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PROTECTION PRODUCTS - RailClamp(R) Description
RailClamps(R) are surge rated diode arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage on the power line, protecting any downstream components. The low capacitance array configuration allows the user to protect four high-speed data or transmission lines. The low inductance construction minimizes voltage overshoot during high current surges. This device is optimized for ESD protection of portable electronics. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge).
RailClamp(R) Low Capacitance TVS Array
Features
Transient protection for high-speed data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Array of surge rated diodes with internal TVS Diode Small package (2.4 x 2.2mm) saves board space Protects up to four I/O lines & power line Low capacitance (<3pF) for high-speed interfaces No insertion loss to 2.0GHz Low leakage current and clamping voltage Low operating voltage: 5.0V Solid-state silicon-avalanche technology
RCLAMP0504F
Mechanical Characteristics
EIAJ SC-70 6L package Lead Finish: Matte Tin RoHS/WEEE Compliant Molding compound flammability rating: UL 94V-0 Marking : F54 Packaging : Tape and Reel per EIA 481
Applications
USB 2.0 USB OTG Monitors and Flat Panel Displays Digital Visual Interface (DVI) High-Definition Multimedia Interface (HDMI) Gigabit Ethernet SIM Ports IEEE 1394 Firewire Ports
Circuit Diagram
Schematic & PIN Configuration
5
1
1 3 4 6
6 5 4
2 3
2
SC-70 6L (Top View)
Revision 11/18/2008 1 www.semtech.com
RCLAMP0504F
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Power (tp = 8/20s) Peak Pulse Current (tp = 8/20s) ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Pp k IP P VESD TJ TSTG Value 150 6 15 8 -55 to +125 -55 to +150 Units Watts A kV C C
Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbol VRWM V BR IR VC VC Cj Conditions Pi n 5 to 2 It = 1mA Pi n 5 to 2 VRWM = 5V, T=25C Pi n 5 to 2 IPP = 1A, tp = 8/20s A n y p i n to p i n 2 IPP = 6A, tp = 8/20s A n y p i n to p i n 2 VR = 0V, f = 1MHz Any I/O p in to p in 2 VR = 0V, f = 1MHz Between I/O p ins 6 3 15 25 3 1.5 Minimum Typical Maximum 5 Units V V A V V pF pF
Note 1: I/O pins are pin 1, 3, 4, and 6
(c) 2008 Semtech Corp.
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RCLAMP0504F
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
110 100
Power Derating Curve
Peak Pulse Power - P PP (kW)
% of Rated Power or IPP
90 80 70 60 50 40 30 20 10
1
0.1
0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000
0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC)
Pulse Waveform
110 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 Time (s) 20 25 30 td = IPP/2
PP
Clamping Voltage vs. Peak Pulse Current
Waveform Parameters: tr = 8s td = 20s
25 Waveform Parameters: tr = 8s td = 20s
Clamping Voltage - VC (V)
20
Pin 1, 3, 4, or 6 to pin 2
Percent of I
e
-t
15
Pin 5 to pin 2
10
5 0 1 2 3 4 Peak Pulse Current - IPP (A) 5 6
Forward Voltage vs. peak Pulse Current
8 7 Forward Voltage - V F (V)
Normalized Capacitance 2
Capacitance vs. Reverse Voltage (Normalized to 0V)
f = 1MHz
6 5 4 3 2 1 0 0 1 2 3 4 5 6 Waveform Parameters: tr = 8s td = 20s
1.5
Any I/O Pin to Pin 2
1
0.5
0 0 1 2 3 4 5 Reverse Voltage - VR (V)
Peak Pulse Current - IPP (A)
(c) 2008 Semtech Corp.
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RCLAMP0504F
PROTECTION PRODUCTS Typical Characteristics
Insertion Loss S21 (I/O to Pin 2)
CH1 S21 LOG 6 dB / REF 0 dB
Insertion Loss S21 (I/O to I/O)
CH1 S21 LOG 6 dB / REF 0 dB
START . 030 MHz
. STOP 3000 000000 MHz
START. 030 MHz
. STOP 3000 000000 MHz
Analog Crosstalk
CH1 S21 LOG 20 dB/ REF 0 dB
ESD Response (8kV Contact per IEC 61000-4-2)
START. 030 MHz
. STOP 3000 000000 MHz
Note: Data is taken with a 10x attenuator
(c) 2008 Semtech Corp.
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RCLAMP0504F
PROTECTION PRODUCTS Applications Information
Device Connection Options for Protection of Four High-Speed Data Lines This device is designed to protect data lines by clamping them to a fixed reference. When the voltage on the protected line exceeds the reference voltage the steering diodes are forward biased, conducting the transient current away from the sensitive circuitry. Data lines are connected at pins 1, 3, 4 and 6. Pin 2 should be connected directly to a ground plane. The path length is kept as short as possible to minimize parasitic inductance. The positive reference is connected at pin 5. The options for connecting the positive reference are as follows: 1. To protect data lines and the power line, connect pin 5 directly to the positive supply rail (VCC). In this configuration the data lines are referenced to the supply voltage. The internal TVS diode prevents over-voltage on the supply rail. 2. In applications where the supply rail does not exit the system, the internal TVS may be used as the reference. In this case, pin 5 is not connected. The steering diodes will begin to conduct when the voltage on the protected line exceeds the working voltage of the TVS (plus one diode drop). 3. In applications where complete supply isolation is desired, the internal TVS is again used as the reference and VCC is connected to one of the I/O inputs. An example of this configuration is the protection of a SIM port. The Clock, Reset, I/O, and VCC lines are connected at pins 1, 3, 4, and 6. Pin 2 is connected to ground and pin 5 is not connected. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
(c) 2008 Semtech Corp. 5 www.semtech.com
Protection of Four Data Lines and Power Supply Line
Protection of Four Data Lines Using Internal TVS Diode as Reference
RCLAMP0504F
PROTECTION PRODUCTS Typical Applications
SIM Port - Protection of Three Data Lines and VCC
USB OTG Receptable Carkit
To Phone
Mini B Receptable
VBus DD+ ID GND
Shield Gnd
1 2 3 6 5 4
Mini A Receptable
USB OTG Carkit Protection
(c) 2008 Semtech Corp.
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RCLAMP0504F
PROTECTION PRODUCTS Typical Applications
SD12
RCLAMP0504F
IEEE 1394 Firewire Protection
RCLAMP0504F
RCLAMP0504F
Gigabit Ethernet Protection
(c) 2008 Semtech Corp. 7 www.semtech.com
RCLAMP0504F
PROTECTION PRODUCTS Outline Drawing - SC70-6L
A e1
N
D
DIM
A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc
A
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
.043 .000 .004 .028 .035 .039 .012 .006 .003 .009 .071 .079 .087 .045 .049 .053 .083 BSC .026 BSC .051 .010 .014 .018 (.017) 6 0 8 .004 .004 .012 1.10 0.10 0.00 0.70 0.90 1.00 0.15 0.30 0.08 0.22 1.80 2.00 2.20 1.15 1.25 1.35 2.10 BSC 0.65 BSC 1.30 BSC 0.26 0.36 0.46 (0.42) 6 0 8 0.10 0.10 0.30
E/2 E1 E
ccc C 2X N/2 TIPS
1
2
e B D
aaa C SEATING PLANE C bxN bbb A1
A2
H C A-B D GAGE PLANE 0.15 L (L1) c
01
DETAIL SIDE VIEW
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
A
SEE DETAIL
A
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-203, VARIATION AB.
Land Pattern - SC70-6L
X
DIM
C G Z C G P X Y Z
DIMENSIONS MILLIMETERS INCHES
(.073) .039 .026 .016 .033 .106 (1.85) 1.00 0.65 0.40 0.85 2.70
Y
P
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
(c) 2008 Semtech Corp.
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RCLAMP0504F
PROTECTION PRODUCTS Marking Ordering Information
Part Number RClamp 0504F.TCT Qty per Reel 3,000 Reel Size 7 Inch
F54
1
RailClamp and RClamp are trademarks of Semtech Corporation
Tape and Reel Specification
F54
F54
F54
F54
F54
F54
F54
F54
Device Orientation in Tape
Tape Width
B, (Max)
D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000)
D1 ( M IN )
E 1.750.10 mm (.069.004)
F
K (MAX)
P 4.00.1 mm (.157.004)
P0 4.00.1 mm (.157.004)
P2
T(MAX)
W
8 mm
4.2 mm (.165)
1.0 mm (.039)
3.50.05 mm (.138.002)
2.4 mm (.094)
2.00.05mm (.079.002)
0.4 mm (.016)
8.3 mm (.312.012)
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
(c) 2008 Semtech Corp. 9 www.semtech.com

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