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HZC Series Silicon Epitaxial Planar Zener Diode for Surge Absorb REJ03G1204-0200 (Previous: ADE-208-1436A) Rev.2.00 Jul 04, 2005 Features * These diodes are delivered taped. * Ultra small Flat Lead Package (UFP) is suitable for surface mount design. Ordering Information Ordering Information Type No. HZC Series Laser Mark Let to Mark Code Package Name UFP Package Code (Previous Code) PWSF0002ZA-A (UFP) Pin Arrangement Cathode mark Mark 1 51 2 1. Cathode 2. Anode Rev.2.00 Jul 04, 2005 page 1 of 5 HZC Series Absolute Maximum Ratings (Ta = 25C) tem Power dissipation Junction temperature Storage temperature Note: See Fig2. Symbol Pd * Tj Tstg Value 150 150 -55 to +150 Unit mW C C Electrical Characteristics (Ta = 25C) Zener Voltage VZ (V) * Type No. HZC2.0 HZC2.2 HZC2.4 HZC2.7 HZC3.0 HZC3.3 HZC3.6 HZC3.9 HZC4.3 HZC4.7 HZC5.1 HZC5.6 HZC6.2 HZC6.8 HZC7.5 HZC8.2 HZC9.1 HZC10 HZC11 HZC12 HZC13 HZC15 HZC16 HZC18 HZC20 HZC22 HZC24 HZC27 HZC30 HZC33 HZC36 Min 1.90 2.10 2.30 2.50 2.80 3.10 3.40 3.70 4.01 4.42 4.84 5.31 5.86 6.47 7.06 7.76 8.56 9.45 10.44 11.42 12.47 13.84 15.37 16.94 18.86 20.88 22.93 25.10 28.00 31.00 34.00 1 Test Condition IZ (mA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 Reverse Current Test IR (A) Condition Max 120.0 120.0 120.0 120.0 50.0 20.0 10.0 10.0 10.0 10.0 5.0 5.0 2.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 VR (V) 0.5 0.7 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.5 2.5 3.0 3.5 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 15.0 17.0 19.0 21.0 23.0 25.0 27.0 Dynamic Resistance Test rd () Condition Max 100 100 100 110 120 130 130 130 130 130 130 80 50 30 30 30 30 30 30 35 35 40 40 45 50 55 60 70 80 80 90 IZ (mA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 ESD-Capability * -- (kV) * Min 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 25 20 2 2 Max 2.20 2.40 2.60 2.90 3.20 3.50 3.80 4.10 4.48 4.90 5.37 5.92 6.53 7.14 7.84 8.64 9.55 10.55 11.56 12.60 13.96 15.52 17.09 19.03 21.08 23.17 25.57 28.90 32.00 35.00 38.00 Notes: 1. Tested with pulse (Pw = 40 ms). 2. C =150 pF, R = 330 , Both forward and reverse direction 10 pulse Failure criterion ; According to IR spec Rev.2.00 Jul 04, 2005 page 2 of 5 HZC Series Mark Code Type No. HZC2.0 HZC2.2 HZC2.4 HZC2.7 HZC3.0 HZC3.3 HZC3.6 HZC3.9 HZC4.3 HZC4.7 HZC5.1 HZC5.6 HZC6.2 HZC6.8 HZC7.5 HZC8.2 HZC9.1 HZC10 HZC11 HZC12 HZC13 HZC15 HZC16 HZC18 HZC20 HZC22 HZC24 HZC27 HZC30 HZC33 Mark No. 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 10 * 11 * 12 * 13 * 15 * 16 * 18 * 20 * 22 * 24 * 27 * 30 * 33 * HZC36 36 * Note: HZC10 To HZC36 has , on the right of Laser Mark. Rev.2.00 Jul 04, 2005 page 3 of 5 HZC Series Main Characteristic HZC2.4 HZC3.0 HZC3.6 HZC4.3 HZC5.1 HZC6.2 HZC7.5 HZC8.2 HZC9.1 HZC10 HZC12 HZC13 HZC16 HZC18 10 8 Zener Current IZ (mA) 6 HZC6.8 HZC2.0 HZC15 HZC11 HZC20 HZC22 HZC24 HZC27 HZC30 HZC33 4 2 0 0 4 8 12 16 20 24 28 Zener Voltage VZ (V) 32 HZC36 36 40 Fig.1 Zener current vs. Zener voltage Zener Voltage Temperature Coefficient Z (mV/C) Zener Voltage Temperature Coefficient Z (%/C) 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 -0.01 -0.02 -0.03 -0.04 -0.05 -0.06 0 250 Polyimide board 20hx15wx0.8t %/C mV/C 40 35 30 25 20 15 10 5 0 -5 -10 -15 -20 -25 Power Dissipation Pd (mW) 200 3.0 1.5 150 1.5 unit: mm 100 50 5 10 15 20 25 30 35 40 45 0 0 50 100 150 Zener Voltage VZ (V) Fig.2 Temperature Coefficient vs. Zener voltage Ambient Temperature Ta (C) Fig.2 Power Dissipation vs. Ambient Temperature Rev.2.00 Jul 04, 2005 page 4 of 5 0.8 200 HZC Series Package Dimensions JEITA Package Code SC-79 RENESAS Code PWSF0002ZA-A Previous Code UFP / UFPV MASS[Typ.] 0.0016g D b E HE c l1 e1 A l1 b2 Reference Symbol Dimension in Millimeters Pattern of terminal position areas A b c D E HE b2 e1 l1 Min 0.50 0.25 0.08 0.70 1.10 1.50 Nom 0.60 0.30 0.80 1.20 1.60 0.80 1.70 0.60 Max 0.70 0.35 0.18 0.90 1.30 1.70 Rev.2.00 Jul 04, 2005 page 5 of 5 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145 http://www.renesas.com Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 (c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .3.0 |
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