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 MMDL101T1 Schottky Barrier Diode
Schottky barrier diodes are designed primarily for high-efficiency UHF and VHF detector applications. Readily available to many other fast switching RF and digital applications.
Features
* Very Low Capacitance - Less than 1.0 pF @ 0 V * Low Noise Figure - 6.0 dB Typ @ 1.0 GHz * Pb-Free Package is Available
MAXIMUM RATINGS
Rating Reverse Voltage Symbol VR Value 7.0 Unit Vdc
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1.0 pF SCHOTTKY BARRIER DIODE
1 CATHODE 2 ANODE
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR-5 Board, (Note 1) @TA = 25C Derate above 25C Thermal Resistance, Junction-to-Ambient Junction and Storage Temperature Range Symbol PD 200 1.57 RqJA TJ, Tstg 635 -55 to +150 mW mW/C C/W C 1 PLASTIC SOD-323 CASE 477 STYLE 1 Max Unit 2
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR-5 Minimum Pad
MARKING DIAGRAM
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Reverse Breakdown Voltage (IR = 10 mA) Diode Capacitance (VR = 0, f = 1.0 MHZ), (Note 2)* Reverse Leakage (VR = 3.0 V) Noise Figure (f = 1.0 GHz), (Note 3)* Forward Voltage (IF = 10 mA) *Notes on Next Page Symbol V(BR)R 7.0 CT - IR - NF - VF - 0.5 0.6 6.0 - Vdc 20 250 dB 0.88 1.0 nAdc 10 - pF Min Typ Max Unit V
4M M G G
4M = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location.
ORDERING INFORMATION
Device MMDL101T1 MMDL101T1G Package SOD-323 SOD-323 (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2006
1
February, 2006 - Rev. 1
Publication Order Number: MMDL101T1/D
MMDL101T1
TYPICAL CHARACTERISTICS
1.0 0.7 0.5 IR, REVERSE LEAKAGE (m A) VR = 3.0 Vdc 0.2 0.1 0.07 0.05 100 IF, FORWARD CURRENT (mA)
10 TA = 85C TA = -40C
1.0 TA = 25C MMBD110T1
0.02 MMBD110T1 0.01 30 40 50 60 70 80 90 100 110 TA, AMBIENT TEMPERATURE (C) 120 130
0.1 0.3
0.4
0.5 0.6 VF, FORWARD VOLTAGE (VOLTS)
0.7
0.8
Figure 1. Reverse Leakage
Figure 2. Forward Voltage
1.0
11 10 NF, NOISE FIGURE (dB) LOCAL OSCILLATOR FREQUENCY = 1.0 GHz (Test Circuit Figure 5)
C, CAPACITANCE (pF)
0.9
9 8 7 6 5 4 3
0.8
0.7 MMBD110T1 0.6 0 1.0 2.0 3.0 VR, REVERSE VOLTAGE (VOLTS) 4.0
2 1 0.1 0.2
MMBD110T1 0.5 1.0 2.0 5.0 PLO, LOCAL OSCILLATOR POWER (mW) 10
Figure 3. Capacitance
Figure 4. Noise Figure
LOCAL OSCILLATOR
NOTES ON TESTING AND SPECIFICATIONS 2. CC and CT are measured using a capacitance bridge (Boonton Electronics Model 75A or equivalent). 3. Noise figure measured with diode under test in tuned diode mount using UHF noise source and local oscillator (LO) frequency of 1.0 GHz. The LO power is adjusted for 1.0 mW. IF amplifier NF = 1.5 dB, f = 30 MHz, see Figure 5.
UHF NOISE SOURCE H.P. 349A
DIODE IN TUNED MOUNT
NOISE FIGURE METER H.P. 342A
IF AMPLIFIER NF = 1.5 dB f = 30 MHz
Figure 5. Noise Figure Test Circuit
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2
MMDL101T1
PACKAGE DIMENSIONS
SOD-323 CASE 477-02 ISSUE G
HE D
b
1
2
E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70 STYLE 1: PIN 1. CATHODE 2. ANODE INCHES NOM MAX 0.035 0.040 0.002 0.004 0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105
A3 A L
NOTE 5
MIN 0.031 0.000
C
NOTE 3
A1
SOLDERING FOOTPRINT*
0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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3
MMDL101T1/D


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