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STGB8NC60K - STGD8NC60K STGP8NC60K N-channel 600V - 8A - D2PAK / DPAK / TO-220 Short circuit rated PowerMESHTM IGBT Features Type STGB8NC60K STGD8NC60K STGP8NC60K VCES 600V 600V 600V VCE(sat)Typ @25C 2.2V 2.2V 2.2V IC @100C 8A 8A 8A 3 1 2 3 1 DPAK TO-220 Lower on voltage drop (Vcesat) Lower CRES / CIES ratio (no cross-conduction susceptibility) Very soft ultra fast recovery antiparallel diode Short circuit withstand time 10s Figure 1. Internal schematic diagram 3 1 DPAK Applications High frequency motor controls SMPS and PFC in both hard switch and resonant topologies Motor drivers Description Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESHTM IGBTs, with outstanding performances. The suffix "K" identifies a family optimized for high frequency motor control applications with short circuit withstand capability. Table 1. Device summary Marking GB8NC60K GD8NC60K GP8NC60K Package DPAK DPAK TO-220 Packaging Tape & reel Tape & reel Tube Order codes STGB8NC60K STGD8NC60K STGP8NC60K October 2007 Rev 1 1/17 www.st.com 17 Contents STGB8NC60K - STGD8NC60K - STGP8NC60K Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 4 5 6 Test circuit ................................................ 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Electrical ratings 1 Electrical ratings Table 2. Symbol VCES IC(1) IC(1) ICP(2) VGE PTOT Tj Tscw Absolute maximum ratings Value Parameter DPAK/TO-220 Collector-emitter voltage (VGS = 0) Collector current (continuous) at TC = 25C Collector current (continuous) at TC = 100C Pulsed collector current Gate-emitter voltage Total dissipation at TC = 25C Operating junction temperature Short circuit withstand time 65 - 55 to 150 10 600 15 8 30 20 62 DPAK V A A A V W C s Unit 1. Calculated according to the iterative formula: T -T JMAX C I ( T ) = ----------------------------------------------------------------------------------------------------CC R xV (T , I ) THJ - C CESAT ( MAX ) C C 2. Pulse width limited by max junction temperature Table 3. Symbol Rthj-case Rthj-amb Thermal resistance Parameter TO-220 / DPAK Thermal resistance junction-case max DPAK Thermal resistance junction-ambient Max 2.0 62.5 C/W C/W Value 1.9 Unit C/W 3/17 Electrical characteristics STGB8NC60K - STGD8NC60K - STGP8NC60K 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 4. Symbol VBR(CES) VCE(sat) VGE(th) ICES IGES gfs Static Parameter Collector-emitter breakdown voltage Test conditions IC= 1mA, VGE= 0 Min. 600 2.2 1.8 4.5 2.75 Typ. Max. Unit V V V V A mA nA S Collector-emitter saturation VGE= 15V, IC=3A voltage VGE= 15V, IC= 3A, Tc= 125C Gate threshold voltage Collector cut-off current (VGE = 0) Gate-emitter leakage current (VCE = 0) Forward transconductance VCE= VGE, IC= 250 A VCE= Max rating,TC= 25C VCE=Max rating,TC= 125C VGE= 20V, VCE= 0 VCE = 15V, IC= 3A 6.5 150 1 100 15 Table 5. Symbol Cies Coes Cres Qg Qge Qgc Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-emitter charge Gate-collector charge Test conditions VCE = 25V, f = 1MHz, VGE = 0 VCE = 390V, IC = 3A, VGE = 15V, (see Figure 18) Min. Typ. Max. 380 46 8.5 19 5 9 Unit pF pF pF nC nC nC 4/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Electrical characteristics Table 6. Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on tr(Voff) td(off) tf tr(Voff) td(off) tf Switching on/off (inductive load) Parameter Turn-on delay time Current rise time Turn-on current slope Test conditions VCC = 390V, IC = 3A , RG= 10 VGE= 15V, Tj= 25C (see Figure 19) VCC = 390V, IC =3A RG= 10 VGE= 15V, , Tj=125C (see Figure 19) Vcc = 390V, IC = 3A, RGE = 10 VGE =15V, , TJ=25C (see Figure 19) Vcc = 390V, IC = 3A, , RGE=10 VGE =15V, Tj=125C (see Figure 19) Min. Typ. 17 6 655 Max. Unit ns ns A/s Turn-on delay time Current rise time Turn-on current slope 16.5 6.5 575 ns ns A/s Off voltage rise time Turn-off delay time Current fall time 33 72 82 ns ns ns Off voltage rise time Turn-off delay time Current fall time 60 106 136 ns ns ns Table 7. Symbol Eon(1) Eoff(2) Ets Eon(1) Eoff(2) Ets Switching energy (inductive load) Parameter Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses Test conditions VCC = 390V, IC = 3A , RG= 10 VGE=15V, Tj=25C (see Figure 19) VCC = 390V, IC = 3A , RG= 10 VGE= 15V, Tj= 125C (see Figure 19) Min. Typ. 55 85 140 87 162 249 Max. Unit J J J J J J 1. Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25C and 125C) 2. Turn-off losses include also the tail of the collector current 5/17 Electrical characteristics STGB8NC60K - STGD8NC60K - STGP8NC60K 2.1 Figure 2. Electrical characteristics (curves) Output characteristics Figure 3. Transfer characteristics Figure 4. Transconductance Figure 5. Collector-emitter on voltage vs temperature Figure 6. Gate charge vs gate-source voltage Figure 7. Capacitance variations 6/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Figure 8. Normalized gate threshold voltage vs temperature Figure 9. Electrical characteristics Collector-emitter on voltage vs collector current Figure 10. Normalized breakdown voltage vs temperature Figure 11. Switching losses vs temperature Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current 7/17 Electrical characteristics Figure 14. Thermal impedance for TO-220/ DPAK STGB8NC60K - STGD8NC60K - STGP8NC60K Figure 15. Turn-off SOA Figure 16. Thermal impedance for DPAK 8/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Test circuit 3 Test circuit Figure 18. Gate charge test circuit Figure 17. Test circuit for inductive load switching Figure 19. Switching waveform Figure 20. Diode recovery time waveform 9/17 Package mechanical data STGB8NC60K - STGD8NC60K - STGP8NC60K 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Package mechanical data TO-220 mechanical data mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 P Q 4.40 0.61 1.14 0.49 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6 inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116 11/17 Package mechanical data STGB8NC60K - STGD8NC60K - STGP8NC60K DPAK MECHANICAL DATA mm. DIM. MIN. A A1 A2 B b4 C C2 D D1 E E1 e e1 H L (L1) L2 L4 R V2 2.2 0.9 0.03 0.64 5.2 0.45 0.48 6 5.1 6.4 4.7 2.28 4.4 9.35 1 2.8 0.8 0.6 0.2 0 8 0 1 0.023 0.008 8 4.6 10.1 0.173 0.368 0.039 0.110 0.031 0.039 6.6 0.252 0.185 0.090 0.181 0.397 TYP MAX. 2.4 1.1 0.23 0.9 5.4 0.6 0.6 6.2 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.200 0.260 TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 inch 0068772-F 12/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Package mechanical data DPAK mechanical data mm Dim Min A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10 8.5 4.88 15 1.27 1.4 2.4 0.4 0 4 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.50 0.055 0.094 10.4 0.393 Typ Max 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 Min 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 inch Typ Max 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 0.315 0.409 0.334 0.208 0.625 0.55 0.68 0.126 0.015 13/17 Packaging mechanical data STGB8NC60K - STGD8NC60K - STGP8NC60K 5 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956 BASE QTY 1000 * on sales type 14/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Packaging mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 16.4 50 22.4 18.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK QTY 2500 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 B1 D D1 E F K0 P0 P1 P2 R W BASE QTY 2500 mm MIN. 6.8 10.4 1.5 1.5 1.65 7.4 2.55 3.9 7.9 1.9 40 15.7 16.3 inch MIN. MAX. 7 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574 0.618 0.641 MAX. 10.6 12.1 1.6 1.85 7.6 2.75 4.1 8.1 2.1 15/17 Revision history STGB8NC60K - STGD8NC60K - STGP8NC60K 6 Revision history Table 8. Date 02-Oct-2007 Document revision history Revision 1 First release Changes 16/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. 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