 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| IC264 Series (Open Top) Specifications Ball Grid Array (BGA, 1.50mm Pitch) Part Number (Details) 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 1 W max. at 10mA/20mV max. Operating Temperature Range: -40C to +150C 10,000 insertions min. Mating Cycles: 225 contact pins Pin Count: 25g to 35g per individual Contact Force: contact pin IC264 Series No. - 225 01 - 1 - ** - MF No. of Contact Pins Design Number NN: Without Positioning Pin #1, #2 NP: Without Positioning Pin #1, With Positioning Pin #2 PN: With Positioning Pin #1, Without Positioning Pin #2 Blank: With Positioning Pin #1, #2 MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Outline Socket Dimensions 56.00.1 50.0 25.0 4- AE2.8 (1.50.1)x14=21.00.15 57.0 37.60.1 4-R 3.0 Recommended PC Board Layout Matching IC Dimensions IC264-22501-1-**-** 56.00.05 4- AE2.8 +0.1 0 13.00.1 Top View from Socket 4- AE2.0 32.50.05 +0.1 0 2- 1.5x14=21.00.1 37.60.05 13.00.05 25.40.05 +0.1 0 1.50x14=21.00 27.00 0.2 225- AE0.6 +0.1 0 28.00.05 2- AE1.5 Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER 28.00.05 1.500.1 1.50.05 AE0.750.1 1.30~1.80 0.600.1 |
Price & Availability of IC264-22501-1
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |