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STPS1045 Power Schottky rectifier Main product characteristics A K IF(AV) VRRM VF 10 A 45 V 0.57 V Features and Benefits Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop Insulated package: TO-220FPAC Insulating voltage = 2000V DC Capacitance = 12 pF Avalanche capability specified K A A K TO-220AC STPS1045D TO-220FPAC STPS1045FP Description Single chip Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. This device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. March 2007 Rev 6 1/8 www.st.com 8 Characteristics STPS1045 1 Characteristics Table 1. Symbol VRRM IF(RMS) IF(AV) Absolute Ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward voltage Average forward current = 0.5 TO-220AC TO-220FPAC Tc = 150 C 10 Tc = 145 C tp = 10 ms sinusoidal tp = 2 s F = 1 kHz tp = 1 s Tj = 25 C 180 1 4000 -65 to + 175 175 10000 A A W C C V/s A Value 45 30 Unit V A IFSM Surge non repetitive forward current Repetitive peak reverse current PARM Tstg Tj dV/dt Repetitive peak avalanche power Storage temperature range Maximum junction temperature Critical rate of rise of reverse voltage Table 2. Symbol Rth(j-c) Thermal resistances Parameter TO-220AC Junction to case TO-220FPAC 4.5 Value 2.2 C/W Unit Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test Conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM IF = 20 A IF = 20 A IF = 10 A Min. Typ. Max. 100 15 0.84 0.72 0.60 V Unit A mA VF(2) Forward voltage drop Tj = 125 C Tj = 125 C 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.015 IF2(RMS) 2/8 STPS1045 Characteristics Figure 1. PF(AV)(W) 8 Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) 12 Average forward current versus ambient temperature ( = 0.5) = 0.1 7 6 = 0.05 = 0.2 = 0.5 10 Rth(j-a)=Rth(j-c) TO-220AC TO-220FPAC 8 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 11 12 T =1 6 4 T Rth(j-a)=15C/W 2 IF(AV)(A) =tp/T tp 0 0 =tp/T 25 tp Tamb(C) 50 75 100 125 150 175 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1s) 1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1 PARM(tp) PARM(25C) 0.01 tp(s) 10 100 1000 Tj(C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC) Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220FPAC) IM(A) 160 140 120 100 80 60 40 IM IM(A) 100 90 80 70 60 TC=50C TC=100C TC=50C 50 TC=100C 40 30 TC=150C t 20 10 IM t TC=150C 20 0 1E-3 =0.5 t(s) 1E-2 1E-1 1E+0 =0.5 t(s) 1E-2 1E-1 1E+0 0 1E-3 3/8 Characteristics STPS1045 Figure 7. Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220AC) Figure 8. Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220FPAC) Zth(j-c)/Rth(j-c) 1.0 1.0 Zth(j-c)/Rth(j-c) 0.8 0.8 0.6 = 0.5 0.6 = 0.5 0.4 = 0.2 0.4 = 0.2 = 0.1 T 0.2 0.2 = 0.1 T 0.0 1E-4 Single pulse tp(s) 1E-3 1E-2 =tp/T 1E-1 tp Single pulse tp(s) 1E-2 1E-1 1E+0 0.0 1E-3 =tp/T 1E+0 tp 1E+1 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) Figure 10. Reverse leakage current versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C IR(A) 1E+5 Tj=150C 1E+4 Tj=125C 1E+3 1E+2 Tj=100C Tj=75C Tj=50C 500 1E+1 Tj=25C 200 1E+0 VR(V) 1E-1 0 5 10 15 20 25 30 35 40 45 100 1 2 5 VR(V) 10 20 50 Figure 11. Forward voltage drop versus forward current (maximum values) IFM(A) 100.0 Tj=125C (typical values) Tj=25C 10.0 Tj=125C 1.0 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 4/8 STPS1045 Package Information 2 Package Information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm Maximum torque value: 0.70 Nm Figure 12. TO-220AC dimensions Dimensions Ref Millimeters Min. H2 OI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 A C D E F F1 G 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/8 Package Information Figure 13. TO-220FPAC dimensions Dimensions Ref Millimeters Min. A A H B STPS1045 Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D Dia L6 L2 L3 L5 F1 L4 D L7 E F F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS1045 Ordering Information 3 Ordering Information Delivery mode Tube Tube Ordering type STPS1045D STPS1045FP Marking STPS1045D STPS1045FP Package TO-220AC TO-220FPAC Weight 1.86 g 1.9 g Base qty 50 50 4 Revision history Date Jul-2003 22-Mar-2007 Revision 5D 6 Last release. Removed ISOWATT package. Description of Changes 7/8 STPS1045 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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