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FGA30N60LSD October 2008 FGA30N60LSD Features * Low saturation voltage: VCE(sat) =1.1V @ IC = 30A * High Input Impedance * Low Conduction Loss tm General Description The FGA30N60LSD is a MOS gated high voltage switching device combining the best features of MOSFETs and bipolar transistors.This device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. Applications * Solar Inverters * UPS, Welder C G E Absolute Maximum Ratings Symbol VCES VGES IC ICM (1) IFSM PD TJ Tstg TL Notes : (1) Repetitive rating : Pulse width limited by max. junction temperature Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current Collector Current Pulsed Collector Current Non-repetitive Peak Surge Current 60Hz Single Half-Sine Wave Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Maximum Lead Temp. for soldering Purposes, 1/8" from case for 5 seconds @ TC = 25C @ TC = 100C @ TC = 25C @ TC = 100C FGA30N60LSD 600 20 60 30 90 150 480 192 -55 to +150 -55 to +150 300 Units V V A A A A W W C C C Thermal Characteristics Symbol RJC(IGBT) RJC(Diode) RJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Typ. ---- Max. 0.26 0.92 40 Units C/W C/W C/W (c)2008 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FGA30N60LSD Rev. A FGA30N60LSD Package Marking and Ordering Information Device Marking FGA30N60LSD Device FGA30N60LSDTU Package TO-3PN Packaging Type Tube Max Qty Qty per Tube 30ea per Box - Electrical Characteristics of the IGBT Symbol Off Characteristics BVCES BVCES/ TJ ICES IGES Collector-Emitter Breakdown Voltage Temperature Coefficient of Breakdown Voltage Collector Cut-Off Current G-E Leakage Current TC = 25C unless otherwise noted Parameter Test Conditions Min. Typ. Max. Units VGE = 0V, IC = 250uA VGE = 0V, IC = 250uA VCE = VCES, VGE = 0V VGE = VGES, VCE = 0V 600 ---- -0.6 --- --250 250 V V/C uA nA On Characteristics VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage IC = 250uA, VCE = VGE IC = 30A, VGE = 15V IC = 30A, VGE = 15V, TC = 125C IC = 60 A, VGE = 15V Dynamic Characteristics Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz ---3550 245 90 ---pF pF pF 4.0 ---5.5 1.1 1.0 1.3 7.0 1.4 --V V V V Switching Characteristics td(on) tr td(off) tf Eon Eoff td(on) tr td(off) tf Eon Eoff Qg Qge Qgc Le Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Gate Charge Gate-Emitter Charge Gate-Collector Charge Internal Emitter Inductance VCE = 300 V, IC = 30A, VGE = 15V Measured 5mm from PKG VCC = 400 V, IC = 30A, RG =6.8, VGE = 15V, Inductive Load, TC = 125C VCC = 400 V, IC = 30A, RG = 6.8, VGE = 15V, Inductive Load, TC = 25C ----------------18 46 250 1.3 1.1 21 17 45 270 2.6 1.1 36 225 30 105 7 ---2.0 ------------ns ns ns us mJ mJ ns ns ns us mJ mJ nC nC nC nH 2 FGA30N60LSD Rev. A www.fairchildsemi.com FGA30N60LSD Electrical Characteristics of the Diode Parameter VFM IRM trr ta tb Qrr IF = 15A IF = 15A VR = 600V IF =1A, di/dt = 100A/s, VCC = 30V IF =15A, di/dt = 100A/s, VCC = 390V IF =15A, di/dt = 100A/s, VCC = 390V TC = 25C unless otherwise noted Conditions TC = 25 C TC = 125 C TC = 25 C TC = 25 C TC = 25 C TC = 25 C TC = 25 C TC = 25 C Min. - Typ. 1.8 1.6 18 13 27.5 Max 2.2 100 35 40 - Units V V A ns ns ns ns nC 3 FGA30N60LSD Rev. A www.fairchildsemi.com FGA30N60LSD Typical Performance Characteristics Figure 1.Typical Output Characteristics 90 TC = 25 C o Figure 2. Typical Saturation Voltage Characteristics 90 TC = 125 C o VGE = 20V VGE = 20V 15V 12V 10V 8V Collector Current, IC [A] 60 Collector Current, IC [A] 15V 12V 10V 8V 60 30 30 0 0 1 2 3 Collector-Emitter Voltage, VCE [V] 4 0 0 1 2 3 Collector-Emitter Voltage, VCE [V] 4 Figure 3. Typical Saturation Voltage Characteritics 90 Common Emitter VGE = 15V Figure 4. Transfer characteristics 90 Common Emitter VCE = 20V o o Collector Current, IC [A] 60 TC = 125 C o Collector Current, IC [A] TC = 25 C o TC = 25 C TC = 125 C 60 30 30 0 0 1 2 Collector-Emitter Voltage, VCE [V] 3 0 0 2 4 6 8 10 Gate-Emitter Voltage,VGE [V] 12 Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level 1.4 Collector-Emitter Voltage, VCE [V] Common Emitter VGE = 15V 60A Figure 6. Saturation Voltage vs. Vge 20 Common Emitter Collector-Emitter Voltage, VCE [V] 16 T = 25 C C o 1.2 12 1.0 30A 8 IC = 15A 0.8 4 30A IC = 15A 60A 0.6 25 0 50 75 100 125 o Collector-EmitterCase Temperature, TC [ C] 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 4 FGA30N60LSD Rev. A www.fairchildsemi.com FGA30N60LSD Typical Performance Characteristics Figure 7. Saturation Voltage vs. Vge 20 Collector-Emitter Voltage, VCE [V] Common Emitter TC = 125 C o (Continued) Figure 8. Capacitance characteristics 13000 10000 Cies 16 Capacitance [pF] 12 Coes Common Emitter VGE = 0V, f = 1MHz TC = 25 C o 1000 Cres 8 30A 60A 4 IC = 15A 100 50 0 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 0 5 10 15 20 25 Collector-Emitter Voltage, VCE [V] 30 Figure 9. Gate Charge Characteristics 15 Common Emitter IC = 30A Figure 10. SOA Characteeristics 300 Ic MAX (Pulsed) Gate-Emitter Voltage, VGE [V] Collector Current, Ic [A] o 12 TC = 25 C 100 Vcc = 100V 300V 200V 50s Ic MAX (Continuous) 100s 9 10 1ms 6 1 Single Nonrepetitive o 3 Pulse TC = 25 C Curves must be derated linearly with increase in temperature DC Operation 0 0 50 100 150 200 Gate Charge, Qg [nC] 250 0.1 0.1 1 10 100 1000 Collector-Emitter Voltage, VCE [V] Figure 11. Load Current Vs. Frequency 80 70 60 50 40 30 20 10 0 0.1 Duty cycle : 50% o Tc = 100 C Powe Dissipation = 192W Vcc = 400V load Current : peak of square wave Figure 12. Turn-On Characteristics vs. Gate Resistance 200 100 Switching Time [ns] Load Current [A] tr td(on) Common Emitter VCC = 400V, VGE = 15V IC = 30A TC = 25 C TC = 125 C o o 1 10 100 Frequency [kHz] 1000 10 0 10 20 30 40 50 Gate Resistance, RG [] 5 FGA30N60LSD Rev. A www.fairchildsemi.com FGA30N60LSD Typical Performance Characteristics Figure 13. Turn-Off Characteristics vs. Gate Resistance 3000 (Continued) Figure 14. Turn-On Characteristics vs. Collector Current 500 Common Emitter VGE = 15V, RG = 6.8 TC = 25 C o o Switching Time [ns] 1000 tf Switching Time [ns] TC = 125 C 100 tr td(off) Common Emitter VCC = 400V, VGE = 15V IC = 30A TC = 25 C o o td(on) 10 100 0 10 20 TC = 125 C 30 40 50 20 30 40 50 60 70 80 Gate Resistance, RG [] Collector Current, IC [A] Figure 15. Turn-Off Characteristics vs. Collector Current 6000 tf Figure 16. Switching Loss vs Gate Resistance 500 Common Emitter VCC = 400V, VGE = 15V IC = 30A Switching Time [ns] Switching Loss [mJ] o 100 TC = 25 C TC = 125 C o 1000 Common Emitter VGE = 15V, RG = 6.8 TC = 25 C td(off) TC = 125 C o o Eoff 10 Eon 100 20 30 40 50 60 70 80 Collector Current, IC [A] 1 5 10 15 20 25 30 35 40 45 50 Gate Resistance, RG [] Figure 17.Switching Loss vs Collector Current 100 Figure 18. Turn-Off Switching SOA Characteristics 200 100 Eoff 10 Eon Collector Current, IC [A] Switching Loss [mJ] 10 1 Common Emitter VGE = 15V, RG = 6.8 TC = 25 C TC = 125 C o o Safe Operating Area o VGE = 15V, TC = 125 C 0.1 10 1 20 30 40 50 60 70 80 1 Collector Current, IC [A] 10 100 1000 Collector-Emitter Voltage, VCE [V] 6 FGA30N60LSD Rev. A www.fairchildsemi.com FGA30N60LSD Figure 19. Transient Thermal Impedance of IGBT 1 0.5 Thermal Response [Zthjc] 0.1 0.2 0.1 0.05 0.01 0.02 PDM t1 t2 0.01 single pulse Duty Factor, D = t1/t2 Peak Tj = Pdm x Zthjc + TC 1E-3 1E-5 1E-4 1E-3 0.01 0.1 Rectangular Pulse Duration [sec] 1 10 Figure 20. Typical Forward Voltage Drop Figure 21. Typical Reverse Current 100 1E-4 FPRWARD CURRENT, IF [A] REVERSE CURRENT, IR [A] 1E-5 TC = 125 C o o 10 1E-6 TC=125 C o TC = 75 C 1E-7 1 TC=75 C o 1E-8 TC = 25 C o TC=25 C 0.1 0.0 o 1E-9 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 0 100 200 300 400 500 600 FORWARD VOLTAGE, VF [V] REVERSE VOLTAGE, VR [V] Figure 22. Typical Reverse Recovery Time 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 100 REVERSE RECOVERY TIME, trr [ns] IF = 15A TC = 125 C o TC = 75 C o TC = 25 C o 200 300 400 500 di/dt [A/s] 7 FGA30N60LSD Rev. A www.fairchildsemi.com FGA30N60LSD 8 FGA30N60LSD Rev. A www.fairchildsemi.com FGA30N60LSD TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and is not intended to be an exhaustive list of all such trademarks. Build it NowTM CorePLUSTM CorePOWERTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EfficentMaxTM EZSWITCHTM * TM (R) tm Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FlashWriter(R) * FPSTM F-PFSTM FRFET(R) Global Power ResourceSM Green FPSTM Green FPSTM e-SeriesTM GTOTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM MotionMaxTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R) (R) tm PDP SPMTM Power-SPMTM PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM Quiet SeriesTM RapidConfigureTM Saving our world, 1mW at a timeTM SmartMaxTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SuperMOSTM SyncFETTM (R) The Power Franchise(R) tm TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM UHC(R) Ultra FRFETTM UniFETTM VCXTM VisualMaxTM * EZSWITCHTM and FlashWriter(R) are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Farichild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Farichild strongly encourages customers to purchase Farichild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handing and storage and provide access to Farichild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Farichild is committed to committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative / In Design Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I35 Preliminary First Production No Identification Needed Obsolete Full Production Not In Production 9 FGA30N60LSD Rev. A www.fairchildsemi.com |
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