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| MA4GP907 GaAs Flip Chip PIN Diode Features Low Series Resistance Ultra Low Capacitance Millimeter Wave Switching & Cutoff Frequency 2 Nanosecond Switching Speed Can be Driven by a Buffered TTL Silicon Nitride Passivation Polyimide Scratch Protection RoHS Compliant M/A-COM Products RoHS Compliant Chip Dimensions Rev. V6 Description M/A-COM's MA4GP907 is Gallium Arsenide (GaAs) flip-chip PIN diode. It is fabricated using an OMCVD epitaxial wafer with a process designed for high device uniformity and extremely low parasitics. The diode exhibits an extremely low RC product, (0.1ps) and 2-3nS switching characteristics. They are fully passivated with silicon nitride and have an added polymer layer for scratch protection. The protective coating prevents damage to the junction and the anode air-bridge during handling and assembly. Applications The ultra low capacitance of the MA4GP907 allows for operation up to millimeter frequencies for RF switches and switched phase shifter applications. The diode is designed for use in pulsed or CW applications, where single digit nS switching speed is required. The low capacitance of the MA4GP907 makes it for use in microwave multi-throw switch assemblies, where the series capacitance of each "off" port adversely loads the input and affects VSWR. Notes: 1. Gold Pads 14M thick. 2. Yellow areas indicate ohmic gold mounting pads. Inches DIM A MIN. 0.026 0.0135 0.0065 0.0043 0.0068 0.0182 MAX. 0.027 0.0145 0.0075 0.0053 0.0073 0.0192 Millimeters MIN. 0.6604 0.3429 0.1651 0.1092 0.1727 0.4623 MAX. 0.6858 0.3683 0.1905 0.1346 0.1854 0.4877 Absolute Maximum Ratings TAMB = +25C (unless otherwise specified) Parameter Absolute Maximum Reverse Voltage 50V Operating Temperature -55C to +125C Storage Temperature -55C to +150C Junction Temperature +175C Dissipated Power 50mW ( RF & DC ) C.W. Incident Power +23 dBm Mounting Temperature +280C for 10 seconds B C D E F ADVANCED: Data Sheets contain information regarding a product M/A-COM is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4GP907 GaAs Flip Chip PIN Diode M/A-COM Products RoHS Compliant Electrical Specifications @ TAMB = +25C Rev. V6 Parameter Total Capacitance Symbol CT Conditions -10V,1MHz Units pF Typ. 0.025 Max. 0.030 Total Capacitance 1 Series Resistance CT RS RS -10V,10GHz +10mA, 1MHz pF 0.025 5.2 ---- 7.0 Series Resistance 2 +10mA, 10GHz 4.2 ---- Forward Voltage VF IR TRISE TFALL +10mA V 1.33 1.45 Reverse Voltage Current 3 Switching Speed 4 VR = -50V 10GHz A nS ---- 2 10 ---- Notes: 1) Capacitance is determined by measuring the isolation of a single series diode in a 50 transmission line at 10GHz. 2) Series resistance is determined by measuring the insertion loss of a single series diode in a 50 transmission line at 10GHz. 3) The max rated VR( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10A 4) Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series mounted diode. Driver delay is not included. ADVANCED: Data Sheets contain information regarding a product M/A-COM is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4GP907 GaAs Flip Chip PIN Diode M/A-COM Products RoHS Compliant Typical RF Performance @ TAMB = +25C Insertion Loss vs. Frequency Rev. V6 I. Loss @5mA 0.0 I. Loss @15mA I. Loss @50mA Insertion Loss (dB) -0.2 -0.4 -0.6 -0.8 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency (GHz) Return Loss vs. Frequency R. Loss @5mA 0.0 -5.0 -10.0 Return Loss (dB) -15.0 -20.0 -25.0 -30.0 -35.0 -40.0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency (GHz) R. Loss @15mA R. Loss @50mA ADVANCED: Data Sheets contain information regarding a product M/A-COM is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4GP907 GaAs Flip Chip PIN Diode M/A-COM Products RoHS Compliant Typical RF Performance @ TAMB = +25C Isolation vs. Frequency Rev. V6 Isolation @ -10V Isolation @ 0V 0.0 -5.0 -10.0 Isolation (dB) -15.0 -20.0 -25.0 -30.0 -35.0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency ( GHz ) ADVANCED: Data Sheets contain information regarding a product M/A-COM is * North America Tel: 800.366.2266 / Fax: 978.366.2266 Frequency (Hz) considering for development. Performance is based on target specifications, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4GP907 GaAs Flip Chip PIN Diode M/A-COM Products RoHS Compliant Device Installation Guidelines Rev. V6 Cleanliness This device should be handled in a clean environment. The chip is resistant to solvents and may cleaned using approved industry standard practices. Static Sensitivity Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD handling techniques should be used. These devices are rated Class 0, ( 0-199V )per HBM MIL-STD-883, method 3015.7 should be handled in a static-free environment. General Handling The die has a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil. Assembly Requirements using Electrically Conductive Silver Epoxy and Solder The MA4GP907 is designed to be inserted onto hard or soft substrates with the junction/pad side down. It may be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately 1-2 mils in thickness and cured at approximately 90C to 150C per manufacturer's schedule. For extended cure times, > 30 minutes, temperatures must be kept below 200C. Eutectic Die Attached Tin rich solders ( >30% Sn by weight ) are not recommended as they will scavenge gold from the contact pads exposing the tungsten metallization beneath and creating a poor solder connection. Indalloy or 80Au/20Sn type solders are acceptable. Maximum soldering temperature must be kept below 280C for less than 10 seconds. Circuit Pad Layout 0.013" Ordering Information Part Number MA4GP907 MADP-000907-13050P Packaging Waffle Pack Pocket Tape 0.008" (2) PL 0.012" (2) PL ADVANCED: Data Sheets contain information regarding a product M/A-COM is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 simulated results, and/or prototype measurements. Commitment to develop is not * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make under development. Performance is based on engineering tests. Specifications are changes to the product(s) or information contained herein without notice. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. |
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