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IN74HC MX25V512 TM32F 33681C NJM2750 2005B 26000 D106X
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  Datasheet File OCR Text:
 ORANGE
1. 2. 2.1 2.2
Item No.: 190220
This specification applies to GaAsP / GaP LED Chips Structure Mesa structure Electrodes p-side (anode) n-side (cathode) Au alloy Au alloy
3.
Outlines (dimensions in microns) p-Electrode p-Diffusion
265
120 270
n-Epitaxy GaAsP n-Epitaxy GaAsP n-Substrate GaP
265
n-Electrode
Wire bond contacts can also be circular or square 4. Electrical and optical characteristics (T=25C)
Parameter
Forward voltage Reverse current Luminous intensity *
Symbol
VF IR IV
Conditions
IF = 20 mA VR = 5 V IF = 20 mA
min
typ
2,10
max
2,50 10
Unit
V A mcd nm
3,0
5,0
Peak wavelength P IF = 20 mA 635 * On request, wafers will be delivered according to luminous intensity classes Brightness measurement at OSA on gold plate 5. Packing Dice on adhesive film with 1) wire bond side on top 2) back contact on top 6. Labeling Type Lot No. IV typ min max Quantity
(c) 2004
OSA Opto Light GmbH Tel. +49-(0)30-65 76 26 83 Fax +49-(0)30-65 76 26 81 contact@osa-opto.com


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