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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Lead (Pb) free product and RoHS compliant. * Low power consumption. * High efficiency. * Versatile mounting on p.c. board or panel. * I.C. compatible/low current requirement. * Wide viewing angle.
Package Dimensions
Part No. LTL487TGT6
Lens Green Transparent
Source Color InGaN Green
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.0mm(.04") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice.
Part No. : LTL487TGT6 BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Absolute Maximum Ratings at TA=25 C
Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) DC Forward Current Reverse Voltage Operating Temperature Range Storage Temperature Range Lead Soldering Temperature [ 2 mm(.0787") From Body] 260C for 5 Seconds 100 30 5 -25C to + 80C -30C to + 100C mA mA V Maximum Rating 120 Unit mW
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Electrical / Optical Characteristics at TA=25 C
Parameter Symbol Min. 85 Typ. 160 Max. Unit Test Condition IF = 20mA Note 1,5 Note 2 (Fig.6)
Luminous Intensity
IV
mcd
Viewing Angle
21/2
120
deg
Dominant Wavelength
d
520
nm
Note 3
Spectral Line Half-Width
35
nm
Forward Voltage
VF
3.5
4.0
V
IF = 20mA
Reverse Current
IR
100
A
VR = 5V
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, d is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Iv classification code is marked on each packing bag. 5. The Iv guarantee should be added 15tolerance. 6. Precautions in handling: When soldering, leave 2mm of minimum clearance from the resin to the soldering point. Dipping the resin to solder must be avoided. Correcting the soldered position after soldering must be avoided. In soldering, do not apply any stress to the lead frame particularly when heated. When forming a lead, make sure not to apply any stress inside the resin. Lead forming must be done before soldering. It is necessary to cut the lead frame at normal temperature. 7. Caution in ESD: Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded.
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Typical Electrical / Optical Characteristics Curves
(25 C Ambient Temperature Unless Otherwise Noted)
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Packing Spec
1000, 500 or 250 pcs per packing bag
8 packing bags per inner carton total 8000 pcs per inner carton
8 Inner cartons per outer carton total 64000 pcs per outer carton In every shipping lot, only the last pack will be non-full packing
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Bin Table Specification
Luminous Intensity Bin Code E F G H J Min. 85 110 140 180 240 Unit : mcd @20mA Max. 110 140 180 240 310
Note: Tolerance of each bin limit is 15% Dominant Wavelength Bin Code G06 G07 G08 G09 G10 G11 G12 Min. 512.0 514.0 516.0 518.0 520.0 523.0 527.0 Unit : nm @20mA Max. 514.0 516.0 518.0 520.0 523.0 527.0 531.0
Note: Tolerance of each bin limit is 1nm
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon's Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature Soldering time 300C Max. 3 sec. Max. (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 100C Max. 60 sec. Max. 260C Max. 5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED
lamp product.
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs All devices, equipment, and machinery must be properly grounded Work tables, storage racks, etc. should be properly grounded Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Suggested checking list :
Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DSL? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file?
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
8. Reliability Test
Classification Test Item Test Condition
Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS) Ta= 655C RH= 90 95% Test Time= 240HRS2HRS Ta= 655C RH= 90 95% VR=5V Test Time = 500HRS (-24HRS, +48HRS) Ta= 1055C *Test Time= 1000HRS (-24HRS,+72HRS)
Reference Standard
MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) MIL-STD-202F: 103B(1980) JIS C 7021 : B-11(1982)
Operation Life
High Temperature High Humidity Storage
Endurance Test
High Temperature High Humidity Reverse BIAS High Temperature Storage
JIS C 7021 : B-11(1982)
MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982)
Low Temperature Storage
Ta= -555C *Test Time=1000HRS (-24HRS,+72HRS) 105C 25C -55C 25C 30mins 5mins 30mins 5mins 10 Cycles 105 5C -55C 5C 10mins 10mins 10 Cycles T.sol = 260C Max Dwell Time= 5 secs Max
JIS C 7021:B-12 (1982) MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021: A-4(1982) MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021: A-1(1982) MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) JIS C 7021: A-2(1982)
Temperature Cycling
Thermal Shock
Environmental Test
Solder Resistance
Solderability
T. sol = 230 5C Dwell Time= 5 1secs
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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