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SPECIFICATION
PART NO. : MT5150-UG 5.0mm ROUND LED LAMP
ATTENTION
OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES
MT5150-UG
Description
5.0 mm ROUND LED LAMP
This true green lamp is made with InGaN/Sapphire chip and water clear epoxy resin.
0.5 MAX.
1.5 TYP.
A
K
Notes: 1. All dimensions are in mm. 2. Tolerance is 0.25mm unless otherwise noted.
Description
LED Chip
Part No. Material MT5150-UG InGaN/Sapphire Emitting Color True green
24.0 MIN.
8.7
5.9
Lens Color
Water clear
VER.: 01 Date: 2007/03/22 Page: 1/5
MT5150-UG
Absolute Maximum Ratings at Ta=25
Parameter
Power Dissipation Reverse Voltage D.C. Forward Current Reverse (Leakage) Current Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature(1.6mm from body) Electrostatic discharge
5.0 mm ROUND LED LAMP
Symbol
PD VR If Ir If(Peak) Topr. Tstg. Tsol. ESD.
Rating
100 5 25 50 100 -40 to +95 -40 to +100 Dip Soldering : 260 Hand Soldering : 350 6000
Unit
mW V mA A mA
for 5 sec. for 3 sec. V
Electrical and Optical Characteristics:
Parameter
Luminous Intensity Forward Voltage Dominant Wavelength Reverse (Leakage) Current Viewing Angle Spectrum Line Halfwidth 2
Symbol
IV Vf d Ir 1/2
Condition
If=20mA If=20mA If=20mA Vr=5V If=20mA If=20mA
Min.
12000
Typ.
22000 3.2
Max.
Unit
mcd
4.0 535 50
V nm A deg nm
520
525
15 35
Notes:
The datas tested by IS tester. 2. Customer's special requirements are also welcome.
VER.: 01 Date: 2007/03/22 Page: 2/5
MT5150-UG
5.0 mm ROUND LED LAMP
Typical Electrical / Optical Characteristics Curves :
Relative Luminous Intensity(mcd)
2.4 2.8 3.2 3.6 4.0
50 40 30 20 10
50000 40000 30000 20000 10000 20.0
Forward Current IF(mA)
2.0
0.0
10.0
30.0
Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE
Forward Current (mA)
FORWARD CURRENT VS. LUMINOUS INTENSITY
50 40 30
1.0
0
10
20 30
Forward Current IF(mA)
40 50 60 70 80 90 0.5 0.3 0.1 0.2 0.4 0.6
20 10
R j-a=480
/W
0.9 0.8
0.7
0
20 40 60 Temperature ( )
80
100
FORWARD CURRENT VS. AMBIENT TEMPERATURE
RADIATION DIAGRAM
VER.: 01 Date: 2007/03/22 Page: 3/5
MT5150-UG
Specifications for Bin Grading: Iv(mcd) BIN Z1 Z2 Z3 MIN. 12000 16800 23500
5.0 mm ROUND LED LAMP
MAX. 16800 23500 32900
Specifications for Vf Group: Vf(V) Group V6 V7 V8 V9 V10 V11 V12 MIN. 2.6 2.8 3.0 3.2 3.4 3.6 3.8 MAX. 2.8 3.0 3.2 3.4 3.6 3.8 4.0
*Majority VF bins are highlighted in Yellow.
Specifications for Wavelength Group: D(nm) @20mA Group X7 X8 X9 MIN. 520 525 530 MAX. 525 530 535
VER.: 01 Date: 2007/03/22 Page: 4/5
MT5150-UG
5.0 mm ROUND LED LAMP
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 . At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) (2) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. Dip soldering : Pre-heat: 90 (3) 3. 4. max. (Backside of PCB), Within 60 seconds. (Solder temperature), Within 5 seconds. max. (Temperature of soldering iron tip), Within 3 seconds. Solder bath: 260 5 Hand soldering: 350
Insertion Pitch of the LED leads and pitch of mounting holes need to be same. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature.
VER.: 01 Date: 2007/03/22 Page: 5/5

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