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Z-Power LED X10490 Technical Data Sheet XZ20360 Description Z-Power series is designed for high current operation and high flux output applications. Z-Power LED's thermal management perform exceeds other power LED solutions. It incorporates state of the art SMD design and Thermal emission material. Z Power LED is ideal light sources for general Illumination applications, custom designed solutions, automotive large LCD backlights Z2 Features * Super high Flux output and high Luminance * Designed for high current operation * Low thermal resistance * SMT solderbility * Lead Free product * RoHS compliant Applications * Mobile phone flash * Automotive interior / exterior lighting * Automotive signal lighting * Automotive forward lighting * General Torch * Architectural lighting * LCD TV / Monitor Backlight * Projector light source * Traffic signals * Task lighting * Decorative / Pathway lighting * Household appliances * Remote / Solar powered lighting *The appearance and specifications of the product may be changed for improvement without notice. Rev. 00 October. 2009 1 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Full Code of Z-Power LED Series Full code form : X1 X2 X3 X4 X5 X6 X7 - X8 X9 -X10X11 X12 X13X14 1. Part Number - X1 : Color - X2 : New Z-Power LED - `Z' - X3 : New Z-Power LED series number - X4 : LENS type - X5 : Chip quantity (or Power Dissipation) - X6 : Package outline size -X7: Type of PCB 2. Internal Number - X8 - X9 3. Code Labeling - X10 : Luminous flux (or Radiant flux for royal blue) - X11 X12 X13: Dominant wavelength (or x,y coordinates rank code) - X1 4: Forward voltage 4. Sticker Diagram on Reel & Aluminum Vinyl Bag PART NO. : X1 X2 X3 X4 X5 X6 X7 - X8 X9 QUANTITY : ### LOT NUMBER : ########## BIN CODE : X10 X11 X12 X13 X14 For more information about binning and labeling, refer to the Application Note -1 Rev. 00 October. 2009 2 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Outline Dimension 1. Flat Type [Package Outlines] [Top VIEW] Cathode Mark [Bottom VIEW] Cathode Pad Thermal Pad Anode Pad [Front VIEW] Circuit Diagram [Recommended] [Solder Pad] Anode Cathode Notes : 1. All dimensions are in millimeters. (tolerance : 0.2 ) 2. Scale : none 3. Thermal pad (slug) is isolated. *The appearance and specifications of the product may be changed for improvement without notice. Rev. 00 October. 2009 3 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Characteristics for Z-Power LED 1. Pure White (WZ20360) 1-1 Electro-Optical characteristics at IF=350mA, TA=25C Value Min 200 9.5 Typ 260 6300 68 11.0 120 6.5 3.3 Max 300 12.5 Parameter Luminous Flux [1] [3] Symbol V [2] CCT Ra [4] Unit lm K V deg. C /W C /W Correlated Color Temperature CRI Forward Voltage View Angle Thermal resistance Thermal resistance [5] [6] VF 2 1/2 RJ-B RJ-C 1-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity [7] Symbol IF Pd Tj Topr Tstg - Value 400 4.5 125 -40 ~ +85 -40 ~ +100 10,000V HBM Unit mA W C C C - *Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter.(25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC [7] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink. Rev. 00 October. 2009 4 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Characteristics for Z-Power LED 2. Warm White (NZ20360) 2-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter Luminous Flux [1] [3] Symbol V [2] CCT Ra [4] Value Min 177 9.5 Typ 200 3000 80 11.0 120 6.5 3.3 Max 230 12.5 Unit lm K V deg. C /W C /W Correlated Color Temperature CRI Forward Voltage View Angle Thermal resistance Thermal resistance [5] [6] VF 2 1/2 RJ-B RJ-C 2-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity [7] Symbol IF Pd Tj Topr Tstg - Value 400 4.5 125 -40 ~ +85 -40 ~ +100 10,000V HBM Unit mA W C C C - *Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter.(25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC [7] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink Rev. 00 October. 2009 5 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Characteristics for Z-Power LED 3. Natural White (SZ20360) 3-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter Luminous Flux [1] [5] Symbol V [2] CCT Ra [3] Value Min 177 9.5 Typ 210 4000 80 11.0 120 6.5 3.3 Max 230 12.5 Unit lm K V deg. C /W C /W Correlated Color Temperature CRI Forward Voltage View Angle Thermal resistance Thermal resistance [5] [6] VF 2 1/2 RJ-B RJ-C 3-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity [7] Symbol IF Pd Tj Topr Tstg - Value 400 4.5 125 -40 ~ +85 -40 ~ +100 10,000V HBM Unit mA W C C C - *Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter.(25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC [7] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink Rev. 00 October. 2009 6 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative Spectral Power Distribution Relative Spectral Power Distribution Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Color Spectrum, TA=25C 1. Pure White 1.0 Standard eye response curve 0.8 0.6 0.4 0.2 0.0 300 2. Warm White 400 500 600 700 800 Wavelength (nm) 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength (nm) Rev. 00 October. 2009 7 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative Spectral Power Distribution Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 3. Natural White 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength (nm) Rev. 00 October. 2009 8 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative Light Output [%] Forwrd Voltage(Vf) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics 1. Relative Light Output vs. Junction Temperature at IF=350mA 160 140 120 100 80 60 40 20 0 25 Pure White Warm White & Natural White 50 75 100 o 125 Junction Temperature, TJ [ C] 2. Forward Voltage Shift vs. Junction Temperature at IF=350mA 0.0 Pure White & Warm white & Natural White -0.2 -0.4 -0.6 -0.8 -1.0 25 50 75 100 o 125 Junction Temperature, TJ [ C] 9 Rev. 00 October. 2009 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Average Forward Current [mA] Relative Lumious Flux(a.U) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics 1. Forward Voltage vs. Forward Current , TA=25 c 700 600 500 400 300 200 100 0 Pure White & Warm White & Natural White 0 2 4 6 8 10 12 Forward Voltage [V] 2. Forward Current vs. Normalized Relative Luminous Flux, TA=25 c 1.5 Pure White & Warm White & Natural White 1.0 0.5 0.0 0 100 200 300 400 Forward Current [mA] 10 Rev. 00 October. 2009 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Current [mA] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs Allowable Forward Current 1-1. Pure White, Warm White, Natural White (TJMAX = 125 C, @350mA) 400 350 300 250 200 150 100 50 0 RjaT = 15 C/W RjaT = 10 C/W o o 0 25 50 75 100 o 125 150 Ambient Temperature [ C] Rev. 00 October. 2009 11 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative luminous flux Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Typical Dome Type Radiation pattern 1. Pure White, Warm White, Natura White 0 1.0 30 0.8 0.6 60 0.4 0.2 0.0 -80 -60 -40 -20 0 90 Angle(deg.) Rev. 00 October. 2009 12 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 150 ~ Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 3. Reflow Soldering Conditions / Profile 260 240 220 200 Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 180 Pre-heating Rising 5 C/sec Cooling -5 C/sec 0 Time [Hr] 4. Hand Soldering conditions Lead : Not more than 3 seconds @MAX280 Slug : Use a thermal-adhesives * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones. Rev. 00 October. 2009 13 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Emitter Type Reel Packaging Note : 1. The number of loaded products in the reel is 500ea 2. All dimensions are in millimeters (tolerance : 0.2 ) 3. Scale none *The appearance and specifications of the product may be changed for improvement without notice. Rev. 00 October. 2009 14 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Packaging Structure Aluminum Vinyl Bag PART NO. : ######-## QUANTITY : *** LOT NUMBER : #######-####### BIN CODE : ####### Outer Box TYPE SIZE(mm) a c b 350 350 370 c ZLED ZLED PART : XZ20360-** PO CODE : ## Q'YT : ###### LOT NO : YMDD-##### DATE : ###### b a SEOUL SEMICONDUCTOR CO.,LTD Note : 1. 6~10 reels are loaded in box 2. Scale none 3. For more information about binning and labeling, refer to the Application Note - 1 Rev. 00 October. 2009 15 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet precaution for use * Storage To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box (or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30 degrees Centigrade. Humidity 50% maximum. * Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40 Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 605 * Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. * Please avoid rapid cooling after soldering. * Components should not be mounted on warped direction of PCB. * Anti radioactive ray design is not considered for the products listed here in. * Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. * This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. * When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. * LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. * The appearance and specifications of the product may be modified for improvement without notice. * Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. * The slug is connected to the anode. Therefore, we recommend to isolate the heat sink. * Attaching LEDs, don't use adhesives to generate organic vapor. Rev. 00 October. 2009 www.ZLED.com 16 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED's reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the Rev. 00 LED. October. 2009 17 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) |
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