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CYStech Electronics Corp.
PNP Epitaxial Planar Power Transistor
Spec. No. : C657J3 Issued Date : 2007.04.04 Revised Date :2009.02.04 Page No. : 1/6
BTA1640J3
Features
BVCEO IC RCESAT
-50V -7A 70m
* Low collector-emitter saturation voltage, VCE(sat) = -0.4V(max) @ IC = -3A, IB=-0.15A * Excellent current gain linearity * RoHS compliant package
Symbol
BTA1640J3
Outline
TO-252
BBase CCollector EEmitter
BCE
Absolute Maximum Ratings (Ta=25C)
Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation @ TA=25 Power Dissipation @ TC=25 Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Junction Temperature Storage Temperature
Note : 1. Single Pulse , Pw380s, Duty2%.
Symbol VCBO VCEO VEBO IC ICP PD PD RJA RJC Tj Tstg
Limits -30 -30 -5 -7 -10 (Note 1) 1 20 125 6.25 150 -55~+150
Unit V V V A W C/W C/W C C
BTA1640J3
CYStek Product Specification
CYStech Electronics Corp.
Characteristics (Ta=25C)
Symbol *BVCEO BVCBO BVEBO ICEO ICBO IEBO *VCE(sat) *VBE(sat) *hFE *hFE Min. -30 -30 -5 160 30 Typ. -0.2 Max. -50 -1 -1 -0.4 -1.2 400 Unit V V V A A A V V -
Spec. No. : C657J3 Issued Date : 2007.04.04 Revised Date :2009.02.04 Page No. : 2/6
Test Conditions IC=-10mA, IB=0 IC=-1mA, IE=0 IE=-1mA, IC=0 VCE=-20V, IB=0 VCB=-30V, IB=0 VEB=-5V, IC=0 IC=-3A, IB=-150mA IC=-3A, IB=-150mA VCE=-1V, IC=-1A VCE=-1V, IC=-3A
*Pulse Test : Pulse Width 380s, Duty Cycle2%
Ordering Information
Device BTA1640J3 Package TO-252 (RoHS compliant) Shipping 2500 pcs / Tape & Reel Marking A1640
Characteristic Curves
Current Gain vs Collector Current
1000
Saturation Voltage vs Collector Current
10000 Saturation Voltage---(mV)
Current Gain---HFE
VCE=2V
VCE(SAT)
1000
100
VCE=1V
100
IC=30IB
IC=50IB
10 1 10 100 1000 Collector Current---IC(mA) 10000
10 1 10 100 1000 Collector Current---IC(mA) 10000
BTA1640J3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Saturation Voltage vs Collector Current
10000
Saturation Voltage---(mV)
Spec. No. : C657J3 Issued Date : 2007.04.04 Revised Date :2009.02.04 Page No. : 3/6
Grounded Emitter Output Characteristics
4000 Collector Current---IC(mA)
20mA
VBE(SAT)@IC=50IB
3500 3000 2500 2000 1500 1000 500 0 0
1000
10mA 6mA 2mA IB=0
100 1 10 100 1000 Collector Current---IC(mA) 10000
1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V)
6
Grounded Emitter Output Characteristics
8000 Collector Current---IC(mA) 7000 6000 5000 4000 3000 2000 1000 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V)
10mA 5mA IB=0mA 25mA 50mA
Power Derating Curve
1.2 1 Power Dissipation---PD(W) 0.8 0.6 0.4 0.2 0 0 50 100 150 200 Ambient Temperature---TA()
6
Power Derating Curve
25 Power Dissipation---PD(W) 20 15 10 5 0 0 50 100 150 200 Case Temperature---TC()
BTA1640J3
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C657J3 Issued Date : 2007.04.04 Revised Date :2009.02.04 Page No. : 4/6
Carrier Tape Dimension
BTA1640J3
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product Pb-free devices Peak Temperature 260 +0/-5 C
Spec. No. : C657J3 Issued Date : 2007.04.04 Revised Date :2009.02.04 Page No. : 5/6
Soldering Time 5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature Average ramp-up rate (Tsmax to Tp) Preheat -Temperature Min(TS min) -Temperature Max(TS max) -Time(ts min to ts max) Time maintained above: -Temperature (TL) - Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature
Sn-Pb eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds 240 +0/-5 C 10-30 seconds 6C/second max. 6 minutes max.
Pb-free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds 260 +0/-5 C 20-40 seconds 6C/second max. 8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTA1640J3
CYStek Product Specification
CYStech Electronics Corp.
TO-252 Dimension
Marking:
A C
Device Name
Spec. No. : C657J3 Issued Date : 2007.04.04 Revised Date :2009.02.04 Page No. : 6/6
B L F G
D
A1640
Date Code
3 H E K 2 I 1 J
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3
*: Typical
DIM A B C D E F
Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2441 0.2677 0.2125 0.2283
Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.20 6.80 5.40 5.80
DIM G H I J K L
Inches Min. Max. 0.0866 0.1102 *0.0906 0.0449 0.0346 0.2047 0.2165 0.0551 0.0630
Millimeters Min. Max. 2.20 2.80 *2.30 1.14 0.88 5.20 5.50 1.40 1.60
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: KFC; pure tin plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTA1640J3
CYStek Product Specification

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