2, C3, C4, C5 R1, R5 R2, R3, R4
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EMIF01-SMIC01F2 Figure 3. Filtering measurements
0.00
Ordering information scheme
dB
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
F (Hz)
-90.00 100.0k 1.0M C3-B1 line 10.0M 100.0M 1.0G
Figure 4.
ESD response to IEC 61000-4-2 (+15 kV air discharge) on one output line
Figure 5.
ESD response to IEC 61000-4-2 (-15 kV air discharge) on one output line
Vin=5V/d
Vin=5V/d
Vout=5V/d 1s/d
Vout=5V/d 1s/d
2
Figure 6.
Ordering information scheme
Ordering information scheme
EMIF
EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, pitch = 500 m, bump = 310 m
yy
-
xxx zz
Fx
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Package information
EMIF01-SMIC01F2
3
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 7. Flip Chip dimensions
500 m 50
310 m 50
650 m 65
500 m 50
210 m 1.42 mm 50 m
Figure 8.
Flip Chip footprint
210 m
Figure 9.
1.42 mm 50 m
Marking
Copper pad Diameter: 250 m recommended, 300 m max. Solder stencil opening: 330 m recommended
Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week)
E
Solder mask opening recommendation: 340 m min. for 300 m copper pad diameter
xxz y ww
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EMIF01-SMIC01F2 Figure 10. Tape and reel specification
Dot identifying Pin A1 location 4 0.1
Package information
O 1.5 0.1
1.75 0.1 3.5 0.1
1.52
0.73 0.05
All dimensions in mm
8 0.3
ST E
ST E
ST E
xxx yww
xxx yww
xxx yww
4 0.1
User direction of unreeling
1.52
Note:
More packing information is available in the application notes: AN1235: "Flip Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements"
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Ordering information
EMIF01-SMIC01F2
4
Ordering information
Table 3. Ordering information
Marking GA Package Flip Chip Weight 2.8 mg Base qty 5000 Delivery mode Tape and reel 7"
Order code EMIF01-SMIC01F2
5
Revision history
Table 4.
Date 03-Oct-2006
Document revision history
Revision 1 Initial release Updated values of capacitors in Table 2. C1, C2, C3, C4 from 0.85 nF to 1 nF, and C5 from 140 pF to 150 pF. Updated ECOPACK statement. Updated Figure 7, and Figure 10. Reformatted to current standards. Changes
24-Apr-2008
2
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EMIF01-SMIC01F2
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