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42-DL312
Version : A.06 Issue Date : 2004-04-19 File Name : 42-DL312-A.06.doc Total Pages : 6
Optical Fiber Receiving IC
SILICON TOUCH TECHNOLOGY INC.
9-4F-3, Prosperity Road I, Hsin-Chu, Taiwan, R.O.C. Fax886-3-5645626 Tel886-3-5645656
SILICON TOUCH TECHNOLOGY INC.
42-DL312
42-DL312 OPTICAL FIBER RECEIVING IC
GENERAL DESCRIPTION 42-DL312 receiver is designed for the application of high-speed optical fiber transmission. As an OEIC, 42-DL312 integrates photo sensor, ATC (Automatic Threshold Control) and signal processing circuit for high-speed application, and is fabricated by using CMOS technology. 42-DL312 is designed to operate by positive logic in which the output voltage is set to high level when optical flux is received.
FEATURES 1. Low jitter (tj: TYP. 1ns) 2. High speed (Up to 13.2Mb/s, NRZ signal) 3. Built-in photo sensor and signal processing circuit. 4. Built-in ATC (Automatic Threshold Control) circuit used for stabilized output at a wide range of optical power level
BLOCK DIAGRAM And APPLICATION CIRCUIT
VDD
VDD
42-DL312
AVDD
DVDD
AMP
COMP ATC
OUT
AVSS
DVSS
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ABSOLUTE MAXIMUM RATINGS (Ta=25)
Item Supply Voltage Power dissipation Operating Temperature Storage Temperature High Level Output Current Low Level Output Current Symbol VDD P Topr Tstg IOH IOL Rating -0.5 to +7 100 -40 to +85 -55 to +100 -1 20 Unit V mW mA mA
RECOMMENDED OPERATING CONDITIONS
ITEM Supply Voltage High Level Output Current Low Level Output Current SYMBOL VDD IOH IOL MIN. 4.75 TYP. 5.0 MAX. 5.25 -150 1.6 UNIT V uA mA
ELECTRICAL CHARACTERISTICS (VDD=5.0V, TA=25 )
ITEM Peak sensitivity wavelength Maximum Input Optical Power for High level Minimum Input Optical Power for High level Current Consumption High Level Output Voltage Low Level Output Voltage Rise Time Fall Time Pulse Width Distortion (note.1) Jitter Data Rate SYMBOL P PCMAX PCMIN IDD VOH VOL Tr Tf tw CONDITIONS Input optical wavelength=650nm Input optical wavelength=650nm VDD = 5V IOH = -0.15mA VDD= 5V IOL = -1.6mA CL=10pF CL=10pF Pulse width=165ns Pulse cycle=330ns, CL=10pF PC=-15dBm PC=-24dBm NRZ Code, Duty 50% Input MIN. TYP. MAX. UNIT -17.5 2.4 0 -17 0.1 700 5 4.5 4.5 1 -24 10 VDD 0.4 6 6 17 10 10 13.2 nm dBm dBm mA V V ns ns ns ns ns Mb/s
tj FDATA
Note.1 Between input of an optical fiber transmitting module and output of 42-DL312.
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PAD DESCRIPTIONS Pad Name VDD_A VDD_D VSS_A VSS_D OUT Size Center Coordinates (unit: um) 100um*100um ( 60, 728.15 ) 100um*100um ( 60, 60 ) 100um*100um ( 634.7, 72.4 ) 100um*100um ( 509.7, 72.4 ) 100um*100um ( 910.5, 72.4 ) I/O Power Power Ground Ground Output Description Analog Power Supply Digital Power Supply Analog Power Ground Digital Power Ground Signal Output
DIE CONFIGURATION (970.5, 790.5)
VDD_A
Photo Sensor
(648.2, 468,15)
42-DL312
VDD_D
VSS_D
VSS_A
OUT
(0, 0) Die Size: 970.5um*790.5um PD Size: 250000umx1
Unitum
The Center Coordinates of PD: (648.2um, 468.15um) * Note: SiTI reserves the right to alter the device geometry and manufacturing processes without prior notice. Though these alterations may result in geometrical changes, they will not affect die electrical characteristics and pad layouts in any sense.
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REQUIREMENTS FOR WAFER DELIVERY Material Silicon with P-Substrate Diameter 6 inches(15cm) Thickness 12 mils(300um) Scribe Line Width 110um Malfunctioned dieMarked with red ink or equivalent marking
HANDLING RECOMMENDATION FOR STATIC ELECTRICITY PROTECTION (1) Avoid any circumstance that produce static electricity, e.g. rubbing against plastic, during moving, storing and processing 42-DL312. (2) Process 42-DL312 in a clean room with proper temperature and humidity. (3) Ground all working machines and workers wear anti-electrostatic ring to ground during processing. (4) Avoid contact 42-DL312with bare hands .If unavoided, wear anti-electrostatic ring and use anti-electrostatic tool to pick it up.
GUARANTED TEMPERATURE AND RETENTION CYCLE (1) The device/wafer 42-DL312 should be stored in the nitrogenous chest. The conditions suggested are as follows: Temperature = 233 Relative Humidity = 5010% Minimum nitrogen inflow = 3 liters/minute (2) If the device/wafer, 42-DL312 is incidentally exposed to the air, use it for manufacturing as soon as possible. (3) Under the storage environment specified in item (1), six-month safe storage period is guaranteed.
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The products listed herein are designed for ordinary electronic applications, such as electrical appliances, audio-visual equipment, communications devices and so on. Hence, it is advisable that the devices should not be used in medical instruments, surgical implants, aerospace machinery, nuclear power control systems, disaster/crime-prevention equipment and the like. Misusing those products may directly or indirectly endanger human life, or cause injury and property loss. Silicon Touch Technology, Inc. will not take any responsibilities regarding the misusage of the products mentioned above. Anyone who purchases any products described herein with the above-mentioned intention or with such misused applications should accept full responsibility and indemnify. Silicon Touch Technology, Inc. and its distributors and all their officers and employees shall defend jointly and severally against any and all claims and litigation and all damages, cost and expenses associated with such intention and manipulation.
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