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| PCA9922 8-channel constant current LED driver with output error detection Rev. 01 -- 15 January 2009 Product data sheet 1. General description The PCA9922 is an 8-channel constant current LED driver designed for LED signage and display applications. The output current is adjustable from 15 mA to 60 mA controlled by an external series resistor. The outputs are controlled via a serial interface with a maximum clock frequency of 25 MHz to allow for the system requirement of high volume data transmission. Each of the 8 channel outputs has edge rate control to limit the change in current when the outputs are enabled or disabled. The device has built-in circuitry for detecting LED open-circuit and output short to ground. After signaling the specified error detect sequence on the input control lines, error status can be read out of the device via the serial data out. The device is designed such that it may be cascaded with other similar devices. The SDO pin contains the output of the shift register which may be used for cascading to the SDI pin of the next device in the series. SDO changes state on the falling edge of CLK. SDI captures data on the rising edge of CLK. The PCA9922 is a pin-to-pin functionally equivalent 5 V alternative (exception: error data is inverted; see Section 7.2.1, Section 7.2.2 and Section 7.2.7) for the ST2221A and STP08CDC596. The PCA9922 is available in DIP16, TSSOP16 and HVQFN20 packages and is specified over the -40 C to +85 C industrial temperature range. 2. Features I I I I I I I I I I I I 25 MHz serial interface 3.3 V to 5.5 V operation 8 LED low side constant current outputs Global control for the 8 LED outputs variable between 15 mA to 60 mA 15 mA to 60 mA maximum current for all 8 output channels set by an external resistor Constant current matching at 25 C, VDD = 5.0 V Bit-to-bit: 6 % Chip-to-chip: 10 % Gradual turn-on/turn-off output to limit EMI Error detection mode for line open, output short to ground, LED open and LED short -40 C to +85 C operation ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection I Packages offered: DIP16, TSSOP16, HVQFN20 3. Applications I I I I Full color, multi-color, monochrome LED signs LED billboard displays Traffic display signs Transportation and commercial LED signs 4. Ordering information Table 1. Ordering information Package Name PCA9922N PCA9922PW PCA9922BS DIP16 TSSOP16 HVQFN20 Description plastic dual in-line package; 16 leads (300 mil) plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm Version SOT38-4 SOT403-1 SOT662-1 Type number 4.1 Ordering options Table 2. PCA9922N PCA9922PW PCA9922BS Ordering options Topside mark PCA9922N PCA9922 P9922 Temperature range Tamb = -40 C to +85 C Tamb = -40 C to +85 C Tamb = -40 C to +85 C Type number PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 2 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 5. Block diagram LED0 LED1 LED7 VDD R_EXT VDD CURRENT REGULATOR ERROR DETECT PCA9922 OUTPUT ENABLE AUTO SHUTDOWN AND AUTO POWER-UP OE LE 8x DATA LATCH VSS SDI CLK ERROR CONTROL 002aad311 8x SHIFT REGISTER SDO VSS Fig 1. Block diagram of PCA9922 PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 3 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 6. Pinning information 6.1 Pinning VSS SDI CLK LE/DM1 LED0 LED1 LED2 LED3 1 2 3 4 16 VDD 15 R_EXT 14 SDO 13 OE/DM2 1 2 3 4 5 6 7 8 002aad163 VSS SDI CLK LE/DM1 16 VDD 15 R_EXT 14 SDO 13 OE/DM2 12 LED7 11 LED6 10 LED5 9 LED4 PCA9922N 5 6 7 8 002aad161 12 LED7 11 LED6 10 LED5 9 LED4 LED0 LED1 LED2 LED3 PCA9922PW Fig 2. Pin configuration for DIP16 Fig 3. 16 R_EXT Pin configuration for TSSOP16 terminal 1 index area CLK LE/DM1 LED0 LED1 LED2 1 2 3 4 5 LED4 10 6 7 8 9 17 VDD 19 VSS 20 SDI 18 n.c. 15 SDO 14 OE/DM2 PCA9922BS 13 LED7 12 LED6 11 LED5 n.c. n.c. LED3 n.c. 002aad349 Transparent top view Fig 4. Pin configuration for HVQFN20 PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 4 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 6.2 Pin description Table 3. Pin description I = input; O = output. Symbol Pin DIP16, TSSOP16 VSS SDI CLK LE/DM1 1 2 3 4 HVQFN20 19[1] 20 1 2 power supply I I I supply ground serial data in serial data clock used to shift data on SDI into the shift register latch enable with internal pull-down resistor; active HIGH signal used to capture data in the shift register to present to the outputs Detection Mode 1 LED0 LED1 LED2 LED3 LED4 LED5 LED6 LED7 OE/DM2 5 6 7 8 9 10 11 12 13 3 4 5 6 10 11 12 13 14 O O O O O O O O I constant current LED output driver 0 constant current LED output driver 1 constant current LED output driver 2 constant current LED output driver 3 constant current LED output driver 4 constant current LED output driver 5 constant current LED output driver 6 constant current LED output driver 7 output enable with internal pull-up resistor; active LOW signal used to allow data captured in the latch to be presented to the constant current outputs Detection Mode 2 SDO R_EXT VDD n.c. [1] Type Description 14 15 16 - 15 16 17 7, 8, 9, 18 O analog input power supply - serial data output external resistor input supply voltage not connected HVQFN20 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 5 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 7. Functional description The PCA9922 is an 8-channel constant current LED driver with built-in LED output error detection. The PCA9922 contains an 8-bit shift register and data latches, which convert serial input data into parallel output data. At the output stage, 8 regulated current sinks are designed to provide constant and uniform current through LEDs with different forward voltages (VF). Refer to Figure 1 "Block diagram of PCA9922". 7.1 System interface During normal operation, serial data can be transferred into the PCA9922 through SDI, shifted into the shift register, and out through the SDO. Data shifts from the SDI pin into the next sequential bit in the shift register on each rising edge of the CLK input. The MSB is the first bit to be clocked in. Data shifts out of the shift register and is presented on the SDO pin on the falling edge of CLK. The exception to this is during the error detect sequence, at which time the error status is loaded in a parallel fashion into the shift register. The shift register is never disabled. It is either shifting or it is loading the error status on every rising edge of CLK. Additionally, the device is designed such that it may be cascaded with other similar devices. The SDO pin contains the output of the shift register which may be used for cascading to the SDI pin of the next device in the series. Data is parallel loaded from the serial shift register to an output control register when LE (Latch Enable) is asserted HIGH (serial-to-parallel conversion). The output control register will continue to reflect the shift register data, even if changes occur in the shift register data, as long as LE is HIGH. When LE is LOW the latch is closed and changes in the shift register data no longer effect the output control register. Applications where the latches are bypassed (LE tied HIGH) will require that the OE input be HIGH during serial data entry. The data in the output control register is then used to drive the constant current output drivers when the outputs are enabled. The outputs are globally enabled or disabled through the OE. A LOW level on the OE will enable the output drivers, LED0 to LED7, to reflect the data contained in the output control register. An example timing diagram of expected normal operation of the device is shown in Figure 5. Remark: It is recommended that OE and LE pulse widths be at least two clocks wide when CLK is running to avoid inadvertent entry into the error detect modes. There is no synchronization logic in the design between CLK, LE and OE. It is the user's responsibility to meet the timing presented in Table 10 in order to guarantee proper operation. PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 6 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection CLK SDI LE OE LED0 LED1 LED2 LED3 LED4 LED5 LED6 LED7 002aad203 For each LEDn 0 is on, 1 is off. Fig 5. Normal function timing diagram 7.2 LED output error detection The PCA9922 has built-in circuitry for detecting LED open-circuit and output short conditions. A predefined set of signal sequence on the input control lines must be initiated to perform the output error detection. Once the error data is captured by this sequence, error status can be read out of the device via the serial interface. The error detection mode is entered by the user via specific timing sequences presented on the CLK, OE and LE pins. There are three key sequences to be generated by the user: enter error detect, capture faults, and exit error detect. It is the responsibility of the user to enable all outputs that the user wants to test during the error detect sequence. Performing an error mode detection sequence consists of several operations: 1. Entering error detect mode. 2. Setting all bits that you want to test by enabling all outputs to logical 1s in the output latch. 3. Capture fault data. 4. Exit error detect. 7.2.1 Open-circuit detection principle The LED open-circuit detection compares the effective current level IO with the open load detection threshold current Ith(det). If IO is below Ith(det), the PCA9922 detects an open-load condition. This error status can be read as an error status code in the error detect mode. For open-circuit error detection, a channel must be on. PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 7 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection Open-circuit detection Condition of output current IO = 0 mA IO < Ith(det)[1] IO Ith(det)[1] Error status code 0 1 channel n error status bit 0 Meaning detection not possible open circuit normal Table 4. State of output port off on [1] Ith(det) = 0.5 x IO (target) (typical). 7.2.2 Short-circuit detection principle The LED short-circuit detection compares the effective voltage level (VO) with the shorted-load detection threshold voltages Vth(det)sc and Vth(norm). If VO is above the Vth(det)sc threshold, the PCA9922 detects a shorted-load condition. If VO is below the Vth(norm) threshold, no error is detected or error bit is reset. This error status can be read as an error status code in the Special mode. For short-circuit error detection, a channel must be on. Table 5. Shorted-load detection Condition of output voltage IO = 0 mA VO Vth(det)sc VO < Vth(norm) Error status code 0 1 channel n error status bit 0 Meaning detection not possible short circuit normal State of output port off on 7.2.3 Entering error detect mode Entering the error detect mode consists of a 5-clock sequence involving CLK, OE and LE as shown in Figure 6. The user must meet the set-up and hold times for OE and LE as detailed inTable 10 to guarantee proper operation of the error detect circuitry. It should be noted that the act of driving LE HIGH around the rising edge of clock 4 opens the latch in the current control register block and data captured in the shift register at that point in time is moved into the output control register. It should also be noted that the output logic was enabled for a brief period of time while OE is LOW around the rising edge of clock 2. The outputs LED[7:0] will glitch during this period. CLK LE OE 002aad204 Fig 6. Timing for `Enter Error Detect Mode' command PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 8 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 7.2.4 Setting the outputs to test Before the Capture Fault sequence may be performed, the outputs must be set up. A logic HIGH must be sent to the output control register for all eight bits. This is done after the Enter Error Detect sequence is performed as a normal data load sequence as seen in Figure 5. Please note that this process is completely destructive to the data that is stored in the output control register (and the LED[7:0] pins). The output control register will have to be restored to its proper values by the user after the error detect sequence has been completed. 7.2.5 Capturing the fault/output error data The Capture Fault/Error Data sequence can only follow the Enter Error Detect sequence. If the Error Detect sequence has not occurred, this sequence will be treated as a normal operational sequence. Once the Capture Fault sequence has occurred, an Exit Error Detect sequence should be performed. There can be no more Capture Sequences until another Enter Error Detect sequence has occurred. The Capture Fault Sequence consists of holding OE LOW for no less than 3 clocks (CLK) and for a minimum of 2 s, whichever is longer. During this period of time, the shift register is being loaded with the fault status. As such, data presented to the device via SDI will not be captured. Bit 7 of the fault data will be present on SDO by the first falling edge CLK after the user de-asserts OE for this cycle. An error condition is output as a 1 (HIGH bit), and a 0 (LOW bit) designates a normal status. Timing for this sequence is shown in Figure 7. CLK LE OE OE = 1'b0 for minimum of 3 clocks or 2 s, whichever is longer SDO previous serial data fault data MSB resume shift with fault data 002aad205 Fig 7. Timing for `Capture Fault Mode' command PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 9 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 7.2.6 Exit error detect mode The `Exit error detect mode' sequence is used to exit the error detect mode of operation and resume normal mode. This is a 5-clock timing sequence using CLK, OE and LE. This sequence consists of LE being held inactive for all five clocks. OE is active in the second clock for one and only one clock. Figure 8 shows the timing for this sequence. CLK LE OE 002aad206 Fig 8. Timing for `Exit Error Detect Mode' command 7.2.7 Error detection data The PCA9922 will return a logical 1 for each output pin that has an error condition detected as described in Table 4 and Table 5. An error condition may be either an open circuit or short-circuit at the output pin. Once the Capture Fault sequence has completed, the resultant fault/output error data may be shifted out of the device by issuing 8 clocks and reading the data at the SDO pin. If more than one device is connected in series, then more than 8 clocks will be needed to shift all of the data from all of the devices through to the last SDO pin in the chain. Figure 9 shows a complete error detection sequence. PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 10 of 26 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Product data sheet Rev. 01 -- 15 January 2009 (c) NXP B.V. 2009. All rights reserved. PCA9922_1 NXP Semiconductors enter error detect command CLK SDI some number of optional clocks to clock in 1s for testing shift halted load fault command at least 8 clocks shift resumed exit error detect command 8-channel constant current LED driver with output error detection shift_reg[n-1:0] SDO previous serial data shifting out fault data fault data MSB this must be min. 2 s wide and 3 clocks minimum with output enable LOW OE LE fault_load fault_data[n-1:0] error_detect_mode 002aad208 fault_load goes LOW on this edge of OE fault data 8 bits PCA9922 11 of 26 Lower-case signal names are internal signals shown to aid understanding of timing. Fig 9. Timing for a complete error detection sequence NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 8. Application design-in information 5V C 10 F 3.3 V to 5.5 V LED0 LED1 LED2 LED3 LED7 VDD SDO to next stage R_EXT PCA9922 SDI CLK LE VSS OE MICROCONTROLLER PWM OR BLANKING INPUT SDO from last stage 002aad312 Fig 10. Typical application VLED = 3 V 4 V + VCE - scan OE CPU CLK LE SDI R_EXT VSS SDO R VDD PCA9922 LED0 LED7 VO VI OE CLK LE SDI R_EXT VSS SDO PCA9922 LED0 LED7 VO VI 002aad504 Fig 11. The PCA9922 in a typical multi-device architecture PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 12 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 9. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD VO(LED) VO(SDO) VI ISS IO(LEDn) fclk Tstg Tj Ptot Parameter supply voltage LED output voltage output voltage on pin SDO input voltage ground supply current output current on pin LEDn clock frequency storage temperature junction temperature total power dissipation Tamb = 25 C DIP16 TSSOP16 HVQFN20 1.12 0.625 3.125 W W W operating pins LED0 to LED7 Conditions Min -0.5 -0.5 -0.5 -0.4 -65 -40 Max +6.0 +6.0 +6.0 VDD + 0.4 485 60 25 +150 +125 Unit V V V V mA mA MHz C C 10. Recommended operating conditions Table 7. Symbol VDD VO(LED) Operating conditions Parameter supply voltage LED output voltage pins LED0 to LED7 inactive output active IO(LEDn) VO(SDO) Ptot output current on pin LEDn output voltage on pin SDO total power dissipation Tamb = 85 C DIP16 TSSOP16 HVQFN20 Toper operating temperature -40 0.44 0.25 1.25 +85 W W W C 15 5.5 2.2 60 5.5 V V mA V Conditions Min 3.3 Max 5.5 Unit V 11. Thermal characteristics Table 8. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions DIP16 TSSOP16 HVQFN20 Typ 89 160 32 Unit C/W C/W C/W PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 13 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 12. Static characteristics Table 9. Static characteristics VDD = 5.0 V; Tamb = 25 C; unless otherwise specified. Symbol Vth(det)sc Parameter short-circuit detection threshold voltage normal mode threshold voltage Conditions for short-error detection; IO (target) = 5 mA to 120 mA for short-error detection; IO (target) = 5 mA to 120 mA [1] Min 2.4 Typ 2.5 Max 2.6 Unit V Vth(norm) 2.3 - - V Control interface (OE, LE, CLK, SDI, SDO) VIH VIL VOL VOH ILI Ci RPU Rpd IOL IOL HIGH-level input voltage LOW-level input voltage LOW-level output voltage HIGH-level output voltage input leakage current input capacitance pull-up resistance pull-down resistance LOW-level output current LOW-level output current variation IOL = 1 mA IOL = -1 mA VI = VDD or VSS (CLK, SDI) VI = VDD or 0 V OE pin LE pin VO = 0.7 V; Rext = 910 VO = 0.7 V; Rext = 470 between bits VO = 0.7 V; Rext = 910 VO = 0.7 V; Rext = 470 IDD supply current Rext = open; LED[7:0] = off Rext = 910 ; LED[7:0] = off Rext = 470 ; LED[7:0] = off Rext = 910 ; LED[7:0] = on Rext = 470 ; LED[7:0] = on [1] 0.7VDD -0.3 VDD - 0.4 -1 150 100 17.5 35.4 - 1.5 300 200 19.5 38.1 3.0 1.5 0.7 3.6 6.2 3.6 6.2 VDD + 0.3 0.3VDD 0.4 +1 5 600 400 21.7 40.8 7 4 1.05 6.0 9.0 6.0 9.0 V V V V A pF k k mA mA % % mA mA mA mA mA Current controlled outputs (LED[7:0]) OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to active LOW times for executing error detect sequences. PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 14 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 13. Dynamic characteristics Table 10. Symbol tw(LE) tw(OE) tsu(SDI) th(SDI) fCLK tw(CLKH) tw(CLKL) tPD(CLK-SDO) tsu(LE) tsu(OE) th(LE) th(OE) tPD(OE-LEDH) Dynamic characteristics Parameter LE pulse width OE pulse width SDI set-up time SDI hold time frequency on pin CLK clock duty cycle CLK HIGH pulse width CLK LOW pulse width propagation delay from CLK to SDO LE set-up time OE set-up time LE hold time OE hold time propagation delay from OE to LED HIGH propagation delay from OE to LED LOW propagation delay from LE HIGH to LED HIGH from LE to CLK from OE to CLK from CLK to LE from CLK to OE pins LED0 to LED7; VDD = 5.0 V; CL = 30 pF; RL = 15 ; VL = 1.9 V; IO = 20.7 mA; Rext = 910 pins LED0 to LED7; VDD = 5.0 V; CL = 30 pF; RL = 15 ; VL = 1.9 V; IO = 20.7 mA; Rext = 910 pins LED0 to LED7; VDD = 5.0 V; CL = 30 pF; RL = 15 ; VL = 1.9 V; IO = 20.7 mA; Rext = 910 ; OE = logic 0 pins LED0 to LED7; VDD = 5.0 V; CL = 30 pF; RL = 15 ; VL = 1.9 V; IO = 20.7 mA; Rext = 910 ; OE = logic 0 [3] [3] [3] [3] Conditions VDD = 3.3 V from SDI to CLK from CLK to SDI [1] [2] Min 10 200 5 5 0 16 16 20 20 5 5 - Typ 210 Max 25 10 - Unit ns ns ns ns MHz ns ns ns ns ns ns ns ns 50 to 50 60 to 40 % tPD(OE-LEDL) - 210 - ns tPD(LEH-LEDH) - 210 - ns tPD(LEH-LEDL) propagation delay from LE HIGH to LED LOW - 210 - ns tPD(CLKH-LEDH) propagation delay pins LED0 to LED7; VDD = 5.0 V; from CLK HIGH to LED HIGH CL = 30 pF; RL = 15 ; VL = 1.9 V; IO = 20.7 mA; Rext = 910 ; OE = logic 0; LE = logic 1 propagation delay pins LED0 to LED7; VDD = 5.0 V; from CLK HIGH to LED LOW CL = 30 pF; RL = 15 ; VL = 1.9 V; IO = 20.7 mA; Rext = 910 ; OE = logic 0; LE = logic 1 rise time pins LED0 to LED7; VDD = 5.0 V; CL = 30 pF; RL = 15 ; VL = 1.9 V; IO = 20.7 mA; Rext = 910 pins LED0 to LED7; VDD = 5.0 V; CL = 30 pF; RL = 15 ; VL = 1.9 V; IO = 20.7 mA; Rext = 910 ; OE = logic 0 - 210 - ns tPD(CLKH-LEDL) - 210 - ns tr - 175 - ns tf fall time - 190 - ns [1] Applies to normal device operation. This pulse width does not apply to active HIGH times for executing error detect sequences. PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 15 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection [2] [3] OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to active LOW times for executing error detect sequences. Timing required for signaling of error detection sequences. Not necessary for `normal' operation. fCLK tw(CLKH) CLK tsu(SDI) SDI 50 % tsu(OE) OE 50 % tsu(LE) LE 50 % th(LE) 50 % tPD(CLK-SDO) SDO 50 % 002aad209 tw(CLKL) 50 % th(SDI) 50 % th(OE) 50 % Fig 12. Timing 1 90 % LEDn tf 10 % 90 % 10 % tr 002aad210 Fig 13. LED[7:0] rise/fall timing PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 16 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection tw(OE) OE 50 % tPD(OE-LEDH) tPD(OE-LEDL) LEDn tw(LE) LE 50 % tPD(LEH-LEDH) tPD(LEH-LEDL) LEDn 50 % 50 % 50 % 50 % tPD(OE-LEDH) tPD(OE-LEDL) 50 % CLK 50 % tPD(CLKH-LEDH) tPD(CLKH-LEDL) 50 % LEDn 50 % 002aad211 Fig 14. Timing 2 PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 17 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 14. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 D seating plane ME A2 A L A1 c Z e b1 b 16 9 b2 MH wM (e 1) pin 1 index E 1 8 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.03 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 95-01-14 03-02-13 Fig 15. Package outline SOT38-4 (DIP16) PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 18 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 D E A X c y HE vMA Z 16 9 Q A2 pin 1 index A1 Lp L (A 3) A 1 e bp 8 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 16. Package outline SOT403-1 (TSSOP16) PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 19 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm SOT662-1 D B A terminal 1 index area E A A1 c detail X e1 e 6 L 11 b 10 vMCAB wMC y1 C C y 5 e Eh e2 1 15 terminal 1 index area 20 Dh 0 16 X 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.38 0.23 c 0.2 D(1) 5.1 4.9 Dh 3.25 2.95 E(1) 5.1 4.9 Eh 3.25 2.95 e 0.65 e1 2.6 e2 2.6 L 0.75 0.50 v 0.1 w 0.05 y 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT662-1 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22 Fig 17. Package outline SOT662-1 (HVQFN20) PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 20 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description". 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: * Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: * * * * * * Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 16.3 Wave soldering Key characteristics in wave soldering are: PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 21 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection * Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave * Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: * Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 18) than a SnPb process, thus reducing the process window * Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board * Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 11 and 12 Table 11. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 12. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220 Package thickness (mm) Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 18. PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 22 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description". 17. Soldering of through-hole mount packages 17.1 Introduction to soldering through-hole mount packages This text gives a very brief insight into wave, dip and manual soldering. Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 17.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 C and 400 C, contact may be up to 5 seconds. PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 23 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 17.4 Package related soldering information Table 13. Package CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP[2] [1] [2] Suitability of through-hole mount IC packages for dipping and wave soldering Soldering method Dipping suitable Wave suitable suitable[1] not suitable For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable. 18. Abbreviations Table 14. Acronym CDM EMI ESD HBM LED MM MSB PCB PWM Abbreviations Description Charged-Device Model ElectroMagnetic Interference ElectroStatic Discharge Human Body Model Light Emitting Diode Machine Model Most Significant Bit Printed-Circuit Board Pulse Width Modulator 19. Revision history Table 15. Revision history Release date 20090115 Data sheet status Product data sheet Change notice Supersedes Document ID PCA9922_1 PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 24 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 20. Legal information 20.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 20.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 20.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 20.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 21. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA9922_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 15 January 2009 25 of 26 NXP Semiconductors PCA9922 8-channel constant current LED driver with output error detection 22. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6 7.2.7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 17.1 17.2 17.3 17.4 18 19 20 20.1 20.2 20.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 System interface . . . . . . . . . . . . . . . . . . . . . . . . 6 LED output error detection . . . . . . . . . . . . . . . . 7 Open-circuit detection principle . . . . . . . . . . . . 7 Short-circuit detection principle . . . . . . . . . . . . 8 Entering error detect mode . . . . . . . . . . . . . . . . 8 Setting the outputs to test . . . . . . . . . . . . . . . . . 9 Capturing the fault/output error data. . . . . . . . . 9 Exit error detect mode . . . . . . . . . . . . . . . . . . 10 Error detection data . . . . . . . . . . . . . . . . . . . . 10 Application design-in information . . . . . . . . . 12 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Recommended operating conditions. . . . . . . 13 Thermal characteristics. . . . . . . . . . . . . . . . . . 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Handling information. . . . . . . . . . . . . . . . . . . . 21 Soldering of SMD packages . . . . . . . . . . . . . . 21 Introduction to soldering . . . . . . . . . . . . . . . . . 21 Wave and reflow soldering . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Soldering of through-hole mount packages . 23 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . 23 Soldering by dipping or by solder wave . . . . . 23 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 Package related soldering information . . . . . . 24 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 20.4 21 22 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information . . . . . . . . . . . . . . . . . . . . 25 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 January 2009 Document identifier: PCA9922_1 |
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