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 HD74LV166A
Parallel-Load 8-bit Shift Register
REJ03D0321-0300Z (Previous ADE-205-268A (Z)) Rev.3.00 Jun. 04, 2004
Description
The HD74LV166A is 8-bit shift register with an output from the last stage. Data may be loaded into the register either in parallel or in serial form. When the Shift/Load input is low, the data is loaded asynchronously in parallel. When the Shift/Load input is high, the data is loaded serially on the rising edge of either clock inhibit or Clock. Clear is asynchronous and active-low. The 2-input NOR clock may be used either by combining two independent clock sources or by designating one of the clock inputs to act as a clock inhibit. Low-voltage and high-speed operation is suitable for the battery-powered products (e.g., notebook computers), and the low-power consumption extends the battery life.
Features
* * * * * * * VCC = 2.0 V to 5.5 V operation All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VO (Max.) = 5.5 V (@VCC = 0 V) Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25C) Typical VOH undershoot > 2.3 V (@VCC = 3.3 V, Ta = 25C) Output current 6 mA (@VCC = 3.0 V to 3.6 V), 12 mA (@VCC = 4.5 V to 5.5 V) Ordering Information
Package Type SOP-16 pin(JEITA) SOP-16 pin(JEDEC) TSSOP-16 pin Package Code FP-16DAV FP-16DNV TTP-16DAV Package Abbreviation FP RP T Taping Abbreviation (Quantity) EL (2,000 pcs/reel) EL (2,500 pcs/reel) ELL (2,000 pcs/reel)
Part Name HD74LV166AFPEL HD74LV166ARPEL HD74LV166ATELL
Note: Please consult the sales office for the above package availability.
Rev.3.00 Jun. 04, 2004 page 1 of 9
HD74LV166A
Function Table
Inputs CLR L H H H H H SH/LD X X L H H X CLK INH X L L L L H CLK X L SER X X X H L X A ... H X X a ... h X X X Internal outputs QA L QA0 a H L QA0 QB L QB0 b QAn QAn QB0 Output QH L QH0 h QGn QGn QH0
Note: H: High level L: Low level : Low to high transition X: Immaterial a ... h: Parallel data Outputs remain unchanged. QA0 ... QH0: Data shifted from the previous stage on a positive edge at the clock input. QAn ... QGn:
Pin Arrangement
SER 1 A2 B3 C4 D5 CLK INH 6 CLK 7 GND 8
16 VCC 15 SH/LD 14 H 13 QH 12 G 11 F 10 E 9 CLR
(Top view)
Rev.3.00 Jun. 04, 2004 page 2 of 9
HD74LV166A
Absolute Maximum Ratings
Item Supply voltage range Input voltage range*1 Output voltage range*1, 2 Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation at Ta = 25C (in still air)*3 Storage temperature Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg Ratings -0.5 to 7.0 -0.5 to 7.0 -0.5 to VCC + 0.5 -0.5 to 7.0 -20 50 25 50 785 500 -65 to 150 Unit V V V mA mA mA mA mW C Conditions
Output: H or L VCC: OFF VI < 0 VO < 0 or VO > VCC VO = 0 to VCC
SOP TSSOP
Notes: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150C.
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Output current Symbol VCC VI VO IOH Min 2.0 0 0 -- -- -- -- -- -- -- -- 0 0 0 -40 Max 5.5 5.5 VCC -50 -2 -6 -12 50 2 6 12 200 100 20 85 Unit V V V A mA Conditions
IOL
A mA
Input transition rise or fall rate
t /v
ns/V
H or L VCC = 2.0 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V VCC = 2.0 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V
Operating free-air temperature
Ta
C
Note: Unused or floating inputs must be held high or low.
Rev.3.00 Jun. 04, 2004 page 3 of 9
HD74LV166A
Logic Diagram
A SER B C D E F G CLR H SH/LD CLK CLK INH
R CP S CD Q
R CP S Q CD
QH
Timing Diagram
CLK CLK INH CLR SER SH/LD
A B C D E F G H H L H L H L H H H H L H L H L H L
Parallel Inputs
Output QH
Serial shift Clear Load Inhibit
Serial shift
Rev.3.00 Jun. 04, 2004 page 4 of 9
HD74LV166A
DC Electrical Characteristics
Ta = -40 to 85C Item Input voltage Symbol VIH VCC (V)* 2.0 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 2.0 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 Min to Max 2.3 3.0 4.5 Min to Max 2.3 3.0 4.5 0 to 5.5 5.5 0 3.3 Min 1.5 VCC x 0.7 VCC x 0.7 VCC x 0.7 -- -- -- -- VCC - 0.1 2.0 2.48 3.8 -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 1.7 Max -- -- -- -- 0.5 VCC x 0.3 VCC x 0.3 VCC x 0.3 -- -- -- -- 0.1 0.4 0.44 0.55 1 20 5 -- Unit V Test Conditions
VIL
Output voltage
VOH
V
VOL
Input current Quiescent supply current Output leakage current Input capacitance
IIN ICC IOFF CIN
A A A pF
IOL = -50 A IOL = -2 mA IOL = -6 mA IOL = -12 mA IOL = 50 A IOL = 2 mA IOL = 6 mA IOL = 12 mA VI = 5.5 V or GND VI = VCC or GND, IO = 0 VI or VO = 0 V to 5.5 V VI = VCC or GND
Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions.
Rev.3.00 Jun. 04, 2004 page 5 of 9
HD74LV166A
Switching Characteristics
VCC = 2.5 0.2 V Ta = 25C Item Maximum clock frequency Propagation delay time Symbol fmax tPLH/tPHL tPHL Setup time tsu Min 50 40 -- -- -- -- 6.0 7.0 6.5 7.0 8.5 -0.5 -0.5 -0.5 8.0 8.5 Typ 80 65 12.2 15.3 10.8 14.2 -- -- -- -- -- -- -- -- -- -- Max -- -- 19.8 23.3 16.0 19.5 -- -- -- -- -- -- -- -- -- -- Ta = -40 to 85C Min 45 35 1.0 1.0 1.0 1.0 7.0 7.0 8.5 8.5 9.5 0.0 0.0 0.0 9.0 9.0 Max -- -- 22.0 26.0 18.0 22.0 -- -- -- -- -- -- -- -- -- -- Unit MHz ns Test Conditions CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CLK CLR CLR inactive before CLK CLK INH before CLK Data before CLK SH/LD high before CLK SER before CLK PAR data after SH/LD SER data after CLK SH/LD high after CLK CLR low CLK H or L VCC = 3.3 0.3 V Ta = 25C Item Maximum clock frequency Propagation delay time Symbol fmax tPLH/tPHL tPHL Setup time tsu Min 65 60 -- -- -- -- 4.0 5.0 5.0 5.0 5.0 0.0 0.0 0.0 6.0 6.0 Typ 115 90 8.6 10.9 7.9 10.4 -- -- -- -- -- -- -- -- -- -- Max -- -- 15.4 18.9 12.5 16.3 -- -- -- -- -- -- -- -- -- -- Ta = -40 to 85C Min 55 50 1.0 1.0 1.0 1.0 4.0 5.0 6.0 6.0 6.0 0.0 0.0 0.0 7.0 7.0 Max -- -- 18.0 21.5 15.0 18.5 -- -- -- -- -- -- -- -- -- -- Unit MHz ns Test Conditions CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CLK CLR CLR inactive before CLK CLK INH before CLK Data before CLK SH/LD high before CLK SER before CLK PAR data after SH/LD SER data after CLK SH/LD high after CLK CLR low CLK H or L QH FROM (Input) TO (Output) QH FROM (Input) TO (Output)
ns
Hold time
th
ns
Pulse width
tw
ns
ns
Hold time
th
ns
Pulse width
tw
ns
Rev.3.00 Jun. 04, 2004 page 6 of 9
HD74LV166A
Switching Characteristics (cont)
VCC = 5.0 0.5 V Ta = 25C Item Maximum clock frequency Propagation delay time Symbol fmax tPLH/tPHL tPHL Setup time tsu Min 110 95 -- -- -- -- 3.5 3.5 4.5 4.0 4.0 1.0 1.0 1.0 5.0 4.0 Typ 165 125 6.0 7.7 5.4 6.9 -- -- -- -- -- -- -- -- -- -- Max -- -- 9.9 11.9 8.6 10.6 -- -- -- -- -- -- -- -- -- -- Ta = -40 to 85C Min 90 85 1.0 1.0 1.0 1.0 3.5 3.5 4.5 4.0 4.0 1.0 1.0 1.0 5.0 4.0 Max -- -- 11.5 13.5 10.0 12.0 -- -- -- -- -- -- -- -- -- -- Unit MHz ns Test Conditions CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CLK CLR CLR inactive before CLK CLK INH before CLK Data before CLK SH/LD high before CLK SER before CLK PAR data after SH/LD SER data after CLK SH/LD high after CLK CLR low CLK H or L QH FROM (Input) TO (Output)
ns
Hold time
th
ns
Pulse width
tw
ns
Operating Characteristics
CL = 50 pF Ta = 25C Item Power dissipation capacitance Symbol CPD VCC (V) 3.3 5.0 Min -- -- Typ 36.1 37.5 Max -- -- Unit pF Test Conditions f = 10 MHz
Test Circuit
Measurement point
CL*
Note: C L includes the probe and jig capacitance.
Rev.3.00 Jun. 04, 2004 page 7 of 9
HD74LV166A
Waveforms
tW VCC CLR
50%VCC 50%VCC
tn tsu CLK
50%VCC 50%VCC
tn+1
tn
tn+1
0V VCC
50%VCC
50%VCC
tW tsu Data
50%VCC
0V th
50%VCC 50%VCC
tsu
th VCC
50%VCC
0V tPHL Output QH
50%VCC
tPHL
50%VCC
tPHL VOH
50%VCC
VOL
Notes: 1. Input waveform: PRR 1 MHz, Zo = 50 , t r 3 ns, t f 3 ns 2. The output are measured one at a time with one transition per measurement.
Package Dimensions
As of January, 2003
10.06 10.5 Max 16 9
Unit: mm
1
*0.20 0.05
8
0.80 Max
5.5
0.20 7.80 + 0.30 -
2.20 Max
1.15
1.27
0.10 0.10
0 - 8
0.70 0.20
*0.40 0.06
0.15
0.12 M
Package Code JEDEC JEITA Mass (reference value) FP-16DAV -- Conforms 0.24 g
*Ni/Pd/Au plating
Rev.3.00 Jun. 04, 2004 page 8 of 9
HD74LV166A
As of January, 2003
Unit: mm
9.9 10.3 Max 16 9
1 1.27 0.635 Max
8
0.11 0.14 + 0.04 - 1.75 Max
3.95
*0.20 0.05
6.10 - 0.30
1.08
+ 0.10
0 - 8
+ 0.67 0.60 - 0.20
*0.40 0.06
0.15 0.25 M
*Ni/Pd/Au plating
Package Code JEDEC JEITA Mass (reference value)
FP-16DNV Conforms Conforms 0.15 g
As of January, 2003
Unit: mm
5.00 5.30 Max 16 9
1
*0.20 0.05
8 0.65 0.13 M 0.65 Max 6.40 0.20 0 - 8 0.50 0.10 1.0
4.40
*0.15 0.05
1.10 Max
0.10
0.07 +0.03 -0.04
*Ni/Pd/Au plating
Package Code JEDEC JEITA Mass (reference value)
TTP-16DAV -- -- 0.05 g
Rev.3.00 Jun. 04, 2004 page 9 of 9
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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