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| Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Specification HBFR113-S SSC Drawn Approval CUSTOMER Approval Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 1. 2. 3. 4. 5. 6. 7. 8. 9. Packing Soldering CONTENTS Absolute Maximum Ratings Electro Characteristics Outline Dimension Electro-Optical characteristic Diagram Rank division Reliability tests Precaution for use Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet - HBFR113-S Description HBFR113-S Features * 1.6(W) X 0.8(D)X 0.5(T)mm Emitted Color : Red/Blue Red: 625 nm Blue: 470 nm Small size suitable for compact appliances. Surface-mounted chip LED device. Pb-free and RoHS complaint component. Tape and Reel packing. Increases the life time of battery. * * Applications * Cellular phone's keypad lightning * * * Other decoration lighting Information Boards Lighting for Small Size Device. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 1. Absolute maximum ratings (Ta=25) Parameter Power Dissipation Symbol Pd IF IFM *1 VR Topr. Tstg. Blue Red Blue Red Blue Red Value 66 72 20 30 50 60 5 -30 ~ 85 -40 ~ 100 Unit mW Forward Current mA Peak Forward Current Reverse Voltage Operation Temperature Storage Temperature mA V *1 IFM conditions: Pulse width Tw0.1ms and Duty ratio1/10. 2. Electro-Optical Characteristics (Ta=25) ParameterForward Voltage Symbol VF IR IV Condition IF=5 VR=5V IF=5 Color Blue Red Blue Red Blue Red Blue Min 2.6 Typ 2.9 Max 3.3 2.4 10 Unit V Reverse Current 15 20 462 615 - 22 30 470 625 120 120 10 475 635 - Luminous Intensity*2 Dominant Wavelength Viewing Angle*3 mcd nm D 21/2 IF=5 Red Blue Red IF=5 *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. Rev. (Tolerance : Iv 10 %, D 2 nm, VF 0.1 V) 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 0.95 1.0 1.0 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 3.Outline Dimension ( Tolerance: 0.1, Unit: mm ) Blue Red - Recommended Soldering Design * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS BT Resin Epoxy Resin Au Plating Copper Alloy Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current IF(mA) Intensity IV[mcd] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Electro-Optical characteristic Diagram Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) 100 Red 10 Blue 1 0.1 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 Forward Voltage VF(V) Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 200 180 160 140 120 100 80 60 40 20 0 0 5 10 15 20 25 30 Red Blue Forwa rd C urre nt IF (m A) Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Forward current IF[mA] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs. Allowable Forward Current (per die) 40 35 30 25 20 15 10 5 0 -25 0 25 50 o 75 100 Ambient temperature Ta[ C] Radiation Diagram (Ta=25 OC ) Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5. Rank Division (IF=5mA) VF[V] Iv[mcd] (IF=5mA) WLD[nm] (IF=5mA) Bin Blue RED Blue RED Blue RED 615~635 (B) 2.7~2.9(B) 20~50 (B) 15~40 (B) 465~470 (B) 470~475 (C) 465~470 (B) 470~475 (C) 465~470 (B) 470~475 (C) 01 02 03 04 05 06 1.70~2.40 (B) 2.9~3.1(C) 20~50 (B) 15~40 (B) 615~635 (B) 3.1~3.3 (D) 20~50 (B) 15~40 (B) 615~635 (B) Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Reliability Tests Item Condition Note Flailed Pass On-Off Operating Life of High Humidity Heat 10mA, 2s, On/Off 60, 90%RH 8585%24hrs => Reflow 3 times(Max26010sec)=> thermal shock 100,000cycle 0/22 O.K Reflow Test 500 hr 0/22 O.K < Judging Criteria For Reliability Tests > Item Criteria for Judgment < Initial * 0.5 < Initial 0.1V Iv Vf Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 4.0 0.5 0.95 (2.75) Tolerance: 0.2, Unit: (1) Quantity: 4,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be 0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev. 00 60 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 7. Packing 4.0 1.5 1.75 2.0 0.2 1.85 3.5 8.0 0.5 180 11.4 9 2 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Reel Packing Structure Reel P/N : # # # # # # # # # # ## SSC-HBFR113-S Lot N o ######### : 4000 Aluminum Vinyl Bag P/N : # # # # # # # # # # ## SSC-HBFR113-S L ot N o ######### : 4000 Outer Box *Material: Paper(SW3B(B)) a 7inch 245 TYPE SIZE(mm) c b 220 142 c CHIP LED TUV MADE IN KOREA Acriche RoHS Semiconductor EcoLight PART : SSC-HBFR113-S CODE : Q'YT : 40,000EA LOT NO : DATE : SEOUL SEMICONDUCTOR CO.,LTD b a Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 8. Soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150 120 sec. Max. 240 Max. 2.5~5 C / sec. 2.5~5 o C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. 10 sec. Max. (2) Lead-Free Solder Lead-frame Solder Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200 120 sec. Max. 260 Max. 1~5 o C / sec. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. 10 sec. Max. (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280C under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don't guarantee the products. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 9. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 605C. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) |
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