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4V Drive Pch+Pch MOSFET SH8J62 Structure Silicon P-channel MOSFET Features 1) Low On-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (SOP8). Application Switching Each lead has same dimensions Dimensions (Unit : mm) SOP8 Packaging specifications Package Type SH8J62 Code Basic ordering unit (pieces) Taping TB 2500 Inner circuit (8) (7) (6) (5) 2 2 (1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain 1 1 (1) (2) (3) (4) 1 ESD PROTECTION DIODE 2 BODY DIODE Absolute maximum ratings (Ta=25C) Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body diode) Total power dissipation Channel temperature Range of Storage temperature 1 Pw10s, Duty cycle1% 2 Mounted on a ceramic board Continuous Pulsed Continuous Pulsed Symbol VDSS VGSS ID IDP 1 IS ISP 1 PD Tch Tstg 2 Limits -30 20 4.5 18 -1.6 -18 2.0 1.4 150 -55 to +150 Unit V V A A A A W / TOTAL W / ELEMENT C C www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 1/5 2010.01 - Rev.A SH8J62 Electrical characteristics (Ta=25C) Parameter Symbol Min. Typ. - - - - 40 55 60 - 800 120 110 7 15 70 50 8.0 2.5 3.0 Max. 10 - -1 -2.5 56 77 84 - - - - - - - - - - - Gate-source leakage - IGSS Drain-source breakdown voltage V(BR) DSS -30 Zero gate voltage drain current IDSS - Gate threshold voltage VGS (th) -1.0 - Static drain-source on-state - RDS (on) resistance - Yfs 3.5 Forward transfer admittance Input capacitance Ciss - Output capacitance - Coss Crss Reverse transfer capacitance - - Turn-on delay time td (on) tr - Rise time Turn-off delay time - td (off) tf Fall time - Total gate charge - Qg Gate-source charge Qgs - Gate-drain charge Qgd - Pulsed Data Sheet Unit A V A V m m m S pF pF pF ns ns ns ns nC nC nC Conditions VGS=20V, VDS=0V ID= -1mA, VGS=0V VDS= -30V, VGS=0V VDS= -10V, ID= -1mA ID= -4.5A, VGS= -10V ID= -2.5A, VGS= -4.5V ID= -2.5A, VGS= -4.0V VDS= -10V, ID= -4.5A VDS= -10V VGS=0V f=1MHz ID= -2.5A VDD -15V VGS= -10V RL=6.0 RG=10 VDD -15V ID= -4.5A VGS= -5V RL=3.3 / RG=10 Body diode characteristics (Source-Drain) (Ta=25C) Parameter Forward voltage Pulsed Symbol VSD Min. - Typ. - Max. -1.2 Unit V Conditions IS= -4.5A, VGS=0V www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 2/5 2010.01 - Rev.A SH8J62 Electrical characteristic curves 20 20 Ta=25C Pulsed 18 16 14 12 10 8 6 4 2 0 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 0.01 1.0 1.5 2.0 2.5 Ta=25C VGS= -10V Pulsed VGS= -4.5V VGS= -4.0V VGS= -3.8V 10 VDS= -10V Pulsed Ta= 125C Ta= 75C Ta= 25C Ta= - 25C Data Sheet DRAIN CURRENT : -ID[A] DRAIN CURRENT : -ID[A] 15 10 VGS= -10V VGS= -4.5V VGS= -4.0V DRAIN CURRENT : -ID[A] 1 5 VGS= -3.5V VGS= -3.0V VGS= -3.2V 0.1 0 3.0 DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.1 Typical output characteristics( ) DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.2 Typical output characteristics( ) GATE-SOURCE VOLTAGE : -VGS[V] Fig.3 Typical Transfer Characteristics 1000 1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[m ] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) [m] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[m ] Ta=25C Pulsed 1000 VGS= -10V Pulsed Ta=125C Ta=75C Ta=25C Ta= -25C VGS= -4.5V Pulsed Ta=125C Ta=75C Ta=25C Ta= -25C VGS= -4.0V VGS= -4.5V VGS= -10V 100 100 100 10 0.1 1 DRAIN-CURRENT : -ID[A] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current( ) 10 10 0.1 1 DRAIN-CURRENT : -ID[A] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current( ) 10 10 0.1 1 DRAIN-CURRENT : -ID[A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current( ) 10 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[m ] 1000 10 10 FORWARD TRANSFER ADMITTANCE : |Yfs| [S] Ta=125C Ta=75C Ta=25C Ta= -25C REVERSE DRAIN CURRENT : -Is [A] VGS= -4.0V Pulsed VDS= -10V Pulsed VGS=0V Pulsed 1 100 1 Ta= -25C Ta=25C Ta=75C Ta=125C 0.1 Ta=125C Ta=75C Ta=25C Ta=-25C 10 0.1 1 DRAIN-CURRENT : -ID[A] Fig.7 Static Drain-Source On-State Resistance vs. Drain Current( ) 10 0.1 0.01 0.1 1 10 0.01 0.0 0.5 1.0 1.5 DRAIN-CURRENT : -ID[A] Fig.8 Forward Transfer Admittance vs. Drain Current SOURCE-DRAIN VOLTAGE : -VSD [V] Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 3/5 2010.01 - Rev.A SH8J62 200 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[m ] Data Sheet 10000 Ta=25C Pulsed Switching Time : t [ns] GATE-SOURCE VOLTAGE : -VGS [V] 10 Ta=25C VDD= -15V VGS=-10V RG=10 Pulsed 8 6 4 2 0 0 5 10 15 Ta=25C VDD= -15V ID= -4.5A RG=10 Pulsed 150 ID= -4.5A ID= -2.5A 1000 td(off) tf 100 100 tr td(on) 50 10 0 0 5 10 15 1 0.01 0.1 1 10 GATE-SOURCE VOLTAGE : -VGS[V] Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage DRAIN-CURRENT : -ID[A] Fig.11 Switching Characteristics TOTAL GATE CHARGE : Qg [nC] Fig.12 Dynamic Input Characteristics 10000 Ta=25C f=1MHz VGS=0V 1000 Ciss DRAIN CURRENT : -ID (A) 1000 100 Operation in this area is limited by RDS(on) (VGS=-10V) PW = 1ms PW=100us CAPACITANCE : C [pF] 10 1 DC operation PW=10ms 100 Coss Crss 10 0.01 0.1 1 10 100 0.1 0.01 Ta = 25C Single Pulse MOUNTED ON CERAMIC BOARD 0.1 1 10 100 DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.13 Typical Capacitance vs. Drain-Source Voltage DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.14 Maximum Safe Operating Area 10 NORMARIZED TRANSIENT THERMAL RESISTANCE : r (t) 1 0.1 Ta = 25C Single Pulse : 1Unit Rth(ch-a)(t) = r(t)xRth(ch-a) Rth(ch-a) = 89.3 C/W 0.01 0.001 0.001 0.01 0.1 1 10 100 1000 PULSE WIDTH : Pw(s) Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 4/5 2010.01 - Rev.A SH8J62 Measurement circuits Pulse Width Data Sheet VGS ID RL D.U.T. VDS VGS 10% 50% 10% 90% 50% 10% 90% RG VDD VDS 90% td(on) ton tr td(off) toff tf Fig.1-1 Switching Time Test Circuit Fig.1-2 Switching Time Waveforms VG VGS ID RL IG(Const.) D.U.T. RG VDD VDS Qg VGS Qgs Qgd Charge Fig.2-1 Gate Charge Test Circuit Fig.2-2 Gate Charge Waveform www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 5/5 2010.01 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. 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More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. R1010A |
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