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LTC3736-2 Dual 2-Phase, No RSENSETM, Synchronous Controller with Output Tracking DESCRIPTIO
The LTC(R)3736-2 is a 2-phase dual synchronous step-down switching regulator controller with tracking that drives external complementary power MOSFETs using few external components. The constant frequency current mode architecture with MOSFET VDS sensing eliminates the need for sense resistors and improves efficiency. Power loss and noise due to the ESR of the input capacitance are minimized by operating the two controllers out of phase. Pulse-skipping operation provides high efficiency at light loads. 100% duty cycle capability provides low dropout operation, extending operating time in battery-powered systems. The switching frequency can be programmed up to 750kHz, allowing the use of small surface mount inductors and capacitors. For noise sensitive applications, the LTC3736-2 switching frequency can be externally synchronized from 250kHz to 850kHz. An internal soft-start, which can be lengthened externally, smoothly ramps the output voltage during start-up. The LTC3736-2 is available in the tiny thermally enhanced (4mm x 4mm) QFN and 24-lead narrow SSOP packages.
, LTC and LT are registered trademarks of Linear Technology Corporation. No RSENSE is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents, including 5481178, 5929620, 6144194, 6580258, 6304066, 6611131, 6498466.
FEATURES

No Current Sense Resistors Required Out-of-Phase Controllers Reduce Required Input Capacitance Tracking Function Wide VIN Range: 2.75V to 9.8V 0.6V 1% Voltage Reference High Current Limit Constant Frequency Current Mode Operation Low Dropout Operation: 100% Duty Cycle True PLL for Frequency Locking or Adjustment Selectable Pulse-Skipping/Forced Continuous Operation Auxiliary Winding Regulation Internal Soft-Start Circuitry Power-Good Output Voltage Monitor Output Overvoltage Protection Micropower Shutdown: IQ = 9A Tiny Low Profile (4mm x 4mm) QFN and Narrow SSOP Packages
APPLICATIO S

One or Two Lithium-Ion Powered Devices Notebook and Palmtop Computers, PDAs Portable Instruments Distributed DC Power Systems
TYPICAL APPLICATIO
High Efficiency, 2-Phase, Dual Synchronous DC/DC Step-Down Converter
VIN 2.75V TO 9.8V VIN SENSE1+ SENSE2+ TG1 2.2H TG2 2.2H 10F x2
EFFICIENCY (%)
Efficiency and Power Loss vs Load Current (Figure 15 Circuit)
100 95 90 85 80 75 70 65 POWER LOSS 0.1 VOUT = 2.5V 10
SW1 SW2 LTC3736-2 BG1 BG2 PGND VFB2 ITH2 SGND 15k 220pF 15k PGND VFB1 220pF 59k ITH1
VOUT1 2.5V
187k
118k
VOUT2 1.8V 47F
47F
59k
37362 TA01a
U
60 55 50
U
U
EFFICIENCY
1
POWER LOSS (W)
0.01
1
10 100 1000 LOAD CURRENT (mA)
0.001 10000
37362 TA01b
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LTC3736-2
ABSOLUTE
(Note 1)
AXI U
RATI GS
PGOOD ..................................................... - 0.3V to 10V TG1, TG2, BG1, BG2 Peak Output Current (<10s) ..... 1A Operating Temperature Range (Note 2) ... -40C to 85C Storage Temperature Range .................. -65C to 125C Junction Temperature (Note 3) ............................ 125C Lead Temperature (Soldering, 10 sec) (LTC3736EGN-2) .................................................. 300C
Input Supply Voltage (VIN) ........................ - 0.3V to 10V PLLLPF, RUN/SS, SYNC/FCB, TRACK, SENSE1+, SENSE2+, IPRG1, IPRG2 Voltages ................. - 0.3V to (VIN + 0.3V) VFB1, VFB2, ITH1, ITH2 Voltages .................. - 0.3V to 2.4V SW1, SW2 Voltages ............ -2V to VIN + 1V or 10V Max
PACKAGE/ORDER I FOR ATIO
TOP VIEW SW1 IPRG1 VFB1 ITH1 IPRG2 PLLLPF SGND VIN TRACK 1 2 3 4 5 6 7 8 9 24 SENSE1+ 23 PGND 22 BG1 21 SYNC/FCB 20 TG1 19 PGND 18 TG2 17 RUN/SS 16 BG2 15 PGND 14 SENSE2+ 13 SW2
SENSE1+
IPRG1
PGND
SW1
VFB1
24 23 22 21 20 19 ITH1 1 IPRG2 2 PLLLPF 3 SGND 4 VIN 5 TRACK 6 7 8 9 10 11 12 25 18 SYNC/FCB 17 TG1 16 PGND 15 TG2 14 RUN/SS 13 BG2
PGOOD
SW2
ITH2 11 PGOOD 12
GN PACKAGE 24-LEAD PLASTIC SSOP TJMAX = 125C, JA = 130C/ W
UF PACKAGE 24-LEAD (4mm x 4mm) PLASTIC QFN
TJMAX = 125C, JA = 37C/W EXPOSED PAD (PIN 25) IS PGND MUST BE SOLDERED TO PCB
ORDER PART NUMBER LTC3736EGN-2
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marking: http://www.linear.com/leadfree/
ORDER PART NUMBER LTC3736EUF-2
SENSE2+
UF PART MARKING 37362
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
PARAMETER Main Control Loops Input DC Supply Current Normal Mode Shutdown UVLO Undervoltage Lockout Threshold
The denotes specifications that apply over the full operating temperature range, otherwise specifications are at TA = 25C. VIN = 4.2V unless otherwise specified.
CONDITIONS (Note 4) RUN/SS = VIN RUN/SS = 0V VIN = UVLO Threshold -200mV VIN Falling VIN Rising

MIN
PGND
VFB2
ITH2
VFB2 10
BG1
2
U
U
W
WW
U
W
TOP VIEW
TYP
MAX
UNITS
475 9 3 1.95 2.15 2.25 2.45
750 20 10 2.55 2.75
A A A V V
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LTC3736-2
ELECTRICAL CHARACTERISTICS
PARAMETER Shutdown Threshold at RUN/SS Start-Up Current Source Regulated Feedback Voltage Output Voltage Line Regulation Output Voltage Load Regulation VFB1,2 Input Current TRACK Input Current Overvoltage Protect Threshold Overvoltage Protect Hysteresis Auxiliary Feedback Threshold Top Gate (TG) Drive 1, 2 Rise Time Top Gate (TG) Drive 1, 2 Fall Time Bottom Gate (BG) Drive 1, 2 Rise Time Bottom Gate (BG) Drive 1, 2 Fall Time Maximum Current Sense Voltage (VSENSE(MAX)) (SENSE+ - SW) Soft-Start Time Oscillator and Phase-Locked Loop Oscillator Frequency
The denotes specifications that apply over the full operating temperature range, otherwise specifications are at TA = 25C. VIN = 4.2V unless otherwise specified.
CONDITIONS RUN/SS = 0V 0C to 85C (Note 5) -40C to 85C 2.75V < VIN < 9.8V (Note 5) ITH = 0.9V (Note 5) ITH = 1.7V (Note 5) TRACK = 0.6V Measured at VFB SYNC/FCB Ramping Positive CL = 3000pF CL = 3000pF CL = 3000pF CL = 3000pF IPRG = Floating IPRG = 0V IPRG = VIN Time for VFB1 to Ramp from 0.05V to 0.55V Unsynchronized (SYNC/FCB Not Clocked) PLLLPF = Floating PLLLPF = 0V PLLLPF = VIN SYNC/FCB Clocked Minimum Synchronizable Frequency Maximum Synchronizable Frequency fOSC > fSYNC/FCB fOSC < fSYNC/FCB IPGOOD Sinking 1mA VFB with Respect to Set Output Voltage VFB < 0.6V, Ramping Positive VFB < 0.6V, Ramping Negative VFB > 0.6V, Ramping Negative VFB > 0.6V, Ramping Positive -13 -16 7 10

MIN 0.45 0.4 0.594 0.591
TYP 0.65 0.7 0.6 0.6 0.05 0.12 -0.12 10 10
MAX 0.85 1 0.606 0.609 0.2 0.5 -0.5 50 50 0.7 0.675
UNITS V A V V mV/V % % nA nA V mV V ns ns ns ns
0.66 0.525
0.68 20 0.6 40 40 50 40
220 150 320 0.667
240 167 345 0.833
260 185 370 1
mV mV mV ms
480 260 650
550 300 750 200 1150 -4 4 125 -10.0 -13.3 10.0 13.3
600 340 825 250
kHz kHz kHz kHz kHz A A mV
Phase-Locked Loop Lock Range
850
Phase Detector Output Current Sinking Sourcing PGOOD Output PGOOD Voltage Low PGOOD Trip Level
-7 -10 13 16
% % % %
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC3736E-2 is guaranteed to meet specified performance from 0C to 85C. Specifications over the -40C to 85C operating range are assured by design, characterization and correlation with statistical process controls. Note 3: TJ is calculated from the ambient temperature TA and power dissipation PD according to the following formula: TJ = TA + (PD * JAC/W)
Note 4: Dynamic supply current is higher due to gate charge being delivered at the switching frequency. Note 5: The LTC3736-2 is tested in a feedback loop that servos ITH to a specified voltage and measures the resultant VFB voltage. Note 6: Peak current sense voltage is reduced dependent on duty cycle to a percentage of value as shown in Figure 1.
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LTC3736-2 TYPICAL PERFOR A CE CHARACTERISTICS
Efficiency and Power Loss vs Load Current
100 95 90 85 VOUT = 2.5V 10
EFFICIENCY
EFFICIENCY (%)
80 75 70 65 60 55 50 1 VIN = 3.3V VIN = 5V 10 100 1000 LOAD CURRENT (mA) 0.01 POWER LOSS 0.1
Load Step (Pulse-Skipping Mode)
VOUT AC-COUPLED 100mV/DIV
IL 2A/DIV
100s/DIV VIN = 3.3V VOUT = 1.8V ILOAD = 300mA TO 3A SYNC/FCB = VIN FIGURE 15 CIRCUIT
Tracking Start-Up with Internal Soft-Start (CSS = 0F)
VOUT1 2.5V VOUT2 1.8V 500mV/ DIV
500mV/ DIV
VOUT1 2.5V VOUT2 1.8V
NORMALIZED FREQUENCY SHIFT (%)
VIN = 5V 200s/DIV RLOAD1 = RLOAD2 = 1 FIGURE 15 CIRCUIT
4
UW
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TA = 25C unless otherwise noted. Load Step (Forced Continuous Mode)
1
VOUT AC-COUPLED 100mV/DIV
POWER LOSS (W)
IL 2A/DIV
0.001 10000
VIN = 3.3V 100s/DIV VOUT = 1.8V ILOAD = 300mA TO 3A SYNC/FCB = 0V FIGURE 15 CIRCUIT
37362 G03
37362 G01
Light Load (Pulse-Skipping Mode)
Light Load (Forced Continuous Mode)
SW 5V/DIV VOUT 50mV/DIV AC COUPLED IL 2A/DIV
SW 5V/DIV VOUT 50mV/DIV AC COUPLED IL 2A/DIV
37362 G04
VIN = 5V 2.5s/DIV VOUT = 2.5V ILOAD = 300mA SYNC/FBC = VIN FIGURE 15 CIRCUIT
37362 G02
2.5s/DIV VIN = 5V VOUT = 2.5V ILOAD = 300mA SYNC/FCB = 0V FIGURE 15 CIRCUIT
37362 G05
Tracking Start-Up with External Soft-Start (CSS = 0.10F)
5 4 3 2 1 0 -1 -2 -3 -4 -5
Oscillator Frequency vs Input Voltage
VIN = 5V 40ms/DIV RLOAD1 = RLOAD2 = 1 FIGURE 15 CIRCUIT
37362 G07
2
3
4
8 6 5 7 INPUT VOLTAGE (V)
9
10
37368 G08
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LTC3736-2
TYPICAL PERFOR A CE CHARACTERISTICS
Maximum Current Sense Voltage vs ITH Pin Voltage
100 80 CURRENT LIMIT (%) 60 40 20 0 -20 FORCED CONTINUOUS MODE PULSE-SKIPPING MODE EFFICIENCY (%) 100 95 90 85 80 75 70 65 60 55 50 0.5 1 1.5 ITH VOLTAGE (V) 2
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FEEDBACK VOLTAGE (V)
Shutdown (RUN) Threshold vs Temperature
1.0 0.9
MAXIMUM CURRENT SENSE THRESHOLD (mV)
RUN/SS PULL-UP CURRENT (A)
0.8
RUN/SS VOLTAGE (V)
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -60 -40 -20 0 20 40 60 TEMPERATURE (C) 80 100
Oscillator Frequency vs Temperature
10 8
2.50 2.45
NROMALIZED FREQUENCY (%)
INPUT (VIN) VOLTAGE (V)
6 4 2 0 -2 -4 -6 -8 -10 -60 -40 -20 0 20 40 60 TEMPERATURE (C) 80 100
UW
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TA = 25C unless otherwise noted.
Efficiency vs Load Current
FIGURE 15 CIRCUIT VIN = 3.3V VOUT = 2.5V
Regulated Feedback Voltage vs Temperature
0.606 0.605 0.604 0.603 0.602 0.601 0.600 0.599 0.598 0.597 0.596 0.595
10000
37362 G10
PULSE-SKIPPING MODE (SYNC/FCB = VIN)
FORCED CONTINUOUS (SYNC/FCB = 0V) 1 100 1000 10 LOAD CURRENT (mA)
0.594 20 40 60 -60 -40 -20 0 TEMPERATURE (C)
80
100
37362 G14
RUN/SS Pull-Up Current vs Temperature
1.0 0.9 0.8 0.7 0.6 0.5 0.4 -60 -40 -20 0 20 40 60 TEMPERATURE (C)
180 175 170 165 160 155
Maximum Current Sense Threshold vs Temperature
IPRG = GND
80
100
150 -60 -40 -20 0 20 40 60 TEMPERATURE (C)
80
100
37362 G13
37362 G11
Undervoltage Lockout Threshold vs Temperature
VIN RISING
2.40
2.35
2.30
VIN FALLING
2.25
2.20
2.15
2.10 20 40 60 -60 -40 -20 0 TEMPERATURE (C)
80
100
37362 G15
37362 G16
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LTC3736-2
TYPICAL PERFOR A CE CHARACTERISTICS
Shutdown Quiescent Current vs Input Voltage
20 18
SHUTDOWN CURRENT (A)
RUN/SS = 0V
RUN/SS PIN PULL-UP CURRENT (A)
16 14 12 10 8 6 4 2 0 2 3 4 8 6 5 7 INPUT VOLTAGE (V) 9 10
PI FU CTIO S (QFN/SSOP Package)
ITH1/ITH2 (Pins 1, 8/Pins 4, 11): Current Threshold and Error Amplifier Compensation Point. Nominal operating range on these pins is from 0.7V to 2V. The voltage on these pins determines the threshold of the main current comparator. PLLLPF (Pin 3/Pin 6): Frequency Set/PLL Lowpass Filter. When synchronizing to an external clock, this pin serves as the lowpass filter point for the phase-locked loop. Normally a series RC is connected between this pin and ground. When not synchronizing to an external clock, this pin serves as the frequency select input. Tying this pin to GND selects 300kHz operation; tying this pin to VIN selects 750kHz operation. Floating this pin selects 550kHz operation. SGND (Pin 4/Pin 7): Small-Signal Ground. This pin serves as the ground connection for most internal circuits. VIN (Pin 5/Pin 8): Chip Signal Power Supply. This pin powers the entire chip except for the gate drivers. Externally filtering this pin with a lowpass RC network (e.g., R = 10, C = 1F) is suggested to minimize noise pickup, especially in high load current applications. TRACK (Pin 6/Pin 9): Tracking Input for Second Controller. Allows the start-up of VOUT2 to "track" that of VOUT1 according to a ratio established by a resistor divider on VOUT1 connected to the TRACK pin. For one-to-one tracking of VOUT1 and VOUT2 during start-up, a resistor divider with values equal to those connected to VFB2 from VOUT2 should be used to connect to TRACK from VOUT1. PGOOD (Pin 9/Pin 12): Power-Good Output Voltage Monitor Open-Drain Logic Output. This pin is pulled to ground when the voltage on either feedback pin (VFB1, VFB2) is not within 13.3% of its nominal set point. PGND (Pins 12, 16, 20, 25/Pins 15, 19, 23): Power Ground. These pins serve as the ground connection for the gate drivers and the negative input to the reverse current comparators. The Exposed Pad must be soldered to PCB ground. RUN/SS (Pin 14/Pin 17): Run Control Input and Optional External Soft-Start Input. Forcing this pin below 0.65V shuts down the chip (both channels). Driving this pin to VIN or releasing this pin enables the chip, using the chip's internal soft-start. An external soft-start can be programmed by connecting a capacitor between this pin and ground. TG1/TG2 (Pins 17, 15/Pins 18, 20): Top (PMOS) Gate Drive Output. These pins drive the gates of the external P-channel MOSFETs. These pins have an output swing from PGND to SENSE+. SYNC/FCB (Pin 18/Pin 21): This pin performs three functions: 1) auxiliary winding feedback input, 2) external clock synchronization input for phase-locked loop, and 3) pulse-skipping operation or forced continuous mode select. For auxiliary winding applications, connect to a
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UW
TA = 25C unless otherwise noted.
RUN/SS Start-Up Current vs Input Voltage
0.9 0.8
RUN/SS = 0V
0.7 0.6 0.5
0.4 0.3
0.2
0.1 0
2
3
4
6 7 5 8 INPUT VOLTAGE (V)
9
10
37362 G17
37362 G18
U
U
U
LTC3736-2
PI FU CTIO S
resistor divider from the auxiliary output. To synchronize with an external clock using the PLL, apply a CMOS compatible clock with a frequency between 250kHz and 850kHz. To select pulse-skipping operation at light loads, tie this pin to V IN. Grounding this pin selects forced continuous operation, which allows the inductor current to reverse. When synchronized to an external clock, pulseskipping operation is enabled at light loads. BG1/BG2 (Pins 19, 13/Pins 22, 16): Bottom (NMOS) Gate Drive Output. These pins drive the gates of the external Nchannel MOSFETs. These pins have an output swing from PGND to SENSE+. SENSE1+/SENSE2+ (Pins 21, 11/Pins 24, 14): Positive Input to Differential Current Comparator. Also powers the gate drivers. Normally connected to the source of the external P-channel MOSFET. SW1/SW2 (Pins 22, 10/Pins 1, 13): Switch Node Connection to Inductor. Also the negative input to differential peak current comparator and an input to the reverse current comparator. Normally connected to the drain of the external Pchannel MOSFETs, the drain of the external N-channel MOSFET, and the inductor. IPRG1/IPRG2 (Pins 23, 2/Pins 2, 5): Three-State Pins to Select Maximum Peak Sense Voltage Threshold. These pins select the maximum allowed voltage drop between the SENSE+ and SW pins (i.e., the maximum allowed drop across the external P-channel MOSFET) for each channel. Tie to VIN, GND or float to select 345mV, 167mV, or 240mV respectively. VFB1/VFB2 (Pins 24, 7/Pins 3, 10): Feedback Pins. Receives the remotely sensed feedback voltage for its controller from an external resistor divider across the output.
FU CTIO AL DIAGRA
UNDERVOLTAGE LOCKOUT
0.7A RUN/SS SHDN
SYNC/FCB SYNC DETECT PHASE DETECTOR
PLLLPF
VFB1 FCB FCB
0.6V
0.54V
VFB2
-
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-
W
+
-
U
U
U
U
U
(Common Circuitry)
RVIN VIN CVIN VIN (TO CONTROLLER 1, 2)
VOLTAGE REFERENCE
0.6V VREF
EXTSS
tSEC = 1ms
+
INTSS
-
VOLTAGE CONTROLLED OSCILLATOR
CLK1 CLK2 SLOPE COMP
SLOPE1 SLOPE2
UV1
OV1 SHDN
PGOOD
+
UV2
OV2
37362 FD
7
LTC3736-2
FU CTIO AL DIAGRA
CLK1
ICMP IPRG1 SENSE1+ SHDN
+ -
EAMP
SC1
SCP
+
OV1 OVP
VFB1 IREV1
-
RICMP
-
0.68V
+
IPROG1
FCB
8
-
+
W
S R
-
+
U
U
(Controller 1)
VIN SENSE1+ CIN
RS1 Q SWITCHING LOGIC AND BLANKING CIRCUIT PGND ANTISHOOT THROUGH SENSE1+
TG1 MP1 SW1 L1 VOUT1 BG1 COUT1 MN1 PGND IREV1
OV1 SC1 FCB
SLOPE1 SW1
VFB1
R1B
R1A
0.6V
EXTSS INTSS
ITH1
RITH1
+ -
0.12V
CITH1
VFB1
PGND
SW1
37362 CONT1
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LTC3736-2
FU CTIO AL DIAGRA
CLK2
ICMP IPRG2 SENSE2+ SHDN
+ -
EAMP
SC2
SCP
TRACK
+
OV2 OVP
VFB2 IREV2
- +
FCB
-
0.68V
-
+
W
RS2 S R
-
+
U
U
(Controller 2)
SENSE2+ VIN
TG2 Q SWITCHING LOGIC AND BLANKING CIRCUIT PGND ANTISHOOT THROUGH SENSE2
+
MP2 SW2 L2 VOUT2 BG2 COUT2 MN2 PGND IREV2
OV2 SC2 FCB
SLOPE2 SW2
VFB2
R2B
R2A VOUT1 TRACK RTRACKB
0.6V RTRACKA ITH2
RITH2
+ -
0.12V
CITH2
VFB2
PGND
SW2
3736 CONT2
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LTC3736-2
OPERATIO
Main Control Loop The LTC3736-2 uses a constant frequency, current mode architecture with the two controllers operating 180 degrees out of phase. During normal operation, the top external P-channel power MOSFET is turned on when the clock for that channel sets the RS latch, and turned off when the current comparator (ICMP) resets the latch. The peak inductor current at which ICMP resets the RS latch is determined by the voltage on the ITH pin, which is driven by the output of the error amplifier (EAMP). The VFB pin receives the output voltage feedback signal from an external resistor divider. This feedback signal is compared to the internal 0.6V reference voltage by the EAMP. When the load current increases, it causes a slight decrease in VFB relative to the 0.6V reference, which in turn causes the ITH voltage to increase until the average inductor current matches the new load current. While the top P-channel MOSFET is off, the bottom N-channel MOSFET is turned on until either the inductor current starts to reverse, as indicated by the current reversal comparator, IRCMP, or the beginning of the next cycle. Shutdown, Soft-Start and Tracking Start-Up (RUN/SS and TRACK Pins) The LTC3736-2 is shut down by pulling the RUN/SS pin low. In shutdown, all controller functions are disabled and the chip draws only 9A. The TG outputs are held high (off) and the BG outputs low (off) in shutdown. Releasing RUN/SS allows an internal 0.7A current source to charge up the RUN/SS pin. When the RUN/SS pin reaches 0.65V, the LTC3736-2's two controllers are enabled. The start-up of VOUT1 is controlled by the LTC3736-2's internal soft-start. During soft-start, the error amplifier EAMP compares the feedback signal VFB1 to the internal soft-start ramp (instead of the 0.6V reference), which rises linearly from 0V to 0.6V in about 1ms. This allows the output voltage to rise smoothly from 0V to its final value, while maintaining control of the inductor current. The 1ms soft-start time can be increased by connecting the optional external soft-start capacitor CSS between the RUN/SS and SGND pins. As the RUN/SS pin continues to
10
U
(Refer to Functional Diagram)
rise linearly from approximately 0.65V to 1.3V (being charged by the internal 0.7A current source), the EAMP regulates the VFB1 proportionally linearly from 0V to 0.6V. The start-up of VOUT2 is controlled by the voltage on the TRACK pin. When the voltage on the TRACK pin is less than the 0.6V internal reference, the LTC3736-2 regulates the VFB2 voltage to the TRACK pin instead of the 0.6V reference. Typically, a resistor divider on VOUT1 is connected to the TRACK pin to allow the start-up of VOUT2 to "track" that of VOUT1. For one-to-one tracking during startup, the resistor divider would have the same values as the divider on VOUT2 that is connected to VFB2. Light Load Operation (Pulse-Skipping or Continuous Conduction) (SYNC/FCB Pin) The LTC3736-2 can be enabled to enter high efficiency pulse-skipping operation or forced continuous conduction mode at low load currents. To select pulse-skipping operation, tie the SYNC/FCB pin to a DC voltage above 0.6V (e.g., VIN). To select forced continuous operation, tie the SYNC/FCB to a DC voltage below 0.6V (e.g., SGND). This 0.6V threshold between pulse-skipping operation and forced continuous mode can be used in secondary winding regulation as described in the Auxiliary Winding Control Using SYNC/FCB Pin discussion in the Applications Information section. In forced continuous operation, the inductor current is allowed to reverse at light loads or under large transient conditions. The peak inductor current is determined by the voltage on the ITH pin. The P-channel MOSFET is turned on every cycle (constant frequency) regardless of the ITH pin voltage. In this mode, the efficiency at light loads is lower than in pulse-skipping operation. However, continuous mode has the advantages of lower output ripple and less interference with audio circuitry. When the SYNC/FCB pin is tied to a DC voltage above 0.6V or when it is clocked by an external clock source to use the phase-locked loop (see Frequency Selection and PhaseLocked Loop), the LTC3736-2 operates in PWM pulseskipping mode at light loads. In this mode, the current comparator ICMP may remain tripped for several cycles and
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LTC3736-2
OPERATIO
force the external P-channel MOSFET to stay off for the same number of cycles. The inductor current is not allowed to reverse, though (discontinuous operation). This mode, like forced continuous operation, exhibits low output ripple as well as low audio noise and reduced RF interference. However, it provides low current efficiency higher than forced continuous mode. During start-up or a short-circuit condition (VFB1 or VFB2 0.54V), the LTC3736-2 operates in pulse-skipping mode (no current reversal allowed), regardless of the state of the SYNC/FCB pin. Short-Circuit Protection When an output is shorted to ground (VFB < 0.12V), the switching frequency of that controller is reduced to 1/5 of the normal operating frequency. The other controller is unaffected and maintains normal operation. The short-circuit threshold on VFB2 is based on the smaller of 0.12V and a fraction of the voltage on the TRACK pin. This also allows VOUT2 to start up and track VOUT1 more easily. Note that if V OUT1 is truly short-circuited (VOUT1 = VFB1 = 0V), then the LTC3736-2 will try to regulate VOUT2 to 0V if a resistor divider on VOUT1 is connected to the TRACK pin. Output Overvoltage Protection As a further protection, the overvoltage comparator (OV) guards against transient overshoots, as well as other more serious conditions that may overvoltage the output. When the feedback voltage on the VFB pin has risen 13.33% above the reference voltage of 0.6V, the external P-channel MOSFET is turned off and the N-channel MOSFET is turned on until the overvoltage is cleared. Frequency Selection and Phase-Locked Loop (PLLLPF and SYNC/FCB Pins) The selection of switching frequency is a tradeoff between efficiency and component size. Low frequency operation increases efficiency by reducing MOSFET switching losses,
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(Refer to Functional Diagram)
but requires larger inductance and/or capacitance to maintain low output ripple voltage. The switching frequency of the LTC3736-2's controllers can be selected using the PLLLPF pin. If the SYNC/FCB is not being driven by an external clock source, the PLLLPF can be floated, tied to VIN or tied to SGND to select 550kHz, 750kHz or 300kHz respectively. A phase-locked loop (PLL) is available on the LTC3736-2 to synchronize the internal oscillator to an external clock source that is connected to the SYNC/FCB pin. In this case, a series RC should be connected between the PLLLPF pin and SGND to serve as the PLL's loop filter. The LTC3736-2 phase detector adjusts the voltage on the PLLLPF pin to align the turn-on of controller 1's external P-channel MOSFET to the rising edge of the synchronizing signal. Thus, the turn-on of controller 2's external P-channel MOSFET is 180 degrees out of phase with the rising edge of the external clock source. The typical capture range of the LTC3736-2's phaselocked loop is from approximately 200kHz to 1MHz, and is guaranteed over temperature to be between 250kHz and 850kHz. In other words, the LTC3736-2's PLL is guaranteed to lock to an external clock source whose frequency is between 250kHz and 850kHz. Dropout Operation When the input supply voltage (VIN) decreases towards the output voltage, the rate of change of the inductor current while the external P-channel MOSFET is on (ON cycle) decreases. This reduction means that the P-channel MOSFET will remain on for more than one oscillator cycle if the inductor current has not ramped up to the threshold set by the EAMP on the ITH pin. Further reduction in the input supply voltage will eventually cause the P-channel MOSFET to be turned on 100%, i.e., DC. The output voltage will then be determined by the input voltage minus the voltage drop across the P-channel MOSFET and the inductor.
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Undervoltage Lockout To prevent operation of the external MOSFETs below safe input voltage levels, an undervoltage lockout is incorporated in the LTC3736-2. When the input supply voltage (VIN) drops below 2.3V, the external P- and N-channel MOSFETs and all internal circuitry are turned off except for the undervoltage block, which draws only a few microamperes. Peak Current Sense Voltage Selection and Slope Compensation (IPRG1 and IPRG2 Pins) When a controller is operating below 20% duty cycle, the peak current sense voltage (between the SENSE+ and SW pins) allowed across the external P-channel MOSFET is determined by:
A( VITH - 0.7 V ) VSENSE(MAX) = 10
SF = I/IMAX (%)
where A is a constant determined by the state of the IPRG pins. Floating the IPRG pin selects A = 1.875; tying IPRG to VIN selects A = 2.7; tying IPRG to SGND selects A = 1.3. The maximum value of VITH is typically about 1.98V, so the maximum sense voltage allowed across the external P-channel MOSFET is 240mV, 345mV, or 167mV for the three respective states of the IPRG pin. The peak sense voltages for the two controllers can be independently selected by the IPRG1 and IPRG2 pins. However, once the controller's duty cycle exceeds 20%, slope compensation begins and effectively reduces the peak sense voltage by a scale factor given by the curve in Figure 1. The peak inductor current is determined by the peak sense voltage and the on-resistance of the external P-channel MOSFET:
IPK VSENSE(MAX) = RDS(ON)
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(Refer to Functional Diagram)
110 100 90 80 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 DUTY CYCLE (%)
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Figure 1. Maximum Peak Current vs Duty Cycle
Power-Good (PGOOD) Pin A window comparator monitors both feedback voltages and the open-drain PGOOD output pin is pulled low when either or both feedback voltages are not within 10% of the 0.6V reference voltage. PGOOD is low when the LTC3736-2 is shut down or in undervoltage lockout. 2-Phase Operation Why the need for 2-phase operation? Until recently, constant frequency dual switching regulators operated both controllers in phase (i.e., single phase operation). This means that both topside MOSFETs (P-channel) are turned on at the same time, causing current pulses of up to twice the amplitude of those from a single regulator to be drawn from the input capacitor. These large amplitude pulses increase the total RMS current flowing in the input capacitor, requiring the use of larger and more expensive input capacitors, and increase both EMI and power losses in the input capacitor and input power supply. With 2-phase operation, the two controllers of the LTC3736-2 are operated 180 degrees out of phase. This effectively interleaves the current pulses coming from the topside MOSFET switches, greatly reducing the time where they overlap and add together. The result is a significant reduction in the total RMS current, which in turn allows the use of smaller, less expensive input capacitors, reduces shielding requirements for EMI and improves real world operating efficiency.
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Figure 2 shows example waveforms for a single phase dual controller versus a 2-phase LTC3736-2 system. In this case, 2.5V and 1.8V outputs, each drawing a load current of 2A, are derived from a 7V (e.g., a 2-cell Li-Ion battery) input supply. In this example, 2-phase operation would reduce the RMS input capacitor current from 1.79ARMS to 0.91ARMS. While this is an impressive reduction by itself, remember that power losses are proportional to IRMS2, meaning that actual power wasted is reduced by a factor of 3.86. The reduced input ripple current also means that less power is lost in the input power path, which could include batteries, switches, trace/connector resistances, and proSingle Phase Dual Controller
SW1 (V)
SW2 (V)
INPUT CAPACITOR RMS CURRENT
IL1
IL2
IIN
Figure 2. Example Waveforms for a Single Phase Dual Controller vs the 2-Phase LTC3736-2
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(Refer to Functional Diagram)
tection circuitry. Improvements in both conducted and radiated EMI also directly accrue as a result of the reduced RMS input current and voltage. Significant cost and board footprint savings are also realized by being able to use smaller, less expensive, lower RMS current-rated input capacitors. Of course, the improvement afforded by 2-phase operation is a function of the relative duty cycles of the two controllers, which in turn are dependent upon the input supply voltage. Figure 3 depicts how the RMS input current varies for single phase and 2-phase dual controllers with 2.5V and 1.8V outputs over a wide input voltage range. It can be readily seen that the advantages of 2-phase operation are not limited to a narrow operating range, but in fact extend over a wide region. A good rule of thumb for most applications is that 2-phase operation will reduce the input capacitor requirement to that for just one channel operating at maximum current and 50% duty cycle.
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 2 VOUT1 = 2.5V/2A VOUT2 = 1.8V/2A 3 4 8 6 5 7 INPUT VOLTAGE (V) 9 10 2-PHASE DUAL CONTROLER SINGLE PHASE DUAL CONTROLER
2-Phase Dual Controller
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Figure 3. RMS Input Current Comparison
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The typical LTC3736-2 application circuit is shown in Figure 13. External component selection for each of the LTC3736-2's controllers is driven by the load requirement and begins with the selection of the inductor (L) and the power MOSFETs (MP and MN). Power MOSFET Selection Each of the LTC3736-2's two controllers requires two external power MOSFETs: a P-channel MOSFET for the topside (main) switch and an N-channel MOSFET for the bottom (synchronous) switch. Important parameters for the power MOSFETs are the breakdown voltage VBR(DSS), threshold voltage VGS(TH), on-resistance RDS(ON), reverse transfer capacitance CRSS, turn-off delay tD(OFF) and the total gate charge QG. The gate drive voltage is the input supply voltage. Since the LTC3736-2 is designed for operation down to low input voltages, a sublogic level MOSFET (R DS(ON) guaranteed at VGS = 2.5V) is required for applications that work close to this voltage. When these MOSFETs are used, make sure that the input supply to the LTC3736-2 is less than the absolute maximum MOSFET VGS rating, which is typically 8V. The P-channel MOSFET's on-resistance is chosen based on the required load current. The maximum average output load current IOUT(MAX) is equal to the peak inductor current minus half the peak-to-peak ripple current IRIPPLE. The LTC3736-2's current comparator monitors the drainto-source voltage VDS of the P-channel MOSFET, which is sensed between the SENSE+ and SW pins. The peak inductor current is limited by the current threshold, set by the voltage on the ITH pin of the current comparator. The voltage on the ITH pin is internally clamped, which limits the maximum current sense threshold VSENSE(MAX) to approximately 240mV when IPRG is floating (167mV when IPRG is tied low; 345mV when IPRG is tied high). The output current that the LTC3736-2 can provide is given by:
VSENSE(MAX) IRIPPLE IOUT(MAX) = - RDS(ON) 2
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A reasonable starting point is setting ripple current IRIPPLE to be 40% of IOUT(MAX). Rearranging the above equation yields:
RDS(ON)(MAX) = 5 VSENSE(MAX) * 6 IOUT(MAX)
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for Duty Cycle < 20%. However, for operation above 20% duty cycle, slope compensation has to be taken into consideration to select the appropriate value of RDS(ON) to provide the required amount of load current:
RDS(ON)(MAX) =
VSENSE(MAX) 5 * SF * 6 IOUT(MAX)
where SF is a scale factor whose value is obtained from the curve in Figure 1. These must be further derated to take into account the significant variation in on-resistance with temperature. The following equation is a good guide for determining the required RDS(ON)MAX at 25C (manufacturer's specification), allowing some margin for variations in the LTC3736-2 and external component values:
RDS(ON)(MAX) =
VSENSE(MAX) 5 * 0.9 * SF * 6 IOUT(MAX) * T
The T is a normalizing term accounting for the temperature variation in on-resistance, which is typically about 0.4%/C, as shown in Figure 4. Junction to case temperature TJC is about 10C in most applications. For a maximum ambient temperature of 70C, using 80C ~ 1.3 in the above equation is a reasonable choice. The power dissipated in the top and bottom MOSFETs strongly depends on their respective duty cycles and load current. When the LTC3736-2 is operating in continuous mode, the duty cycles for the MOSFETs are:
VOUT VIN V -V Bottom N-Channel Duty Cycle = IN OUT VIN Top P-Channel Duty Cycle =
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2.0
T NORMALIZED ON RESISTANCE
1.5
1.0
0.5
0 - 50
50 100 0 JUNCTION TEMPERATURE (C)
150
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Figure 4. RDS(ON) vs Temperature
The MOSFET power dissipations at maximum output current are:
PTOP V = OUT * IOUT(MAX)2 * r T * RDS(ON) + 2 * VIN2 VIN * IOUT(MAX) * CRSS * fOSC VIN - VOUT * IOUT(MAX)2 * r T * RDS(ON) VIN
PBOT =
Both MOSFETs have I2R losses and the PTOP equation includes an additional term for transition losses, which are largest at high input voltages. The bottom MOSFET losses are greatest at high input voltage or during a short-circuit when the bottom duty cycle is nearly 100%. The LTC3736-2 utilizes a nonoverlapping, antishootthrough gate drive control scheme to ensure that the Pand N-channel MOSFETs are not turned on at the same time. To function properly, the control scheme requires that the MOSFETs used are intended for DC/DC switching applications. Many power MOSFETs, particularly P-channel MOSFETs, are intended to be used as static switches and therefore are slow to turn on or off. Reasonable starting criteria for selecting the P-channel MOSFET are that it must typically have a gate charge (QG) less than 25nC to 30nC (at 4.5VGS) and a turn-off delay
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(tD(OFF)) of less than approximately 140ns. However, due to differences in test and specification methods of various MOSFET manufacturers, and in the variations in QG and tD(OFF) with gate drive (VIN) voltage, the P-channel MOSFET ultimately should be evaluated in the actual LTC3736-2 application circuit to ensure proper operation. Shoot-through between the P-channel and N-channel MOSFETs can most easily be spotted by monitoring the input supply current. As the input supply voltage increases, if the input supply current increases dramatically, then the likely cause is shoot-through. Note that some MOSFETs that do not work well at high input voltages (e.g., VIN > 5V) may work fine at lower voltages (e.g., 3.3V). Table 1 shows a selection of P-channel MOSFETs from different manufacturers that are known to work well in LTC3736-2 applications. Selecting the N-channel MOSFET is typically easier, since for a given RDS(ON), the gate charge and turn-on and turnoff delays are much smaller than for a P-channel MOSFET.
Table 1. Selected P-Channel MOSFETs Suitable for LTC3736-2 Applications
PART NUMBER Si7540DP Si9801DY FDW2520C FDW2521C Si3447BDV Si9433BDY FDC602P FDC606P FDC638P FDW2502P FDS6875 HAT1054R NTMD6P02R2-D MANUFACTURER Siliconix Siliconix Fairchild Fairchild Siliconix Siliconix Fairchild Fairchild Fairchild Fairchild Fairchild Hitachi On Semi TYPE Complementary P/N Complementary P/N Complementary P/N Complementary P/N Single P Single P Single P Single P Single P Dual P Dual P Dual P Dual P PACKAGE PowerPak SO-8 SO-8 TSSOP-8 TSSOP-8 TSOP-6 SO-8 TSOP-6 TSOP-6 TSOP-6 TSSOP-8 SO-8 SO-8 SO-8
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Operating Frequency and Synchronization
The choice of operating frequency, fOSC, is a trade-off between efficiency and component size. Low frequency operation improves efficiency by reducing MOSFET switching losses, both gate charge loss and transition loss. However, lower frequency operation requires more inductance for a given amount of ripple current. The internal oscillator for each of the LTC3736-2's controllers runs at a nominal 550kHz frequency when the PLLLPF pin is left floating and the SYNC/FCB pin is a DC low or high. Pulling the PLLLPF to VIN selects 750kHz operation; pulling the PLLLPF to GND selects 300kHz operation. Alternatively, the LTC3736-2 will phase-lock to a clock signal applied to the SYNC/FCB pin with a frequency between 250kHz and 850kHz (see Phase-Locked Loop and Frequency Synchronization). Inductor Value Calculation Given the desired input and output voltages, the inductor value and operating frequency fOSC directly determine the inductor's peak-to-peak ripple current:
IRIPPLE = VOUT VIN - VOUT VIN fOSC * L
Lower ripple current reduces core losses in the inductor, ESR losses in the output capacitors, and output voltage ripple. Thus, highest efficiency operation is obtained at low frequency with a small ripple current. Achieving this, however, requires a large inductor. A reasonable starting point is to choose a ripple current that is about 40% of IOUT(MAX). Note that the largest ripple current occurs at the highest input voltage. To guarantee that ripple current does not exceed a specified maximum, the inductor should be chosen according to:
L
VIN - VOUT VOUT * fOSC * IRIPPLE VIN
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Inductor Core Selection Once the inductance value is determined, the type of inductor must be selected. Core loss is independent of core size for a fixed inductor value, but it is very dependent on inductance selected. As inductance increases, core losses go down. Unfortunately, increased inductance requires more turns of wire and therefore copper losses will increase. Ferrite designs have very low core loss and are preferred at high switching frequencies, so design goals can concentrate on copper loss and preventing saturation. Ferrite core material saturates "hard," which means that inductance collapses abruptly when the peak design current is exceeded. This results in an abrupt increase in inductor ripple current and consequent output voltage ripple. Do not allow the core to saturate! Schottky Diode Selection (Optional) The Schottky diodes D1 and D2 in Figure 16 conduct current during the dead time between the conduction of the power MOSFETs . This prevents the body diode of the bottom N-channel MOSFET from turning on and storing charge during the dead time, which could cost as much as 1% in efficiency. A 1A Schottky diode is generally a good size for most LTC3736-2 applications, since it conducts a relatively small average current. Larger diodes result in additional transition losses due to their larger junction capacitance. This diode may be omitted if the efficiency loss can be tolerated. CIN and COUT Selection The selection of CIN is simplified by the 2-phase architecture and its impact on the worst-case RMS current drawn through the input network (battery/fuse/capacitor). It can be shown that the worst-case capacitor RMS current occurs when only one controller is operating. The controller with the highest (VOUT)(IOUT) product needs to be used in the formula below to determine the maximum RMS
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capacitor current requirement. Increasing the output current drawn from the other controller will actually decrease the input RMS ripple current from its maximum value. The out-of-phase technique typically reduces the input capacitor's RMS ripple current by a factor of 30% to 70% when compared to a single phase power supply solution. In continuous mode, the source current of the P-channel MOSFET is a square wave of duty cycle (VOUT)/(VIN). To prevent large voltage transients, a low ESR capacitor sized for the maximum RMS current of one channel must be used. The maximum RMS capacitor current is given by: CIN Required IRMS IMAX VOUT VIN - VOUT VIN
[( )(
This formula has a maximum at VIN = 2VOUT, where IRMS = IOUT/2. This simple worst-case condition is commonly used for design because even significant deviations do not offer much relief. Note that capacitor manufacturers' ripple current ratings are often based on only 2000 hours of life. This makes it advisable to further derate the capacitor, or to choose a capacitor rated at a higher temperature than required. Several capacitors may be paralleled to meet size or height requirements in the design. Due to the high operating frequency of the LTC3736-2, ceramic capacitors can also be used for CIN. Always consult the manufacturer if there is any question. The benefit of the LTC3736-2 2-phase operation can be calculated by using the equation above for the higher power controller and then calculating the loss that would have resulted if both controller channels switched on at the same time. The total RMS power lost is lower when both controllers are operating due to the reduced overlap of current pulses required through the input capacitor's ESR. This is why the input capacitor's requirement calculated above for the worst-case controller is adequate for the dual controller design. Also, the input protection fuse resistance, battery resistance, and PC board trace resistance losses are also reduced due to the reduced peak currents
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in a 2-phase system. The overall benefit of a multiphase design will only be fully realized when the source impedance of the power supply/battery is included in the efficiency testing. The sources of the P-channel MOSFETs should be placed within 1cm of each other and share a common CIN(s). Separating the sources and CIN may produce undesirable voltage and current resonances at VIN. A small (0.1F to 1F) bypass capacitor between the chip VIN pin and ground, placed close to the LTC3736-2, is also suggested. A 10 resistor placed between CIN (C1) and the VIN pin provides further isolation between the two channels. The selection of COUT is driven by the effective series resistance (ESR). Typically, once the ESR requirement is satisfied, the capacitance is adequate for filtering. The output ripple (VOUT) is approximated by:
1 VOUT IRIPPLE ESR + 8 fCOUT
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)]
1/ 2
where f is the operating frequency, COUT is the output capacitance and IRIPPLE is the ripple current in the inductor. The output ripple is highest at maximum input voltage since IRIPPLE increases with input voltage. Setting Output Voltage The LTC3736-2 output voltages are each set by an external feedback resistor divider carefully placed across the output, as shown in Figure 5. The regulated output voltage is determined by:
R VOUT = 0.6 V * 1 + B RA
To improve the frequency response, a feedforward capacitor, CFF, may be used. Great care should be taken to route the VFB line away from noise sources, such as the inductor or the SW line.
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VOUT RB CFF 1/2 LTC3736-2 VFB RA
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Figure 5. Setting Output Voltage
Run/Soft-Start Function The RUN/SS pin is a dual purpose pin that provides the optional external soft-start function and a means to shut down the LTC3736-2. Pulling the RUN/SS pin below 0.65V puts the LTC3736-2 into a low quiescent current shutdown mode (IQ = 9A). If RUN/SS has been pulled all the way to ground, there will be a delay before the LTC3736-2 comes out of shutdown and is given by:
tDELAY = 0.65V *
CSS = 0.93 s / F * CSS 0.7A
This pin can be driven directly from logic as shown in Figure 6. Diode D1 in Figure 6 reduces the start delay but allows CSS to ramp up slowly providing the soft-start function. This diode (and capacitor) can be deleted if the external soft-start is not needed. During soft-start, the start-up of VOUT1 is controlled by slowly ramping the positive reference to the error amplifier from 0V to 0.6V, allowing VOUT1 to rise smoothly from 0V to its final value. The default internal soft-start time is 1ms.
3.3V OR 5V D1 CSS CSS RUN/SS RUN/SS
VDD VIN
RUN/SS (INTERNAL SOFT-START)
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Figure 6. RUN/SS Pin Interfacing
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This can be increased by placing a capacitor between the RUN/SS pin and SGND. In this case, the soft-start time will be approximately:
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tSS1 = CSS *
Tracking
600mV 0.7A
The start-up of VOUT2 is controlled by the voltage on the TRACK pin. Normally this pin is used to allow the start-up of VOUT2 to track that of VOUT1 as shown qualitatively in Figures 7a and 7b. When the voltage on the TRACK pin is less than the internal 0.6V reference, the LTC3736-2 regulates the VFB2 voltage to the TRACK pin voltage instead of 0.6V. The start-up of VOUT2 may ratiometrically track that of VOUT1, according to a ratio set by a resistor divider (Figure 7c):
VOUT1 R2A R + RTRACKB = * TRACKA VOUT2 RTRACKA R2B + R2A
For coincident tracking (VOUT1 = VOUT2 during start-up), R2A = RTRACKA R2B = RTRACKB The ramp time for VOUT2 to rise from 0V to its final value is:
tSS2 = tSS1 *
RTRACKA R1A + R1B * R1A RTRACKA + RTRACKB
VOUT1 VOUT2 LTC3736-2 VFB1 R1A VFB2 R2A R2B
R1B
RTRACKB TRACK
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RTRACKA
Figure 7a. Using the TRACK Pin
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APPLICATIO S I FOR ATIO
OUTPUT VOLTAGE
VOUT2
OUTPUT VOLTAGE
TIME
(7b) Coincident Tracking
Figures 7b and 7c. Two Different Modes of Output Voltage Tracking
For coincident tracking,
tSS2 = tSS1 *
VOUT2F VOUT1F
where VOUT1F and VOUT2F are the final, regulated values of VOUT1 and VOUT2. VOUT1 should always be greater than VOUT2 when using the TRACK pin. If no tracking function is desired, then the TRACK pin may be tied to VIN. However, in this situation there would be no (internal nor external) soft-start on VOUT2. Phase-Locked Loop and Frequency Synchronization The LTC3736-2 has a phase-locked loop (PLL) comprised of an internal voltage-controlled oscillator (VCO) and a phase detector. This allows the turn-on of the external Pchannel MOSFET of controller 1 to be locked to the rising edge of an external clock signal applied to the SYNC/FCB pin. The turn-on of controller 2's external P-channel MOSFET is thus 180 degrees out of phase with the external clock. The phase detector is an edge sensitive digital type that provides zero degrees phase shift between the external and internal oscillators. This type of phase detector does not exhibit false lock to harmonics of the external clock. The output of the phase detector is a pair of complementary current sources that charge or discharge the external filter network connected to the PLLLPF pin. The relationship between the voltage on the PLLLPF pin and operating
FREQUENCY (kHz)
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VOUT1 VOUT1 VOUT2 TIME
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(7c) Ratiometric Tracking
frequency, when there is a clock signal applied to SYNC/ FCB, is shown in Figure 8 and specified in the Electrical Characteristics table. Note that the LTC3736-2 can only be synchronized to an external clock whose frequency is within range of the LTC3736-2's internal VCO, which is nominally 200kHz to 1MHz. This is guaranteed, over temperature and variations, to be between 300kHz and 750kHz. A simplified block diagram is shown in Figure 9. If the external clock frequency is greater than the internal oscillator's frequency, fOSC, then current is sourced continuously from the phase detector output, pulling up the PLLLPF pin. When the external clock frequency is less than fOSC, current is sunk continuously, pulling down the
1400 1200 1000 800 600 400 200 0 0 0.5 1 1.5 2 PLLLPF PIN VOLTAGE (V) 2.4
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Figure 8. Relationship Between Oscillator Frequency and Voltage at the PLLLPF Pin When Synchronizing to an External Clock
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SYNC/ FCB EXTERNAL OSCILLATOR
DIGITAL PHASE/ FREQUENCY DETECTOR
Figure 9. Phase-Locked Loop Block Diagram
PLLLPF pin. If the external and internal frequencies are the same but exhibit a phase difference, the current sources turn on for an amount of time corresponding to the phase difference. The voltage on the PLLLPF pin is adjusted until the phase and frequency of the internal and external oscillators are identical. At the stable operating point, the phase detector output is high impedance and the filter capacitor CLP holds the voltage. The loop filter components, CLP and RLP, smooth out the current pulses from the phase detector and provide a stable input to the voltage-controlled oscillator. The filter components CLP and RLP determine how fast the loop acquires lock. Typically RLP = 10k and CLP is 2200pF to 0.01F. Typically, the external clock (on SYNC/FCB pin) input high level is 1.6V, while the input low level is 1.2V. Table 2 summarizes the different states in which the PLLLPF pin can be used.
Table 2
PLLLPF PIN 0V Floating VIN RC Loop Filter SYNC/FCB PIN DC Voltage DC Voltage DC Voltage Clock Signal FREQUENCY 300kHz 550kHz 750kHz Phase-Locked to External Clock
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2.4V RLP CLP PLLLPF OSCILLATOR
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Auxiliary Winding Control Using SYNC/FCB Pin The SYNC/FCB can be used as an auxiliary feedback to provide a means of regulating a flyback winding output. When this pin drops below its ground-referenced 0.6V threshold, continuous mode operation is forced. During continuous mode, current flows continuously in the transformer primary. The auxiliary winding draws current only when the bottom, synchronous N-channel MOSFET is on. When primary load currents are low and/or the VIN/VOUT ratio is close to unity, the synchronous MOSFET may not be on for a sufficient amount of time to transfer power from the output capacitor to the auxiliary load. Forced continuous operation will support an auxiliary winding as long as there is a sufficient synchronous MOSFET duty factor. The FCB input pin removes the requirement that power must be drawn from the transformer primary in order to extract power from the auxiliary winding. With the loop in continuous mode, the auxiliary output may nominally be loaded without regard to the primary output load. The auxiliary output voltage VAUX is normally set as shown in Figure 10 by the turns ratio N of the transformer: VAUX (N + 1) VOUT However, if the controller goes into pulse-skipping operation and halts switching due to a light primary load current, then VAUX will droop. An external resistor divider from VAUX to the FCB sets a minimum voltage VAUX(MIN):
R6 VAUX(MIN) = 0.6 V 1 + R5
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VIN LTC3736-2 R6 SYNC/FCB R5 SW BG TG L1 1:N
+
1F VOUT
+
COUT
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Figure 10. Auxiliary Output Loop Connection
NORMALIZED VOLTAGE OR CURRENT (%)
If VAUX drops below this value, the FCB voltage forces temporary continuous switching operation until VAUX is again above its minimum. Table 3 summarizes the different states in which the SYNC/FCB pin can be used
Table 3
SYNC/FCB PIN 0V to 0.5V 0.7V to VIN Feedback Resistors External Clock Signal CONDITION Forced Continuous Mode Current Reversal Allowed Pulse-Skipping Operation Enabled No Current Reversal Allowed Regulate an Auxiliary Winding Enable Phase-Locked Loop (Synchronize to External CLK) Pulse-Skipping at Light Loads No Current Reversal Allowed
Fault Condition: Short-Circuit and Current Limit To prevent excessive heating of the bottom MOSFET, foldback current limiting can be added to reduce the current in proportion to the severity of the fault. Foldback current limiting is implemented by adding diodes DFB1 and DFB2 between the output and the ITH pin as shown in Figure 11. In a hard short (VOUT = 0V), the current will be reduced to approximately 50% of the maximum output current. Low Supply Operation Although the LTC3736-2 can function down to below 2.4V, the maximum allowable output current is reduced as VIN decreases below 3V. Figure 12 shows the amount of change as the supply is reduced down to 2.4V. Also shown is the effect on VREF.
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VOUT
VAUX
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1/2 LTC3736-2 ITH VFB
R2 R1
+
DFB1 DFB2
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Figure 11. Foldback Current Limiting
105 100 95 90 85 80 75 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 INPUT VOLTAGE (V)
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VREF
MAXIMUM SENSE VOLTAGE
Figure 12. Line Regulation of VREF and Maximum Sense Voltage for Low Input Supply
Minimum On-Time Considerations Minimum on-time, tON(MIN), is the smallest amount of time that the LTC3736-2 is capable of turning the top P-channel MOSFET on and then off. It is determined by internal timing delays and the gate charge required to turn on the top MOSFET. Low duty cycle and high frequency applications may approach the minimum on-time limit and care should be taken to ensure that:
tON(MIN) < VOUT fOSC * VIN
If the duty cycle falls below what can be accommodated by the minimum on-time, the LTC3736-2 will begin to skip cycles (unless forced continuous mode is selected). The output voltage will continue to be regulated, but the ripple current and ripple voltage will increase. The minimum ontime for the LTC3736-2 is typically about 200ns. However, as the peak sense voltage (I L(PEAK) * RDS(ON)) decreases, the minimum on-time gradually increases up to about 250ns. This is of particular concern in forced continuous applications with low ripple current at light
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LTC3736-2
APPLICATIO S I FOR ATIO
loads. If forced continuous mode is selected and the duty cycle falls below the minimum on-time requirement, the output will be regulated by overvoltage protection. Efficiency Considerations The efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is limiting efficiency and which change would produce the most improvement. Efficiency can be expressed as: Efficiency = 100% - (L1 + L2 + L3 + ...) where L1, L2, etc. are the individual losses as a percentage of input power. Although all dissipative elements in the circuit produce losses, five main sources usually account for most of the losses in LTC3736-2 circuits: 1) LTC3736-2 DC bias current, 2) MOSFET gate charge current, 3) I2R losses, and 4) transition losses. 1) The VIN (pin) current is the DC supply current, given in the electrical characteristics, excluding MOSFET driver currents. VIN current results in a small loss that increases with VIN. 2) MOSFET gate charge current results from switching the gate capacitance of the power MOSFETs. Each time a MOSFET gate is switched from low to high to low again, a packet of charge dQ moves from SENSE+ to ground. The resulting dQ/dt is a current out of SENSE+, which is typically much larger than the DC supply current. In continuous mode, IGATECHG = f * QP. 3) I2R losses are calculated from the DC resistances of the MOSFETs and inductor. In continuous mode, the average output current flows through L but is "chopped" between the top P-channel MOSFET and the bottom N-channel MOSFET. The MOSFET RDS(ON)s multiplied by duty cycle can be summed with the resistance of L to obtain I2R losses.
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4) Transition losses apply to the top external P-channel MOSFET and increase with higher operating frequencies and input voltages. Transition losses can be estimated from: Transition Loss = 2 (VIN)2IO(MAX)CRSS(f) Other losses, including CIN and COUT ESR dissipative losses and inductor core losses, generally account for less than 2% total additional loss. Checking Transient Response The regulator loop response can be checked by looking at the load transient response. Switching regulators take several cycles to respond to a step in load current. When a load step occurs, VOUT immediately shifts by an amount equal to (ILOAD)(ESR), where ESR is the effective series resistance of COUT. ILOAD also begins to charge or discharge COUT, which generates a feedback error signal. The regulator loop then returns VOUT to its steady-state value. During this recovery time, VOUT can be monitored for overshoot or ringing. OPTI-LOOP(R) compensation allows the transient response to be optimized over a wide range of output capacitance and ESR values. The ITH series RC-CC filter (see Functional Diagram) sets the dominant pole-zero loop compensation. The ITH external components shown in the Typical Application on the front page of this data sheet will provide an adequate starting point for most applications. The values can be modified slightly (from 0.2 to 5 times their suggested values) to optimize transient response once the final PC layout is done and the particular output capacitor type and value have been determined. The output capacitors need to be decided upon because the various types and values determine the loop feedback factor gain and phase. An output current pulse of 20% to 100% of full load current having a rise time of 1s to 10s will produce output voltage and ITH pin waveforms that will give a sense of the overall loop stability. The gain of the loop will be increased by increasing RC, and the bandwidth of the loop will be
OPTI-LOOP is a registered trademark of Linear Technology Corporation.
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LTC3736-2
APPLICATIO S I FOR ATIO
LTC3736EGN-2 1 2 3 4 5 6 7 8 9 10 11 12 SW1 IPRG1 VFB1 ITH1 IPRG2 PLLLPF SGND VIN TRACK VFB2 ITH2 PGOOD 24 SENSE1+ PGND BG1 SYNC/FCB TG1 PGND TG2 RUN/SS BG2 PGND SENSE2+ SW2 23 22 21 20 19 18 17 16 15 14 13 CVIN2 MN2 CVIN MN1 CVIN1
COUT2 BOLD LINES INDICATE HIGH CURRENT PATHS
PC Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC3736-2. These items are illustrated in the layout diagram of Figure 13. Figure 14 depicts the current waveforms present in the various branches of the 2-phase dual regulator. 1) The power loop (input capacitor, MOSFETs, inductor, output capacitor) of each channel should be as small as possible and isolated as much as possible from the power loop of the other channel. Ideally, the drains of the P- and N-channel FETs should be connected close to one another with an input capacitor placed across the FET sources (from the P-channel source to the Nchannel source) right at the FETs. It is better to have two separate, smaller valued input capacitors (e.g., two 10F--one for each channel) than it is to have a single larger valued capacitor (e.g., 22F) that the channels share with a common connection. 2) The signal and power grounds should be kept separate. The signal ground consists of the feedback resistor dividers, ITH compensation networks and the SGND pin. The power grounds consist of the (-) terminal of the input and output capacitors and the source of the Nchannel MOSFET. Each channel should have its own
Figure 13. LTC3736-2 Layout Diagram
power ground for its power loop (as described above in item 1). The power grounds for the two channels should connect together at a common point. It is most important to keep the ground paths with high switching currents away from each other. The PGND pins on the LTC3736-2 IC should be shorted together and connected to the common power ground connection (away from the switching currents). 3) Put the feedback resistors close to the VFB pins. The trace connecting the top feedback resistor (RB) to the output capacitor should be a Kelvin trace. The ITH compensation components should also be very close to the LTC3736-2. 4) The current sense traces (SENSE+ and SW) should be Kelvin connections right at the P-channel MOSFET source and drain. 5) Keep the switch nodes (SW1, SW2) and the gate driver nodes (TG1, TG2, BG1, BG2) away from the smallsignal components, especially the opposite channel's feedback resistors, ITH compensation components, and the current sense pins (SENSE+ and SW).
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A second, more severe transient is caused by switching in loads with large (>1F) supply bypass capacitors. The discharged bypass capacitors are effectively put in parallel with COUT, causing a rapid drop in VOUT. No regulator can deliver enough current to prevent this problem if the load switch resistance is low and it is driven quickly. The only solution is to limit the rise time of the switch drive so that the load rise time is limited to approximately (25)(CLOAD). Thus a 10F capacitor would require a 250s rise time, limiting the charging current to about 200mA.
+
L1 L2
increased by decreasing CC. The output voltage settling behavior is related to the stability of the closed-loop system and will demonstrate the actual overall supply performance. For a detailed explanation of optimizing the compensation components, including a review of control loop theory, refer to Application Note 76.
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COUT1 VOUT1 MP1 VIN MP2 VOUT2
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LTC3736-2
APPLICATIO S I FOR ATIO
VIN RIN CIN
+
BOLD LINES INDICATE HIGH, SWITCHING CURRENT LINES. KEEP LINES TO A MINIMUM LENGTH
Figure 14. Branch Current Waveforms
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MP1 L1 VOUT1 MN1 COUT1
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+
RL1
MP2
L2
VOUT2
MN2
COUT2
+
RL2
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LTC3736-2
TYPICAL APPLICATIO S
RFB1A 59k RFB1B 187k L1 1.5H CITH1A 100pF
VIN 5V CIN 10F x2
RITH1 CITH1 15k 220pF RVIN 10
MP2
RITH2 15k CSS 10nF CITH2B 100pF RFB2A 59k
L2 1.5H
25
RTRACKA 59k
RFB2B RTRACKB 118k 118k
Figure 15. 2-Phase, 550kHz, Dual Output Synchronous DC/DC Converter
RFB1A 59k
RFB1B 187k CFF1 22pF 22 23 24 1 2 3 4 SENSE1+ SW1 PGND IPRG1 BG1 VFB1 SYNC/FCB ITH1 TG1 IPRG2 PGND PLLLPF SGND TG2 LTC3736EUF-2 5 14 VIN RUN/SS 13 BG2 9 12 PGND PGOOD 7 11 SENSE2+ VFB2 8 ITH2 10 6 TRACK SW2 PGND 25 21 20 19 18 17 16 15 L1 1.5H D1 COUT1 47F x2
CITH1A 100pF
MP1 Si3447BDV MN1 Si3460DV
VIN 3.3V CIN 22F
RITH1 CITH1 22k 1000pF RVIN 10
CITH2 CVIN 1000pF 1F RITH2 22k CSS 10nF CITH2A 100pF RFB2A 59k
MN2 Si3460DV MP2 Si3447BDV
D2
L2 1.5H
RTRACKA 59k
RFB2B RTRACKB 118k 118k L1, L2: VISHAY IHLP-2525CZ-01 D1, D2: OPTIONAL
Figure 16. 2-Phase, 750kHz, Dual Output Synchronous DC/DC Converter
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CITH2 CVIN 220pF 1F
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22 23 24 1 2 3 4
SW1 SENSE1+ PGND IPRG1 BG1 VFB1 SYNC/FCB ITH1 TG1 IPRG2 PGND PLLLPF SGND TG2 LTC3736EUF-2 5 VIN RUN/SS
21 20 19 18 17 16 15 14
MP1 MN1 Si7540DP
VOUT1 2.5V 6A
+
COUT1 150F
13 BG2 9 12 PGND PGOOD 7 + 11 SENSE2 V 8 FB2 ITH2 10 6 SW2 TRACK PGND
MN2 Si7540DP
COUT2 150F V OUT2 1.8V 6A
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VOUT1 2.5V 4A
COUT2 47F x2 VOUT2 1.8V 4A
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LTC3736-2
TYPICAL APPLICATIO S
CFF1 100pF RFB1A 59k CITH1 1nF RFB1B 187k
CLP 10nF VIN 3.3V CIN 22F CVIN 1F CITH2 1nF
RVIN 10
RFB2A 59k
Figure 17. 2-Phase, Synchronizable, Dual Output Synchronous DC/DC Converter
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CLK IN L1 1.5H VOUT1 2.5V 5A COUT1 100F
RITH1 22k
RLP 15k
1 2 3 4 5 6 7
SW1 IPRG1 PGND BG1 VFB1 SYNC/FCB ITH1 TG1 IPRG2 PGND PLLLPF TG2 SGND LTC3736EGN-2 5 VIN RUN/SS
24 SENSE1+ 23 22 21 20 19 18 17
MP1
SW1 MN1 Si7540DP
RITH2 22k RTRACKA 59k
16 BG2 12 15 PGND PGOOD 10 14 SENSE2+ VFB2 11 ITH2 13 9 TRACK SW2 RFB2B RTRACKB 118k 118k
MN2 Si7540DP MP2 SW2 L2 1.5H
COUT2 100F V OUT2 1.8V 5A
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L1, L2: VISHAY IHLP-2525CZ-01 CFF1 100pF
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LTC3736-2
PACKAGE DESCRIPTIO
7.8 - 8.2
0.42 0.03 RECOMMENDED SOLDER PAD LAYOUT
5.00 - 5.60** (.197 - .221)
0.09 - 0.25 (.0035 - .010)
0.55 - 0.95 (.022 - .037)
NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS MILLIMETERS 2. DIMENSIONS ARE IN (INCHES) 3. DRAWING NOT TO SCALE
4.50 0.05 2.45 0.05 (4 SIDES) 3.10 0.05
0.25 0.05 0.50 BSC NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)--TO BE APPROVED 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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GN Package 24-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
1.25 0.12 7.90 - 8.50* (.311 - .335) 24 23 22 21 20 19 18 17 16 15 14 13 5.3 - 5.7 7.40 - 8.20 (.291 - .323) 0.65 BSC 1 2 3 4 5 6 7 8 9 10 11 12 2.0 (.079) MAX
0 - 8
0.65 (.0256) BSC
0.22 - 0.38 (.009 - .015) TYP
0.05 (.002) MIN
G24 SSOP 0204
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED .152mm (.006") PER SIDE **DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
UF Package 24-Lead Plastic QFN (4mm x 4mm)
(Reference LTC DWG # 05-08-1697)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 4.00 0.10 (4 SIDES) 0.70 0.05 PIN 1 TOP MARK (NOTE 5) 0.75 0.05
R = 0.115 TYP
BOTTOM VIEW--EXPOSED PAD 0.23 TYP (4 SIDES) 23 24 0.38 0.10 1 2
2.45 0.10 (4-SIDES)
PACKAGE OUTLINE 0.200 REF 0.00 - 0.05 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6. DRAWING NOT TO SCALE
(UF24) QFN 0603
0.25 0.05 0.50 BSC
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LTC3736-2
TYPICAL APPLICATIO
2-Phase, 750kHz, Dual Output Synchronous DC/DC Converter
RFB1A 59k RFB1B 187k CFF1 22pF 22 23 24 1 2 3 4 SENSE1+ SW1 PGND IPRG1 BG1 VFB1 SYNC/FCB ITH1 TG1 IPRG2 PGND PLLLPF SGND TG2 LTC3736EUF-2 5 VIN RUN/SS 21 20 19 18 17 16 15 14 MN2 Si3460DV MP2 Si3447BDV D2 COUT2 47F x2 VOUT2 1.8V 4A L1 1.5H D1 COUT1 47F x2
CITH1A 100pF
VIN 3.3V CIN 22F
RITH1 CITH1 22k 1000pF RVIN 10
CITH2 CVIN 1000pF 1F RITH2 22k CSS 10nF CITH2A 100pF RFB2A 59k
RELATED PARTS
PART NUMBER LTC1735 LTC1778 LTC2923 LTC3411 LTC3416 LTC3418 LTC3701 LTC3708 LTC3728/LTC3728L DESCRIPTION High Efficiency Synchronous Step-Down Controller No RSENSETM Synchronous Step-Down Controller Power Supply Tracking Controller 1.25A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 4A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter with Output Tracking 8A, 4MHz Synchronous Step-Down Regulator 2-Phase, Low Input Voltage Dual Step-Down DC/DC Controller Fast 2-Phase, No RSENSE Buck Controller with Output Tracking COMMENTS Burst Mode Operation, 16-Pin Narrow SSOP, 3.5V VIN 36V Current Mode Operation Without Sense Resistor, Fast Transient Response, 4V VIN 36V Controls Up to Three Supplies, 10-Lead MSOP 95% Efficiency, VIN: 2.5V to 5.5V, IQ = 60A, ISD = <1A, MS Package 95% Efficiency, VIN: 2.25V to 5.5V, ISD = <1A, TSSOP-20E Package VIN: 2.25V to 5.5V, 5mm x 7mm QFN Package 2.5V VIN 9.8V, 550kHz, PGOOD, PLL, 16-Lead SSOP Constant On-Time Dual Controller, VIN Up to 36V, Very Low Duty Cycle Operation, 5mm x 5mm QFN Package Constant Frequency, VIN to 36V, 5V and 3.3V LDOs, 5mm x 5mm QFN or 28-Lead SSOP 2.75V VIN 9.8V, Output Tracking VIN: 2.75V to 9.8V, 4mm x 4mm QFN Package Spread Spectrum Operation; Output Tracking Non-Synchronous Constant Frequency with PLL, 4mm x 4mm QFN and 24-Lead SSOP Packages 2.75V VIN 9.8V, SOT-23 or 3mm x 2mm DFN Packages Provides VDDQ and VTT with One IC, 2.75V VIN 9.8V, 4mm x 4mm QFN and 24-Lead SSOP Packages 2.75V VIN 9.8V; Spread Spectrum Operation; 3mm x 4mm DFN and 16-Lead SSOP Packages 2.75V to 9.8V, 3mm x 3mm DFN and 10-Lead MSOPE Packages
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Dual, 550kHz, 2-Phase Synchronous Step-Down Switching Regulator LTC3736 Dual, 2-Phase, No RSENSE Synchronous Controller LTC3736-1 Dual, 2-Phase, No RSENSE Synchronous Controller with Spread Spectrum LTC3737 Dual, 2-Phase, No RSENSE Controller with Output Tracking LTC3772 No RSENSE Step-Down DC/DC Controller LTC3776 Dual, 2-Phase, No RSENSE Synchronous Controller for DDR/QDR Memory Termination LTC3808 No RSENSE, Low EMI, Synchronous Step-Down Controller with Output Tracking LTC3809/LTC3809-1 No RSENSE Synchronous Step-Down Controllers No RSENSE is a trademark of Linear Technology Corporation.
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Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
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MP1 Si3447BDV MN1 Si3460DV VOUT1 2.5V 4A 13 BG2 9 12 PGND PGOOD 7 11 SENSE2+ VFB2 8 ITH2 10 6 TRACK SW2 PGND 25 L2 1.5H RTRACKA 59k RFB2B RTRACKB 118k 118k L1, L2: VISHAY IHLP-2525CZ-01 D1, D2: OPTIONAL
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LT 0206 REV A * PRINTED IN USA
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2005

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