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| TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com Approval Sheet For Product Specification Issued Date: 2/27/2007 (REV. NO: 1) Product Name: SMD 3.2x2.5 40.0MHz VCTCXO TST Parts No.: TX0225A Customer Parts No.: Company: Division: Approved by: Date: Checked by: Approval by: Date: CC Hsu Robert Chang 2/27/2007 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document FR-71S03-01 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com SMD 3.2x2.5 40.0MHz VCTCXO MODEL NO.: TX0225A REV. NO.: 1 RoHS Compliant Lead free Lead-free soldering Features: Ultra Miniature SMD Package Good Frequency Stability Good Phase Noise Response Description and Applications: Surface mount 3.2mmx2.5mm VCTCXO for use in wireless communications devices Electrical Specifications: TX0225A Nominal Frequency, Fo Storage Temperature Range Operating Temperature Range Power Supply Voltage, Vdd Output Voltage with Load 10pF//10K, Vout Output Waveform Power Supply Current, Icc Control Voltage, Vcon DC Terminal Input Impedance Frequency Tolerance (Vcon=1.4V) as received Frequency Stability a. Vs. Temperature (-30~85C) b. Vs. Load varied 10pF//10K+/-10% c. Vs. Supply Voltage varied 2.8+/-.2V Aging After reflow Vcon Frequency Control Range (1.4+/-1.0 V) Start Up Time (90% of final RF level in Vp-p) Harmonics SSB Phase Noise (@1KHz Carrier Offset) Specifications 40.000000 MHz -40C to +85C -30C to +85C 2.8 V 0.8 Vp-p min Clipped Sinewave 2.0 mA max 1.4 +/- 1.0 V 100K ohms min +/- 1.0 ppm max @ 25C +/- 3C +/- 2.0 ppm +/- 0.2 ppm +/- 0.3ppm +/- 1 ppm/ year +/- 1 ppm/ 2 times +/-10 ppm min. 2.0 msec max. -5.0 dBc max -130 dBc/Hz max TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 2 Mechanical Dimensions (mm): Marking: Line 1: Customer Frequency (40.00) Line 2: TST Logo + Crystal Product Code + Date Code+ A Product Code Table Year Product Code 2001 2005 X 2002 2006 x 2003 2007 X 2004 2008 x Date Code Table WK01 A WK14 N WK27 a WK40 n WK02 B WK15 O WK28 b WK41 o WK03 C WK16 P WK29 c WK42 p WK04 D WK17 Q WK30 d WK43 q WK05 E WK18 R WK31 e WK44 r WK06 F WK19 S WK32 f WK45 s WK07 G WK20 T WK33 g WK46 t WK08 H WK21 U WK34 h WK47 u WK09 I WK22 V WK35 i WK48 v WK10 J WK23 W WK36 j WK49 w WK11 K WK24 X WK37 k WK50 x WK12 L WK25 Y WK38 l WK51 y WK13 M WK26 Z WK39 m WK52 z TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 Recommended Circuit Recommended Reflow Soldering Condition 300 250 200 150 100 50 0 0 60 120 180 Time (seconds) 240 300 360 Max peak temperature: 260 deg C Reflow Area Rising Area Preheat Area Forced Cooling Area Packing (mm): 1. Reel Dimension Temperature (deg C) A Dimensions Tolerance 180 B C D E 9.1 F 2.9 H 3.9 G T2 T1 T3 9.0 1.2 60 13.0 2.0 4.9 11.4 1.0 +1.0 0.2 0.5 0.5 0.5 0.5 0.5 1.0 0.3 0.1 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 2. Tape Dimension Unit: mm Dimension Tolerance A0 B0 W 8.00 F 3.5 0.05 E P0 P1 P2 2 0.05 D1 1.50 D 1.0 K0 1.75 t 0.25 0.02 2.80 3.71 1.75 4.00 4.00 0.1 0.1 0.1 0.1 0.1 +0.3/-0.1 +0.1/-0.00 +0.25/-0.00 0.1 Notes of the Usage: 1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec. 2. In the customer's reflow process, if it will remain some mechanical stress at the soldering terminals, also make some cracks on the soldering termination. Some cracks will cause open or short circuit and cause of thermal increasing or smoking. Don't make any excess mechanical stress to soldering points. 3. In case of giving a heavy shock to the products, it may make an open or short circuit and cause of thermal increasing and smoking. To avoid heavy shock impact applying to products is strictly required. Notes of the Storage: 1. To keep products under the condition at the room temperature (-5~35 deg C) with normal humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of characteristics and a short circuit. 2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas will make a cause of the open or short circuit. Keep it in the clean place where is not in dusty and no corrosive gas. 3. Use the unti-static material to the storage package. 4. Don't put any excess weight to the TCXO in the storage process. 5. Don't move the product from the cold place to the hot place in the short time, otherwise it may make some dew-drop, then a short circuit may happen in case. TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 6. Storage periods should be maximum 6 months under condition of above item 1 after delivery from TST factory. 7. Once open the bag, there is possibility of electrical characteristics deterioration due to absorption of moisture. So, please use parts within 7 days after opening the bag. 8. If you have to keep parts without using after opening the bag, please put the drying agent in the bag, fold the bag and keep it in the place where temperature and humidity are controlled (nitrogen atmosphere box etc.) TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 |
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