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XC3202 Series Low Power Consumption Hall IC (Magnetic Sensor) ETR0412-005 GENERAL DESCRIPTION The XC3202 series is a Hall effect magnetic sensor IC with a built-in CMOS output driver. The device features low power consumption and small packaging which is ideally suited for battery powered portable applications such as mobile phones, electronic dictionaries and handheld game consoles. When the magnetic flux density (Omnipolar) is larger than the operating magnetic flux density (Bop), the CMOS output driver will be turned on (Detect Low). The output driver will be turned off (Release High) when the output is lower than the release magnetic flux density (Brp). APPLICATIONS Cover detector, Home security systems Mobile phones Electronic dictionaries Portable game consoles Home electronics (refrigerators, washing machines etc) FEATURES Supply Voltage Range Average Supply Current Operating Magnetic Flux Density Release Magnetic Flux Density Hysteresis Width Packages Environmentally Friendly : 2.4~5.5V : 8A : South Pole North Pole : South Pole North Pole : South Pole North Pole 3mT(TYP.) -3mT(TYP.) 2mT(TYP.) -2mT(TYP.) 1mT(TYP.) 1mT(TYP.) : SOT-23D QFN-0601 (under development) : EU RoHS Compliant, Pb Free TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE CHARACTERISTICS Supply Current (avg) vs. Ambient Temperature XC 3 2 0 2 A1 8 3 Average Supply Current : Idd(A) 40 VINr=.5.5V 3.0V 2.4V VDD 30 20 C XC3202 VSS VOUT OUTPUT 10 0 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta() * is a capacitor for noise reduction and input voltage stability. The recommended value is 10nF100nF 1/8 XC3202 Series PIN CONFIGURATION * QFN-0601 is under development. PIN ASSIGNMENT PIN NUMBER SOT-23D 1 2 3 QFN-0601 1 3 5 2,4,6 PIN NAME VDD VOUT VSS NC FUNCTION Power Input Output Pin Ground No Connection * QFN-0601 is under development. PRODUCT CLASSIFICATION Ordering Information XC3202-(*1) DESIGNATOR - DESCRIPTION Product Type Product No. Packages Taping Type (*2) SYMBOL A 183 MR-G ZR-G CMOS Output Based on the internal standard SOT-23D (Halogen & Antimony free) QFN-0601 (Halogen & Antimony free) (under development) DESCRIPTION * QFN-0601 is under development. (*1) (*2) The "-G" suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: R-, Reverse orientation: L-) 2/8 XC3202 Series BLOCK DIAGRAMS VDD Power switch Hall Plate Amp Latch Logical Hall Plate Amp Latch VOUT VSS ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage Magnetic Flux Density Operating Temperature Range Storage Temperature Range Power Dissipation SOT-23D QFN-0601 SYMBOL VDD B Topr Tstg Pd Tjc IOUT RATINGS 7 Unlimited -40+85 -55+150 150 under development 125 40 Ta=25 UNITS V mW mA Maximum Junction Temperature Maximum Output Current * This IC should be used within the stated absolute maximum ratings in order to prevent damage. OPERATING CONDITION PARAMETER Supply Voltage SYMBOL VDD CONDITONS Operating RATINGS 2.45.5 UNITS V CIRCUIT - ELECTRICAL CHARACTERISTICS PARAMETER On-state Output Voltage Supply Current Detection Time Detection Period Duty Cycle SYMBOL VOUT IDD (en) IDD (dis) IDD (avg) tawake tperiod DTY CONDITONS IOUT=1mA MIN. TYP. 0.1 3 5 8 75 75 0.1 MAX. 0.3 6 10 16 150 150 V Ta=25, VDD=3V UNITS CIRCUIT mA A A s ms % 3/8 XC3202 Series MAGNETIC CHARACTERISTCS PARAMETER Operating Magnetic Flux Density: South Pole Operating Magnetic Flux Density: North Pole Release Magnetic Flux Density: South Pole Release Magnetic Flux Density: North Pole Hysteresis Width SYMBOL Bops Bopn Brps Brpn Bhy(Bop-Brp) MIN. 2 -4 1 0.5 TYP. 3 -3 2 -2 1 O Ta=25 C, VDD=3V, 1mT=10Gauss MAX. 4 -2 -1 - UNITS mT mT mT mT mT CIRCUIT OPERATIONAL Operating by flux density Off-state Off-state Output Voltage Output Voltage On-state On-state Magnetic flux density (North Pole) Magnetic flux density (South Pole) Timing chart IDD tperiod Time IDD tperiod Time tawake Time tawake Time Time B Bop B Brp Time VOUT Hig h Low *1 VOUT Hig h Low *2 *1: When the magnetic flux density to the IC becomes larger than Bop, the IC goes into an on-state and outputs a low signal (VOUT=Low) at the leading edge of the next "tawake" pulse. *2: When the magnetic flux density to the IC becomes lower than Brp, the IC goes into an off-state and outputs a high signal (VOUT=High) at the leading edge of the next "tawake" pulse. During the other periods, the previous state is maintained. 4/8 XC3202 Series TEST CIRCUITS Circuit 1 1.VDD V 2.VSS A 3.VOUT Circuit 2 1.VDD 3.VOUT 2.VSS OSC OSC:Oscilloscope Circuit 3 Bcoil Vcoil 1.VDD 2.VSS 3.VOUT OSC OSC:Oscilloscope 5/8 XC3202 Series PACKAGING INFORMATION SOT-23D 3.00.1 0.4 +0.1 -0.05 Position of sensor 3 3 2.850.15 1.60.1 0.8 00.1 0.450.1 1 1.5 2 0.65 1 (1.9) 2 0.150.05 (0.95) 1.150.15 QFN-0601 (under development) Position of sensor 1.0mm 0.65mm 0.43mm 6/8 XC3202 Series SOT-23D MARKING RULE SOT-23D / QFN-0601 represents production number: standard / custom production MARK 2 PRODUCT SERIES XC3202****** 3 1 2 QFN0601 denotes production registered number: standard / custom production 1, ..., 9, A, ..., Z in order (G, I, J, O, Q, W are excluded) 1pin represents the last 1 digit of the manufacturing year: standard / custom production (e.g) MARK 9 0 YEAR 2009 2010 *QFN-0601 is under development represents manufacturing month: standard / custom production MANUFACTURING MONTH January February March April MANUFACTURING MONTH May June July August MANUFACTURING MONTH September October November December MARK A B C D MARK E F G H MARK J K L M denotes production lot number A, ..., Z, in order (G, I, J, O, Q, W are excluded) 7/8 XC3202 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 8/8 |
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