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APX9132G
Hall Effect Micro Switch IC
Features
* * * * *
Micro Power Operation for Battery Applications Chopper Stabilized Amplifier Independent of North or South Pole Magnet, Easy for Manufacture Small Size Package Lead Free and Green Devices Available (RoHS Compliant)
General Description
The APX9132G, integrated circuit, is an ultra-sensitive, pole independent Hall-effect switch with a latched digital output. A 2.5 volt to 3.5 volt operation and an unique clocking s c h e m e r e d u c e t h e a ve r a g e o p e r a t i n g p o we r requirements, either a north or south pole of sufficient flux will turn the output on; in the absence of a magnetic field, the output is off. The polarity independence and minimal power requirement allow this device to be easily replaced reed switch for superior for signal conditioning. Advanced CMOS processing is used to take advantage of low-voltage and low-power requirements, SOT-23-3 package provided a optimized package for most applications.
Applications
* * * *
Micro Switch Handheld Wireless Application Wake Up Switch Clamp Shell Type Application Switch Magnet Switch in Low Duty Cycle Applications
Pin Configuration
GND
APX9132G
VDD
VOUT
SOT-23-3
Ordering and Marking Information
APX9132G Assembly Material Handling Code Temperature Range Package Code Package Code A : SOT-23-3 AT : TSOT-23-3 Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device X - Date Code
APX9132G A/AT:
X32X
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Oct., 2009 1 www.anpec.com.tw
APX9132G
Absolute Maximum Ratings
Symbol VDD VOUT IOUT TJ TSTG Supply Voltage Output Voltage Output Current Junction Temperature Range Storage Temperature Range
TA = 25C unless otherwise noted (Note 1)
Rating 5 5 1 150 -65 to +150 Unit V V mA C C
Parameter
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol JA Parameter Junction-to-Ambient Resistance in Free Air
(Note 2)
Typical Value SOT-23 TSOT-23 260 275 0.385 0.364
Unit
C/W
Power Dissipation, TA=25oC PD SOT-23 TSOT-23 W
Note 2: JA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Electrical Characteristics
Symbol VDD Characteristic Supply Voltage Range
TA = 25C, VDD=3V unless otherwise noted APX9132G Test Conditions Min. Operating Average 2.5 VDD -0.4 Typ. 5 1.2 2 20 180 60 0.3 11 Max. 3.5 10 2 8 1.0 40 V A mA A A V mV s ms % kHz Unit
IDD
Supply Current
Awake Sleep
IOFF VOH VOL tawake tperiod d.c. fc
Output Leakage Current Output High Voltage Output Low Voltage Wake up Time Period Duty Cycle Chopping Frequency
VOUT=3.5V, BRPNCopyright (c) ANPEC Electronics Corp. Rev. A.1 - Oct., 2009
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APX9132G
Magnetic Characteristics
Symbol BOPS Operate Points BOPN BRPS Release Points BRPN Bhys Hysteresis -23 -15 10 -10 G G -28 10 -25 15 -19 23 G G Characteristic
TA = 25C, VDD=3V unless otherwise noted
APX9132G Test Conditions Min. 19 Typ. 25 Max. 28 G Unit
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APX9132G
Typical Operating Characteristics
Switching Points vs. Ambient Temperature
40 30 20
Switching Points (G)
BOPS
Switching Points vs. Supply Voltage
40 30 20
Switching Points (G)
BOPS
TA=25oC
10 0 -10 -20 -30 -40 -40
BRPS
10 0 -10 -20 -30
BRPS
BRPN
BRPN
BOPN
BOPN
-40
-20
0
20
40
60
80
100
2.5
3
3.5
4
4.5
5
Ambient Temperature (C)
Supply Voltage (V)
Average Supply Current vs. Ambient Temperature
10
Average Supply Current (A)
Average Supply Current vs.Supply Voltage
20 18
Average Supply Current (A) TA=25oC
8
16 14 12 10 8 6 4 2 0 2.5 3 3.5 4 4.5 5
6
4
2
0 -40 -20 0 20 40 60 80 100
Ambient Temperature (C)
Supply Voltage (V)
Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Oct., 2009
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APX9132G
Typical Operating Characteristics (Cont.)
Output Source Current vs. VDD-VOUT Voltage
5
VDD=5V
Output Sink Current vs. Output Low Voltage
10 9 8
Output Sink Current (mA)
VDD=4V
Output Source Current (mA)
4
7 6 5 4 3 2 1
0
VDD=5V
VDD=3V
3
VDD=4V
2
VDD=3V
1
0 0 0.2 0.4 0.6 0.8 1
0 0 0.2 0.4 0.6 0.8 1
Output Low Voltage (V)
VDD-VOUT Voltage (V)
Output Switch Waveform
Output Switch Waveform
Output Voltage (0.5V/div)
VOUT (0.5V/div)
Output Voltage (0.5V/div)
VDD=3V CL=12pF
VDD=3V CL=12pF
VOUT (0.5V/div)
Time (50s/div)
Time (50s/div)
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APX9132G
Pin Description
PIN NO. 1 2 3 NAME VDD VOUT GND Power Input When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than BOPN) the output turns on (output is low). When the magnetic field is below the release point BRPS (or above BRPN), the output turns off (output is high). Ground Connection FUNCTION
Block Diagram
VDD
Awake & Sleep Timing Logic
Hall Plane
Dynamic Offset Cancellation
Latch Circuit
VOUT
Chopper Amplifier
Hysteresis Control
GND
Typical Application Circuit
VOUT APX9132G
VDD
+ 2.5V-3.5V 0.1F -
GND
SOT-23 (Top View)
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APX9132G
Function Description
Operation The output of APX9132G switches low (turn-on) when in presence of strong flux density facing the marked side of package exceeds the operate point BOPS (or is less than BOPN). After turn-on, the output is capable of sinking up to 1mA and the output voltage is low (turn-on). In absence of flux density below the release point BRPS (or increased above BRPN), the APX9132G output switches high (turns off). After turn-off, the output is capable of sourcing up to 1mA and the output voltage is high (turn-off). The difference in the magnetic operated and released point is the hysteresis (B hys) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical bouncing vibration and electrical noise. Awake & Sleep Internal awake & sleep timing block circuit activates the sensor for 180s and deactivates it for the remainder of the period (60ms). A short "awake" time allows for stabilization prior to the sensor sampling and data latching on the falling edge of the timing pulse. While in sleep cycle, the output is latched in its previous state. Chopper Stabilized Technique The chopper stabilized technique cancels the mismatching of the hall element, the amplifier offset voltage and temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique produces devices have an extremely stable Hall output voltage, therefore, the magnetic switch points are stable.
OUTPUT OFF 5V MAX OUTPUT VOLTAGE BOPN BOPS
BRPN 0 -B 0
BRPS
OUTPUT ON +B
MAGNETIC FLUX
Pole-independent The pole-independent sensing technique allows for operation with either a north or south pole magnet orientation, enhancing the manufacturability of the device. The state-of-the-art technology provides the same output polarity for either pole in presence.
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APX9132G
Application Information
It is strongly recommended that an external bypass capacitor be connected (is close to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies.
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APX9132G
Package Information
SOT-23-3
D e
SEE VIEW A
E1
E
b e1
c
0.25
VIEW A SOT-23-3 INCHES MIN. MAX. 0.057 0.000 0.035 0.012 0.003 0.106 0.102 0.055 0.037 BSC 0.075 BSC 0.60 8 0.012 0 0.024 8 0.006 0.051 0.020 0.009 0.122 0.118 0.071 MAX. 1.45 0.15 1.30 0.50 0.22 3.10 3.00 1.80
A2
A
A1
S Y M B O L A A1 A2 b c D E E1 e e1 L 0
MILLIMETERS MIN.
0.00 0.90 0.30 0.08 2.70 2.60 1.40 0.95 BSC 1.90 BSC 0.30 0
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Oct., 2009
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0
L
GAUGE PLANE SEATING PLANE
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APX9132G
Package Information
TSOT-23-3
D e
SEE VIEW A
E1 b e1
E
c
A2
A
0.25 GAUGE PLANE SEATING PLANE L VIEW A TSOT-23 INCHES MIN. 0.030 0.001 0.028 0.012 0.003 0.106 0.102 0.055 0.037 BSC 0.075 BSC 0.60 8 0.012 0 0.024 8 MAX. 0.031 0.002 0.030 0.020 0.008 0.122 0.118 0.071 MAX. 0.80 0.05 0.75 0.50 0.20 3.10 3.00 1.80
S Y M B O L A A1 A2 b c D E E1 e e1 L 0
MILLIMETERS MIN. 0.75 0.03 0.70 0.30 0.08 2.70 2.60 1.40 0.95 BSC 1.90BSC 0.30 0
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Oct., 2009
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APX9132G
Carrier Tape & Reel Dimensions
OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B
d
Application
A 178.0O .00 2
H 50 MIN. P1 4.0O .10 0 H 50 MIN. P1 4.0O .10 0
H A
T1
T1 8.4+2.00 -0.00 P2 2.0O .05 0 T1 8.4+2.00 -0.00 P2 2.0O .10 0
C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00
d 1.5 MIN. D1 1.0 MIN. d 1.5 MIN. D1 1.0 MIN.
D 20.2 MIN. T 0.6+0.00 -0.40 D 20.2 MIN. T 0.6+0.00 -0.40
W 8.0O .30 0 A0 3.20O .20 0 W 8.0O .30 0 A0 3.20O .20 0
W
E1 1.75O .10 0 B0 3.10O .20 0 E1 1.75O .10 0 B0 3.10O .20 0
F 3.5O .05 0 K0 1.50O .20 0 F 3.5O .05 0 K0 1.50O .20 0 (mm)
SOT-23-3
P0 4.0O .10 0
Application
A 178.0O .00 2
TSOT-23-3
P0 4.0O .10 0
Devices Per Unit
Package Type SOT-23-3 TSOT-23-3 Unit Tape & Reel Tape & Reel Quantity 3000 3000
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APX9132G
Taping Direction Information
(T)SOT-23-3
USER DIRECTION OF FEED
Classification Profile
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APX9132G
Classification Reflow Profiles
Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time (tP)** within 5C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to peak temperature Sn-Pb Eutectic Assembly 100 C 150 C 60-120 seconds 3 C/second max. 183 C 60-150 seconds See Classification Temp in table 1 20** seconds 6 C/second max. 6 minutes max. Pb-Free Assembly 150 C 200 C 60-120 seconds 3C/second max. 217 C 60-150 seconds See Classification Temp in table 2 30** seconds 6 C/second max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process - Classification Temperatures (Tc) Package Thickness <2.5 mm 2.5 mm
3 3 3
Volume mm <350 235 C 220 C
Volume mm 350 220 C 220 C
3
Table 2. Pb-free Process - Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm - 2.5 mm 2.5 mm Volume mm <350 260 C 260 C 250 C Volume mm 350-2000 260 C 250 C 245 C Volume mm >2000 260 C 245 C 245 C
3
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245C 1000 Hrs, Bias @ 125C 168 Hrs, 100%RH, 2atm, 121C 500 Cycles, -65C~150C VHBMU2KV VMMU200V 10ms, 1trU 100mA
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APX9132G
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838
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