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 BB506M
Built in Biasing Circuit MOS FET IC UHF RF Amplifier
REJ03G1604-0100 Rev.1.00 Nov 26, 2007
Features
* Built in Biasing Circuit; To reduce using parts cost & PC board space. * High gain PG = 24 dB typ. (f = 900 MHz) * Low noise NF = 1.4 dB typ. (f = 900 MHz) * Low output capacitance Coss = 1.1 pF typ. (f = 1 MHz) * Provide mini mold packages: CMPAK-4 (SOT-343mod)
Outline
RENESAS Package code: PLSP0004ZA-A (Package name: MPAK-4)
2 3 1 4
1. Source 2. Gate1 3. Gate2 4. Drain
Notes:
1. Marking is "FS-". 2. BB506M is individual type number of RENESAS BBFET.
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to source voltage Gate1 to source voltage Gate2 to source voltage Drain current Channel power dissipation Channel temperature Storage temperature Symbol VDS VG1S VG2S ID PchNote3 Tch Tstg Ratings 6 +6 -0 +6 -0 30 300 150 -55 to +150 Unit V V V mA mW C C
Notes: 3. Value on the glass epoxy board (50 mm x 40 mm x 1 mm).
This device is sensitive to electro static discharge.
An adequate careful handling procedure is requested.
REJ03G1604-0100 Page 1 of 8
Rev.1.00
Nov 26, 2007
BB506M
Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate1 to source breakdown voltage Gate2 to source breakdown voltage Gate1 to source cutoff current Gate2 to source cutoff current Gate1 to source cutoff voltage Gate2 to source cutoff voltage Drain current Forward transfer admittance Input capacitance Output capacitance Power gain Noise figure Symbol V(BR)DSS V(BR)G1SS V(BR)G2SS IG1SS IG2SS VG1S(off) VG2S(off) ID(op) |yfs| Ciss Coss PG NF Min 6 +6 +6 -- -- 0.5 0.4 12 27 1.2 0.7 19 -- Typ -- -- -- -- -- 0.8 0.7 16 32 1.6 1.1 24 1.4 Max -- -- -- +100 +100 1.1 1.0 20 38 2.0 1.5 29 2.1 Unit V V V nA nA V V mA mS pF pF dB dB Test Conditions ID = 200 A, VG1S = VG2S = 0 IG1 = +10 A, VG2S = VDS = 0 IG2 = +10 A, VG1S = VDS = 0 VG1S = +5 V, VG2S = VDS = 0 VG2S = +5 V, VG1S = VDS = 0 VDS = 5 V, VG2S = 4 V, ID = 100 A VDS = 5 V, VG1S = 5 V, ID = 100 A VDS = 5 V, VG1 = 5 V, VG2S = 4 V RG = 100 k VDS = 5 V, VG1 = 5 V, VG2S = 4 V RG = 100 k, f = 1 kHz VDS = 5 V, VG1 = 5 V, VG2S = 4 V RG = 100 k, f = 1 MHz VDS = 5 V, VG1 = 5V, VG2S = 4 V RG = 100 k, f = 900 MHz
Bias Circuit for Operating Items (ID(op), |yfs|, Ciss, Coss, NF, PG)
VG2 Gate 2 Gate 1 RG VG1
Drain A ID
Source
REJ03G1604-0100 Page 2 of 8
Rev.1.00
Nov 26, 2007
BB506M
900 MHz Power Gain, Noise Figure Test Circuit
VG1 VG2 C4 C5 VD C6
R1
R2 C3 G2
R3 D L3
RFC Output (50 ) L4
Input (50 ) L1 L2
G1 S
C1
C2
C1, C2 C3 C4 to C6 R1 R2 R3
: : : : : :
Variable Capacitor (10 pF MAX) Disk Capacitor (1000 pF) Air Capacitor (1000 pF) 100 k 47 k 4.7 k
L1: 10
L2:
10
26
(1 mm Copper wire) Unit : mm
8
21 L4: 29
3
L3:
18
10
7
7
RFC : f1 mm Copper wire with enamel 4 turns inside dia 6 mm
REJ03G1604-0100 Page 3 of 8
Rev.1.00
Nov 26, 2007
10
3
BB506M
Main Characteristics
Maximum Channel Power Dissipation Curve
Channel Power Dissipation Pch* (mW)
400 25
Typical Output Characteristics
VG2S = 4 V VDS = VG1 20
82 k
68 k
300
ID (mA)
15
100 k
120 k
200
Drain Current
10
k
150 k
100
5
RG
=1
80
0
50
100
150
200
0 0
1
2
3
4
5
Ambient Temperature Ta (C)
* Value on the glass epoxy board (50 mm x 40 mm x 1 mm)
Drain to Source Voltage VDS (V) Forward Transfer Admittance vs. Gate1 Voltage
|yfs| (mS)
50 VDS = 5 V VG2S =4 V RG = 100 k f = 1 kHz
Drain Current vs. Gate1 Voltage
25 VDS = 5 V VG2S = 4 V RG = 100 k
ID (mA)
20
40
Forward Transfer Admittance
4V
15
4V 3V
3V 2V
30 20
Drain Current
10 5
VG2S = 1 V
0 0 1 2 3 4 5
10 V G2S = 0
2V 1V
0
0
1
2
3
4
5
Gate1 Voltage VG1 (V)
Gate1 Voltage VG1 (V)
Drain Current vs. Gate Resistance
25
5
Input Capacitance vs. Gate2 to Source Voltage
VDS = 5 V VG1 = 5 V RG = 100 k f = 1 MHz
Input Capacitance Ciss (pF)
100 1000
Drain Current ID (mA)
20
4
15
3
10 5 VDS = VG1 = 5 V VG2S = 4 V 0 10
2
1
0 0 1 2 3 4
Gate Resistance RG (k)
Gate2 to Source Voltage VG2S (V)
REJ03G1604-0100 Page 4 of 8
Rev.1.00
Nov 26, 2007
BB506M
Power Gain vs. Gate Resistance
50
VDS = 5 V VG1 = 5 V VG2S = 4 V f = 900 MHz
Noise Figure vs. Gate Resistance
5
VDS = 5 V VG1 = 5 V VG2S = 4 V f = 900 MHz
Power Gain PG (dB)
NF (dB) Noise Figure
40
4
30
3
20
2
10
1
0 10
0 100 1000 10 100 1000
Gate Resistance RG (k) Power Gain vs. Gate2 to Source Voltage
25
5
Gate Resistance RG (k)
Noise Figure vs. Gate2 to Source Voltage
VDS = 5 V VG1 = 5 V RG = 100 k f = 900 MHz
NF (dB) Noise Figure
4 VDS = 5 V VG1 =5 V RG = 100 k f = 900 MHz 1 2 3
Power Gain PG (dB)
20
4
15
3 2
10
5
1
0
0 1 2 3 4
Gate2 to Source Voltage VG2S (V) Gain Reduction vs. Gate2 to Source Voltage
40 VDS = 5 V VG1 = 5 V RG = 100 k f = 900 MHz
Gate2 to Source Voltage
VG2S (V)
Gain Reduction GR (dB)
35 30 25 20 15 10 5 0 0 1 2
3
4
Gate2 to Source Voltage VG2S (V)
REJ03G1604-0100 Page 5 of 8
Rev.1.00
Nov 26, 2007
BB506M
S11 Parameter vs. Frequency
.8 .6 .4 3 .2 4 5 10 0 .2 .4 .6 .8 1 1.5 2 3 45 -10 -.2 -5 -4 -3 -.4 -2 -.6 -.8 -1 -1.5 -120 -90 -60 180 0 150 30 1 1.5 2 120
S21 Parameter vs. Frequency
90
Scale: 5 / div.
60
-150
-30
Test condition: VDS = 5 V, VG1 = 5 V, VGS2 = 4 V, RG = 100 k 0.05 to 1.05 GHz (0.05 GHz step)
Test condition: VDS = 5 V, VG1 = 5 V, VGS2 = 4 V, RG = 100 k 0.05 to 1.05 GHz (0.05 GHz step)
S12 Parameter vs. Frequency
90 120
S22 Parameter vs. Frequency
.8 .6 .4 3 1 1.5 2 30 .2
Scale: 0.05 / div.
60
150
4 5 10
180
0
0
.2
.4
.6 .8 1
1.5 2
3 45 -10
-.2 -150 -30 -.4 -2 -120 -90 -60 -.6 -.8 -1 -1.5
-5 -4 -3
Test condition: VDS = 5 V, VG1 = 5 V, VGS2 = 4 V, RG = 100 k 0.05 to 1.05 GHz (0.05 GHz step)
Test condition: VDS = 5 V, VG1 = 5 V, VGS2 = 4 V, RG = 100 k 0.05 to 1.05 GHz (0.05 GHz step)
REJ03G1604-0100 Page 6 of 8
Rev.1.00
Nov 26, 2007
BB506M
S parameter
(VDS = 5 V, VG1 = 5 V, VG2S = 4 V, RG = 100 k, Zo = 50 )
Freq (MHz) 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 S11 Mag 0.995 0.991 0.992 0.987 0.984 0.981 0.975 0.967 0.964 0.958 0.951 0.939 0.933 0.922 0.916 0.900 0.892 0.883 0.866 0.858 Deg -3.3 -6.2 -9.3 -12.4 -15.5 -18.6 -21.7 -24.8 -27.9 -30.8 -33.9 -37.0 -40.3 -43.5 -46.5 -49.6 -52.8 -56.2 -59.2 -62.0 Mag 3.28 3.26 3.28 3.26 3.27 3.24 3.23 3.24 3.22 3.22 3.22 3.20 3.20 3.20 3.19 3.19 3.18 3.18 3.17 3.16 S21 Deg 177.9 175.5 173.7 171.3 170.0 167.3 165.8 163.3 161.9 159.4 157.9 155.4 154.1 150.7 150.7 146.7 146.4 142.8 142.3 139.8 Mag 0.001 0.001 0.002 0.002 0.004 0.003 0.004 0.004 0.004 0.006 0.006 0.004 0.004 0.007 0.007 0.006 0.005 0.005 0.006 0.006 S12 Deg 17.6 75.6 73.8 79.5 116.5 89.6 76.3 87.0 91.9 89.0 100.4 84.2 85.4 80.4 93.5 108.8 122.9 120.3 104.0 121.3 Mag 0.991 0.996 0.995 0.997 0.995 0.993 0.992 0.989 0.991 0.987 0.988 0.985 0.984 0.983 0.981 0.979 0.978 0.975 0.970 0.970 S22 Deg -1.8 -3.6 -5.2 -7.0 -8.6 -10.3 -11.8 -13.9 -15.5 -17.0 -18.9 -20.4 -22.2 -23.7 -25.5 -27.2 -28.9 -30.6 -32.3 -33.8
REJ03G1604-0100 Page 7 of 8
Rev.1.00
Nov 26, 2007
BB506M
Package Dimensions
Package Name MPAK-4 JEITA Package Code SC-61AA RENESAS Code PLSP0004ZA-A Previous Code MPAK-4 / MPAK-4V MASS[Typ.] 0.013g
D e2 b1 B B e
A Q c
E
HE
L A A xM S A b
L1 A3 e2
LP
Reference Dimension in Millimeters Symbol Min Nom Max
e
A2
A
I1
b5 yS A1 S e1
b
b1
I1
c
c
b4
A-A Section
B-B Section
Pattern of terminal position areas
A A1 A2 A3 b b1 c D E e e2 HE L L1 LP x y b4 b5 e1 I1 Q
1.0 0 1.0 0.35 0.55 0.1 2.7 1.35
1.1 0.25 0.4 0.6 0.16 1.5 0.95 0.85 2.8
1.3 0.1 1.2 0.5 0.7 0.26 3.1 1.65
2.2 0.35 0.15 0.25
3.0 0.75 0.55 0.65 0.05 0.05 0.55 0.75 1.05
1.95 0.3
Ordering Information
Part Name BB506MFS-TL-E Note: Quantity 3000 Emboss Taping Shipping Container
For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
REJ03G1604-0100 Page 8 of 8
Rev.1.00
Nov 26, 2007
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
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(c) 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2


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