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PIP213-12M
DC-to-DC converter power train
Rev. 01 -- 25 September 2007 Product data sheet
1. General description
The PIP213-12M is a fully optimized power train for high-current high-frequency synchronous buck DC-to-DC converter applications. The PIP213-12M replaces two power MOSFETs, a Schottky diode and a driver IC, resulting in a significant increase in power density. The integrated solution allows for optimization of individual components and greatly reduces the parasitics associated with conventional discrete solutions, resulting in higher system efficiencies at higher operating frequencies.
2. Features
I I I I I I I I I I I I I Input voltage range from 3.3 V to 16 V Output voltages from 0.8 V to 6 V Capable of up to 25 A maximum output current at 1 MHz Operating frequency up to 1 MHz Peak system efficiency > 85 % at 1 MHz Automatic Dead-time Reduction (ADR) for maximum efficiency Internal thermal shutdown Auxiliary 5 V output Power ready output flag Power sequencing functions Internal 6.5 V regulator for efficient gate drive Compatible with single and multi-phase Pulse Width Modulation (PWM) controllers Low-profile, surface-mounted package (8 mm x 8 mm x 0.85 mm)
3. Applications
I I I I High-current DC-to-DC point-of-load converters Small form-factor voltage regulator modules Microprocessor and memory voltage regulators Intel DriverMOS (DrMOS) compatible
NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
4. Ordering information
Table 1. Ordering information Package Name PIP213-12M HVQFN56 Description plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm Version SOT684-4 Type number
5. Block diagram
CBP 5 CBN VDDO 10 8, 11 to 20
PIP213-12M
VDDC VDDG_EN VDDG REG5V 4 2 3 54 5 V REG 5V 56 5V
30 k upper driver
6.5 V REG
INTERNAL 5 V REG
UVLO
BOOST SWITCH
VI
42 to 50 CONTROL LOGIC AND DEAD-TIME CONTROL VDDG
VO
OTP
DISABLE
55
PRDY
53
lower driver
1, 7, 51 VSSC signal ground power ground
22 to 41 VSSO
003aac025
A bootstrap switch is integrated into the design of the PIP213-12M between VDDC and CBN
Fig 1. Block diagram
PIP213-12M_1
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Product data sheet
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6. Functional diagram
conversion supply control circuit supply
VDDG REG5V PWM input VI
VDDC
VDDO
100 nF
CBP
PIP213-12M
CBN
Lo(ext)
DISABLE VSSC signal ground VSSO
VO
output
Co(ext)
power ground
003aac027
Fig 2. Simplified functional block diagram of a synchronous DC-to-DC converter output stage
7. Pinning information
7.1 Pinning
55 DISABLE
54 REG5V
53 PRDY
51 VSSC
50 VO
49 VO
48 VO
47 VO
46 VO
45 VO
44 VO
terminal 1 index area VSSC VDDG_EN VDDG VDDC CBP n.c VSSC VDDO n.c. 1 2 3 4 5 6 7 8 9
43 VO 42 VO 41 VSSO 40 VSSO 39 VSSO 38 VSSO 37 VSSO 36 VSSO 35 VSSO 34 VSSO 33 VSSO 32 VSSO 31 VSSO 30 VSSO 29 VSSO VSSO 28
003aac026
VSSC PAD 1
52 n.c
56 VI
PIP213-12M
VO PAD 3 VDDO PAD 2
CBN 10 VDDO 11 VDDO 12 VDDO 13 VDDO 14 VDDO 15 VDDO 16
VDDO 17
VDDO 18
VDDO 19
VDDO 20
VO_SENSE 21
VSSO 22
VSSO 23
VSSO 24
VSSO 25
VSSO 26
Transparent top view
Fig 3. Pin configuration
PIP213-12M_1
VSSO 27
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Product data sheet
Rev. 01 -- 25 September 2007
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PIP213-12M
DC-to-DC converter powertrain
7.2 Pin description
Table 2. Symbol VDDC VDDO VSSC VSSO VI VO VO_SENSE CBP CBN VDDG_EN VDDG PRDY REG5V DISABLE n.c. Pin description Pin 4 8, 11 to 20, pad 2 1, 7, 51, pad 1 22 to 41 56 42 to 50, pad 3 21 5 10 2 3 53 54 55 6, 9, 52 Type I I O O I O O I/O Description control circuit supply voltage output stage supply voltage control circuit ground output stage ground supply voltage pulse width modulation input output voltage sense connection to VO often required for remote current sensing connection to bootstrap capacitor connection to bootstrap capacitor enables internal 6.5 V regulator for VDDG gate driver supply voltage indicates that VDDC is above the UVLO (UnderVoltage Lockout) level (open drain) 5 V regulated supply output disable driver function (active LOW) not connected - leave open or connected to GND on PCB (Printed-Circuit Board) layout
8. Functional description
8.1 Basic operation
The PIP213-12M combines two MOSFET's and a MOSFET driver in a thermally enhanced low inductance package for use in high frequency and high efficiency synchronous buck DC-to-DC converters; see Figure 2. The two MOSFETs are connected in a half bridge configuration between VDDO and VSSO. The mid point of the two transistors is VO which is connected to the output of DC-to-DC converter via an inductor. A logic HIGH signal on the VI pin causes the lower MOSFET to be switched off and the upper MOSFET to be switched on. Current will then flow from the supply (VDDO), through the upper MOSFET and the inductor (Lo(ext)) to the output. A logic LOW signal on the VI pin causes the upper MOSFET to be turned off and the lower MOSFET to be switched on. Current then flows from the power ground (VSSO), through the lower MOSFET and the inductor (Lo(ext)), to the output. The output voltage is determined by the ratio of the times that the upper and lower MOSFETs conduct.
8.2 UnderVoltage Lockout (UVLO)
The UVLO function ensures the correct operation of the control circuit during a power-up and power-down sequence. Power to the control circuit is provided by the VDDC pin. This voltage is internally monitored to ensure that if VDDC is below the UVLO threshold, the DISABLE pin is internally pulled LOW and both MOSFETs are off. This is indicated by the power ready (PRDY) flag, an open drain output that is pulled LOW whenever VDDC is below the UVLO threshold.
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Product data sheet
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8.3 Upper driver operation
The gate drive to the upper MOSFET is provided by a bootstrap capacitor (typically 100 nF) that is placed between the CBP and CBN pins. This capacitor is charged via an internal boost switch to a voltage within a few millivolts of VDDC up to a maximum of 12 V (this is to prevent excessive gate charge losses when VDDC > 12 V). The upper MOSFET will be switched according to PWM input once the boost capacitor voltage is above Vth(CBP-CBN) on. When ever the voltage is below Vth(CBP-CBN) off the upper MOSFET will remain off.
8.4 VDDG regulator
The gate drive voltage level to the lower MOSFET is set by the voltage on the VDDG pin. A 1 F capacitor must be connected between this pin and VSSC. For minimum power loss within the PIP213-12M, an external power supply of between 5 V and 12 V must be connected to this pin. The optimum value for this voltage is dependent on the application but in the majority of cases a 5 V supply is recommended; see Figure 11. In cases where the VDDG maximum voltage will not be exceeded, the VDDG pin can be connected to the VDDC pin and the VDDG capacitor can be omitted; see Figure 13. When VDDC is connected to a supply greater than 9 V, an internal 6.5 V regulator connected to VDDG can be used to provide the gate drive for the lower MOSFET; see Figure 12. The VDDG regulator is enabled by leaving the VDDG_EN pin open resulting in this pin being pulled internally to 5 V. If an external supply is to be connected to VDDG then the VDDG_EN pin must be pulled low by connecting to VSSC to disable the internal VDDG regulator.
Table 3. VDDG_EN Open circuit VSSC VDDG biasing VDDG internal 6.5 V regulator used (VDDC > 9 V) connection to external supply required
8.5 3-state function
If the input to VI from the PWM controller becomes high impedance, then the VI input is driven to 2.5 V by an internal voltage divider. A voltage on the VI pin that is in-between the VIH and VIL levels and present for longer than td(3-state), causes both MOSFETs to be turned off. Normal operation commences once the VI input is outside this window for longer than td(3-state).
8.6 Automatic Dead-time Reduction (ADR)
Protection against cross-conduction (shoot-through) is achieved via by a delay (or dead-time) between the switching off of one MOSFET and the switching on of the other MOSFET. The automatic dead-time reduction feature continuously monitors the body diode of the lower MOSFET adjusting the dead-time to minimize body diode conduction. This reduces power loss in both the upper and lower MOSFETs due to the reduction in body diode conduction and reverse recovery charge. The lower power dissipation leads to higher system efficiency and enables higher frequency operation.
PIP213-12M_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 September 2007
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DC-to-DC converter powertrain
8.7 Overtemperature Protection (OTP)
Protection against over temperature is provided by an internal thermal shutdown incorporated into the control circuit. When the control circuit die temperature exceeds the upper thermal trip level, both MOSFETs are switched off and the internal VDDG regulator disabled. This state continues until the die temperature falls below the lower trip temperature. This function is only operational when VDDC is above the UVLO level.
8.8 Disable
This is the disable or enable function of the driver. Pulling the DISABLE pin LOW switches off both MOSFETs and disables the REG5V output. This pin is internally pulled LOW whilst VDDC remains below the UVLO threshold. Once VDDC exceeds the UVLO threshold, this pin is pulled HIGH by an internal resistor. In this way the driver will enable itself unless there is an external pull down. In multiphase applications, connecting the DISABLE pins of multiple PIP213-12M devices together will ensure that all devices will only become enabled when the voltage on the VDDC pins of all of the devices has exceeded the UVLO threshold; see Figure 10.
8.9 Reg5V
This function provides a low current regulated 5 V output voltage suitable for providing power to a PWM controller. It is operational when both PRDY and DISABLE are HIGH. Operation as a 5 V power supply is only guaranteed when VDDC is > 7 V. This pin can also be used as part of an enable function for a PWM controller; this ensures that the PWM is enabled only when the PIP213-12M is fully operational (i.e. both PRDY and DISABLE are HIGH).
9. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDDC VDDO VI VDDG VO Vc(bs) IO(AV) IORM VPRDY VDISABLE VREG5V Ptot Tstg Tj
PIP213-12M_1
Parameter control circuit supply voltage output stage supply voltage input voltage gate driver supply voltage output voltage bootstrap capacitance voltage average output current repetitive peak output current voltage on pin PRDY voltage on pin DISABLE voltage on pin REG5V total power dissipation storage temperature junction temperature
Conditions
Min -0.5 -0.5 -0.5 -0.5 -0.5 -0.5
Max +15 +24 +12.6 +12.6 VO + 15 25 40 +12.6 +12.6 +12.6 21 10 +150 +150
Unit V V V V V A A V V V W W C C
6 of 21
VDDO + 0.5 V
VDDC = 12 V; Tpcb 90 C; fi = 1 MHz VDDC = 12 V; tp 10 s
[1]
-0.5 -0.5 -0.5
Tmb = 25 C Tmb = 90 C
[2]
-55 -55
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 September 2007
NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
[1] [2]
Pulse width and repetition rate limited by maximum value of Tj. Assumes a thermal resistance from junction to mounting base of 6 K/W.
10. Thermal characteristics
Table 5. Symbol Rth(j-mb) Thermal characteristics Parameter thermal resistance from junction to mounting base Conditions device tested with upper and lower MOSFETs in series Min Typ 3 Max 6 Unit K/W
PIP213-12M_1
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Product data sheet
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DC-to-DC converter powertrain
11. Characteristics
Table 6. Characteristics VDDC = 12 V; Tj = 25 C unless otherwise specified. Symbol VDDC Vth(UVLO) Parameter control circuit supply voltage Conditions 25 C Tj 150 C turn off Vth(CBP-CBN) threshold voltage between pin CBP and pin CBN VIH VIL ILI IDDC HIGH-level input voltage LOW-level input voltage input leakage current control circuit supply current 0 V VI 5 V fi = 0 Hz, VI = 0 V fi = 500 kHz, VDDG_EN = open fi = 500 kHz, VDDG_EN = ground VDDG VREG5V IREG5V Vth(en) Vth(dis) Ttrip(otp) Ttrip(otp)hys Ptot gate driver supply voltage voltage on pin REG5V current on pin REG5V enable threshold voltage disable threshold voltage over-temperature protection trip temperature hysteresis of over-temperature protection trip temperature total power dissipation VDDO = 12 V; IO(AV) = 20 A; VO = 1.3 V; Tpcb = 90 C; fi = 500 kHz fi = 1 MHz Upper MOSFET RDSon RDSon drain-source on-state resistance drain-source on-state resistance IO = 10 A; VCBP = 12 V IO = 10 A; VDDG = 12 V IO = 10 A; VDDG = 6.5 V Dynamic characteristics td(on)(IH-OH) td(off)(IL-OL) td(3-state)
[1]
Min 4.5 4.05 3.7 3.85 2.35
[1] [1]
Typ 12 4.2 3.9 4.1 2.6 3.5 1.5 180 8.2 40 12 6.5 5.0 3.2 1.6 160 40
Max 14 4.45 4.1 4.35 2.85 3.7 1.6 7.25 5.5 3.5 1.8 -
Unit V V V V V V V A mA mA mA V V mA V V C C
Static characteristics undervoltage lockout threshold voltage turn on turn on turn off
3.3 1.4 5.75 4.5 18 2.9 1.4 -
IL = 65 mA IL IREG5V minimum, VDDC > 7 V VREG5V = 4.5 V on pin DISABLE, VDDC > 4.5 V on pin DISABLE, VDDC > 4.5 V
-
4.7 5.5 6.5 3.8 4.5 90
80 75 -
W W m m m ns ns ns
Lower MOSFET
turn-on delay time from input HIGH to output HIGH turn-off delay time from input LOW to output LOW 3-state delay time
VDDO = 12 V; IO(AV) = 12.5 A
If the input voltage remains between VIH and VIL (2.5 V typ) for longer than td(3-state), then both MOSFETs are turned off.
PIP213-12M_1
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Product data sheet
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DC-to-DC converter powertrain
10 Ptot (W) 8
003aab957
1.3 a
003aab958
1.2 1 MHz 500 kHz 1.1 4
6
1 2
0 0 10 20 IO (A) 30
0.9 0 6 12 VDDO (V) 18
VDDC = 12 V; VDDO = 12 V; VO = 1.3 V; fi = 1 Mhz
VDDC = 12 V; VO = 1.3 V; fi = 1 MHz; IO(AV) = 20 A
P tot a = ---------------------------------------P tot ( V = 12 V)
DDO
Fig 4. Total power dissipation as a function of average output current; typical values
1.6 b
003aab959
Fig 5. Normalized power dissipation as a function of output stage supply voltage; typical values
1.2 c
003aab960
1.4 1
1.2
0.8 1
0.8 0 2 4 Vout (V) 6
0.6 200
400
600
800 f (kHz)
1000
VDDC = 12 V; VDDO = 12 V; fi = 1 MHz; IO(AV) = 20 A
VDDC = 12 V; VDDO = 12 V; VO = 1.3 V; IO(AV) = 20 A
P tot b = ----------------------------------P tot ( V = 1.3 V )
O
P tot c = -----------------------------------P tot ( f = 1 MHz )
i
Fig 6. Normalized power dissipation as a function of output voltage; typical values
Fig 7. Normalized power dissipation as a function of input frequency; typical values
PIP213-12M_1
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Product data sheet
Rev. 01 -- 25 September 2007
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PIP213-12M
DC-to-DC converter powertrain
1.2 d
003aab961
1.2 e
003aab962
1.1 1.1
1
1 0.9
0.8 6 8 10 12 VDDC (V) 14
0.9 4 6 8 10 VDDG (V) 12
VDDC = 12 V; VO = 1.3 V; fi = 1 MHz; IO(AV) = 20 A
VDDC = 12 V; VDDO = 12 V; f = 1 MHz; IO(AV) = 20 A
P tot d = ---------------------------------------P tot ( V = 12 V )
DDC
P tot e = -------------------------------------P tot ( V = 5 V)
DDG
Fig 8. Normalized power dissipation as a function of control circuit supply voltage; typical values
Fig 9. Normalized power dissipation as a function of gate driver supply voltage; typical values
PIP213-12M_1
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Product data sheet
Rev. 01 -- 25 September 2007
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12. Application information
12.1 Typical application
conversion supply control circuit supply
10 1 F 1 F
22 F (4x)
VDDG REG5V VI
100 nF
VDDC
VDDO CBP
100 nF
PIP213-12M CBN
VO VSSO VSSC
360 nH 100 F (2x)
DISABLE
10 1 F 1 F
22 F (4x)
VDDG REG5V VI
VDDC
VDDO CBP
100 nF
PIP213-12M CBN
VO VSSO VSSC
360 nH 100 F (2x)
DISABLE VCC PWM 1 PWM CONTROLLER PWM 1 PWM 1 PWM 1
10 1 F 1 F
22 F (4x)
VDDG REG5V VI
VDDC
VDDO CBP
100 nF
PIP213-12M CBN
VO VSSO VSSC
360 nH 100 F (2x)
DISABLE
10 1 F 1 F
22 F (4x)
signal ground power ground
VDDG REG5V VI
VDDC
VDDO CBP
100 nF
PIP213-12M CBN
VO VSSO VSSC
360 nH 100 F (2x)
DISABLE
voltage output
003aac028
Fig 10. Typical application circuit using the PIP213-12M in a four-phase converter
A typical four-phase buck converter is shown in Figure 10. This system uses four PIP213-12M devices to deliver a continuous output current of 100 A at an operating frequency of 500 kHz.
PIP213-12M_1
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Product data sheet
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12.2 VDDG supply options
The following options can be used for the lower MOSFET driver supply (VDDG).
conversion supply control circuit supply
5 V external gate drive
VDDG
VDDC
VDDO CBP
100 nF
PWM input
VI
PIP213-12M
CBN
Lo(ext)
VDDG_EN VSSC signal ground VSSO
VO
output
Co(ext)
power ground
003aac030
Fig 11. Dual supply operation using 5 V external supply for VDDG
conversion supply control circuit supply
VDDG
VDDC
VDDO CBP
100 nF
PWM input open circuit
VI
PIP213-12M
CBN
Lo(ext)
VDDG_EN VSSC signal ground VSSO
VO
output
Co(ext)
power ground
003aac031
Fig 12. Single supply operation using internal supply for VDDG
conversion supply control circuit supply
VDDG
VDDC
VDDO
100 nF
CBP PWM input VI
PIP213-12M
CBN
Lo(ext)
VDDG_EN VSSC signal ground VSSO
VO
output
Co(ext)
power ground
003aac029
Fig 13. Single supply operation using external supply for VDDG
12.3 DrMOS compatibility
The PIP213-12M can be configured to be compatible with the Intel DrMOS specification. Conformance to the Intel DrMOS specification requires that an external power supply to the VDDG pin is used and hence the internal VDDG regulator must be disabled by connecting the VDDG_EN pin to VSSC.
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Product data sheet
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The PRDY flag is not used and should be left unconnected on the PCB. The external boost capacitor should also be connected between CBP and VO and not CBP and CBN with the CBN pin being left unconnected on the PCB. In addition, VSSC pin 7 and VSSO pin 39 to pin 41 should be left unconnected on the PCB. Note that the sizes of PAD 1, PAD 2 and PAD 3 can vary between different DrMOS vendors. The PCB footprint must be modified to take the pinning modifications and pad size differences into account. To ensure footprint compatibility with other DrMOS products, it is recommended that the latest multiple vendor compatibility PCB footprint contained within the Intel DrMOS specification is used and that the relevant DrMOS product data sheet is checked for compatibility.
13. Marking
terminal 1 index area
TYPE No.
DIFFUSION LOT No.
RoHS compliant G = RoHS indicator Diffusion centre h = Hazel Grove, UK
Mask code N1I = Mask layout version
hfGYYWWN1I
Date code YY = last two digits of year WW = week number
03ai72
MANUFACTURING CODE COUNTRY OF ORIGIN
Assembly centre f = Amkor Korea
03ao89
TYPE No: PIP213-12M_NN (NN is revision number) DIFFUSION LOT No: 7 characters MANUFACTURING CODE; see Figure 15 COUNTRY OF ORIGIN: Korea
Fig 14. SOT684-4 marking
Fig 15. Interpretation of manufacturing code
PIP213-12M_1
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Product data sheet
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DC-to-DC converter powertrain
14. Package outline
HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm
SOT684-4
D D1
B A
terminal 1 index area A E1 E
A4 c A1
detail X
C e1 e 15 L 14
1/2 e
b 28 29
vMCAB wM C
y1 C
y
e Eh1
Eh
1/2 e
e2
Eh2
1 terminal 1 index area 56 Dh1 Dh2 43
42 X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 0.9 A1 0.05 0.00 A4 0.70 0.65 b 0.30 0.18 c 0.2 D 8.1 7.9 D1 7.8 7.7 D h1 2.65 2.35 D h2 3.55 3.25 E 8.1 7.9 E1 7.8 7.7 Eh 6.45 6.15 E h1 3.25 2.95 E h2 2.85 2.55 e 0.5 e1 6.5 e2 6.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT684-4
REFERENCES IEC --JEDEC MO-220 JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 03-10-23 04-09-14
Fig 16. Package outline SOT684-4 (HVQFN56)
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Product data sheet
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15. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
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Product data sheet
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15.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 17) than a PbSn process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 7 and 8
Table 7. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 8. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 17.
PIP213-12M_1
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Product data sheet
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temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 17. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
16. Mounting
16.1 PCB design guidelines
The terminals on the underside of the package are rectangular in shape with a rounded edge on the inside. Electrical connection between the package and the printed-circuit board is made by printing solder paste onto the PCB footprint followed by component placement and reflow soldering. The PCB footprint shown in Figure 18 is designed to form reliable solder joints. The use of solder resist between each solder land is recommended. PCB tracks should not be routed through the corner areas shown in Figure 18. This is because there is a small, exposed remnant of the lead frame in each corner of the package, left over from the cropping process. Good surface flatness of the PCB lands is desirable to ensure accuracy of placement after soldering. Printed-circuit boards that are finished with a roller tin process tend to leave small lumps of tin in the corners of each land. Levelling with a hot air knife improves flatness. Alternatively, an electro-less silver or silver immersion process produces completely flat PCB lands.
PIP213-12M_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 September 2007
17 of 21
NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
9.25 (2x) 8.30 (2x) 6.20 (2x) 0.475 1.40 0.30 0.50 0.25
1.60 0.45 7.04 (4x) 0.05 0.525
0.40
0.70 (3x)
e = 0.50 0.615 0.80 (2x) 1.90 0.50
0.29 (56x)
solder lands 0.425 7.20 (2x) 9.00 (2x) 0.50 2.00
001aaa064
Cu pattern 0.075 clearance 0.150 solder paste 0.025 placement area
occupied area
All dimensions in mm
Fig 18. PCB footprint for SOT684-4 package (reflow soldering)
16.2 Solder paste printing
The process of printing the solder paste requires care because of the fine pitch and small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The stencil apertures can be made the same size as the solder lands in Figure 18. The type of solder paste recommended for MLF (Micro Lead-Frame) packages is "No clean", Type 3, due to the difficulty of cleaning flux residues from beneath the MLF package.
PIP213-12M_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 September 2007
18 of 21
NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
17. Revision history
Table 9. Revision history Release date 20070925 Data sheet status Product data sheet Change notice Supersedes Document ID PIP213-12M_1
PIP213-12M_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 September 2007
19 of 21
NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
18. Legal information
18.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
18.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS -- is a trademark of NXP B.V.
19. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
PIP213-12M_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 25 September 2007
20 of 21
NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
20. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 9 10 11 12 12.1 12.2 12.3 13 14 15 15.1 15.2 15.3 15.4 16 16.1 16.2 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Basic operation . . . . . . . . . . . . . . . . . . . . . . . . . 4 UnderVoltage Lockout (UVLO) . . . . . . . . . . . . . 4 Upper driver operation . . . . . . . . . . . . . . . . . . . 5 VDDG regulator . . . . . . . . . . . . . . . . . . . . . . . . . 5 3-state function . . . . . . . . . . . . . . . . . . . . . . . . . 5 Automatic Dead-time Reduction (ADR) . . . . . . 5 Overtemperature Protection (OTP). . . . . . . . . . 6 Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Reg5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 11 Typical application. . . . . . . . . . . . . . . . . . . . . . 11 VDDG supply options . . . . . . . . . . . . . . . . . . . . 12 DrMOS compatibility . . . . . . . . . . . . . . . . . . . . 12 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Introduction to soldering . . . . . . . . . . . . . . . . . 15 Wave and reflow soldering . . . . . . . . . . . . . . . 15 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 PCB design guidelines . . . . . . . . . . . . . . . . . . 17 Solder paste printing. . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 September 2007 Document identifier: PIP213-12M_1

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