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*Customer:
Pb Free
SPECIFICATION
ITEM MODEL Revision Date CHIP LED DEVICE SSC-HBFR411-SK Rev0.0(071204)
[Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use
Customer
Approved by Approved by Approved by
Supplier
Drawn by Checked by Approved by
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HBFR411-S Seoul Semiconductor
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1. Features
Package : 1.6 1.5 0.5mm Untinted, Diffused flat mold Wavelength : 465 (Blue), 625 (Red)
2. Absolute Maximum Ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM*1 VR Topr Tstg Blue Red Blue Red Blue Red 5 -30 ~ +85 E E -40 ~ +100 Value 72 72 20 30 50 60 I
(Ta=25E ) Unit N I
V
*1 IFM conditions: Pulse width TwA 0.1ms, Duty ratioA 1/10
3. Electro-optical Characteristics Parameter Forward Voltage Reverse Current Luminous Intensity*2 Wavelength e Ae 2e
1/2
(Ta=25E ) Condition IF=20I VR=5V IF=20I IF=20I IF=20I IF=20I Color Blue Red Blue Red Blue Red Blue Red Blue Red Blue Red Min 25 50 462 615 Typ 3.2 1.9 60 90 470 625 30 25 150 150 Max 3.7 2.4 10 10 100 150 475 635 Unit V E mcd
Symbol VF IR IV
D
Spectral Bandwidth Viewing angle*3
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 e
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv 20 %, D 2 nm, VF 0.1 V)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HBFR411-S
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4. Characteristic Diagram
Forward Current vs Forward Voltage
100
Relative Intensity vs Forward Current
140
Red
120
Forward Current IF(mA)
Relative Intensity IV(%)
Red
10
100 80 60 40 20 0
Blue
Blue
1
0.1 1.8
2.2
2.6
3.0
3.4
0
5
10
15
20
25
30
Forward Voltage VF(V)
Forward Current IF(mA)
Forward Current Derating Curve
40
Radiation Diagram
Red
30
Forward current IF(mA)
20
Blue
10
0 -25
0
25
50
75
100
Ambient temperature Ta(E )
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HBFR411-S
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5. Soldering Profile Reflow Soldering Conditions/ Profile (1) Lead Solder -Preliminary heating to be at 150E max. for 2 minutes max. -Soldering heat to be at 240E max. for 5 seconds max.
LED Surfa c e te mp e ra ture
LED Surface t e mpe rat ure
C AE Oper ati o n he at ing 240
150
~
Pre- hea ting
Tem p era ture ris e : 5AE C/sec .
Co olin g: -5 AEC /s ec .
120
0 60 to 120 sec. 5sec. ma x
(2) Lead- Free Solder -Preliminary heating to be at 150E max. for 2 minutes max. -Soldering heat to be at 260E max. for 10 seconds max.
AEC O p er at io n heat in g 26 0
15 0 ~ 12 0 0
P re - h e a ting
Te m p e rat ure ris e : 5 AE C/ s e c .
Cool in g: -5 AE C/ s e c .
60 t o 1 20 sec.
10 s e c .
(3) Hand Soldering conditions -Not more than 3 seconds @MAX280E , under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don't guarantee the products.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HBFR411-S
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6. Outline Dimension
0. 4 1.5 2 4 Marking (0.18) Re s in 1.1 1.2 0.8 0.2
Tolerance: 3/4 0.1,
Cath o de
2 4
Unit: (R)
0. 8 0. 2 1.8
1.6
Blue
Red
PCB 0.4 1 0.8 3 0.2 0.5 0.6 1 3
Ano de
[ Rec omm e nded S o lder Pa tte rn]
7. Packing
Tolerance: 3/4 0.2,
+0 .1 -0 0 .05 3/4
3/4 0.05 3/4 0.1
Unit: (R)
4.0 1.5
0 .1 3/4
1.75
1.75
2.0
0.2
3/40.05
3/4 0.05
3.5
4.0
3/40.1
0.5
3/40.0
5
1.73
3/40.0
5
(2.75)
8.0
3/4 0.2
0.7
3/40.0
5
18 0
+0 -3
11 .4 9
0 .3 3/4
2
3/40 .2
22 13
3/40 .2
Label
(1) Quantity : 4000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10pitches to be 3/4 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
60
+0.2 -0
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HBFR411-S
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2.4
8. Reel Packing Structure
Re el
P/ N: # # # # # # # # # #
##
A|
Ci
SSC- HBFR- S
Lot No # # # # # # # # #
o1/4 (R)*
: 0 00 3
Alumi um Vinyl Bag n
P/ N: # # # # # # # # # #
##
A|Ci
S SC- HBFR- S
Lot No # # # # # # # # #
:1/4o*(R)
3 000
O Box uter
*Mat rial: Paper(SWB(B)) e 3 a 7inch 245 c
CHIP LE D
PART : SSC-H BFR- S CODE : Q ' Y T : 0, 000EA 3
TYPE
SIZE(mm) c b 220 142
CHIP LD E b a
LO NO : T DATE :
SEOU L SEM ICONDU CTOR CO. , LTD
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HBFR411-S
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9. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant . Otherwise, to store them in the following environment is recommended. Temperature : 5E ~30E (2) Attention after opened However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40E Humidity : less than 30% . . (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 603/4 5E 100Hr at 803/4 5E or 12Hr at 1003/4 5E (4) In case of supposed the components is humid, shall be dried dip-solder just before. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (11) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (13) The LEDs must be soldered within seven days after opening the moisture-proof packing. (14) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (15) The appearance and specifications of the product may be modified for improvement without notice. Humidity : 60%HR max.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HBFR411-S
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