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| PDD-2C-3.0G POWER DIVIDER PRELIMINARY REV: 003, 05/10/06 TECHNICAL DESCRIPTION FEATURES * 2000 - 4000 MHz * LOW LOSS * HIGH ISOLATION * EXCELLENT PHASE/AMPLITUDE BALANCE * SURFACE MOUNT * TAPE & REEL AVAILABLE APPLICATIONS * I&Q NETWORKS * POWER AMPLIFIERS * SIGNAL DISTRIBUTION The Multi-Mix(R) PDD series provides a 3 dB 0 in-phase power divider with low insertion loss, low VSWR, and high isolation. Accurate phase and amplitude balance make this series ideal for use in IQ networks, power amplifiers, radio transceivers, receiver multicouplers and RF signal distribution and processing equipment. PDD power dividers are fusion bonded multilayer stripline devices. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques. GENERAL SPECIFICATIONS FREQUENCY RANGE MHz INSERTION LOSS (dB MAX) 0.30 INPUT POWER (CW @ 1.2:1 LOAD VSWR) 1W AMPLITUDE BALANCE (dB MAX) 0.10 PHASE BALANCE 2000 - 4000 2 ISOLATION (dB MIN) VSWR (MAX) RF INTERFACE OPERATING TEMPERATURE 20 1.2:1 Surface Mount -55 - +95 C PACKAGE OUTLINE 1.000 [25.40] PORT 2 PORT 1 PDD-2C-3G 1.000 [25.40] .050 TYP [1.27] PORT 3 .015 TYP [.38] .030 TYP [.76] .066 [1.68] THE MULTI-MIX MICROTECHNOLOGY(R) GROUP IS ISO 9001:2000 REGISTERED U.S. Patent 6,099,677 and other Patents Pending. Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006 Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: crm@merrimacind.com / www.merrimacind.com MOUNTING CONFIGURATION PDD-2C-3.0G VSWR Port 1 2 1.8 1.6 1.4 1.2 1 1000 Insertion Loss Port 3 Port 4 1 0.75 Insertion Loss (dB) 0.5 0.25 0 -0.25 -0.5 -0.75 -1 1000 Port 2 VSWR 1500 2000 2500 3000 3500 4000 4500 1500 2000 2500 3000 3500 4000 4500 Frequency (MHz) Frequency (MHz) Transmission Loss In-Out1 -2 -2.2 Phase (degrees) -2.4 Coupling (dB) -2.6 -2.8 -3 -3.2 -3.4 -3.6 -3.8 -4 1000 1500 2000 2500 3000 Frequency (MHz) 3500 4000 4500 Phase Balance 5 4 3 2 1 0 -1 -2 -3 -4 -5 1000 1500 2000 2500 3000 3500 4000 4500 In-Out2 Frequency (MHz) MOUNTING CONFIGURATION GROUND PLANE OF UNIT SHOULD BE SOLDERED TO GROUND PLANE OF CIRCUIT BOARD FOR OPTIMUM PERFORMANCE GROUND PLANE .050 [1.27] .015 TYP [.38] GROUND VIAS PLATED THRU .500 [12.71] .015 [.38] .053 [1.36] .030 [.76] 50 OHM LINE .032 DIELECTRIC THICKNESS ER=3.38 .940 [23.88] .997 [25.32] .028 [.72] TRUTH TABLE 1 1 2 3 Input Out Out 2 Out Input Isolated 3 Out Isolated Input Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006 Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: crm@merrimacind.com / www.merrimacind.com |
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