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Combine Type Connector (for SD Memory Card, MultiMediaCardTM, Memory StickTM)
SCDB Series
Push-push type featuring contact protection function with less impact to media cards.
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module Structure Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial Contact resistance Initial Connector contacts Detection switch
Standard mount/Reverse mount Push-push type 25 to 60
Features
Applicable to three memory card standards - SD Memory Card, Multi Media CardTM and Memory StickTM. Push-push ejection mechanism applied in both card types. Contact point protection to minimize card damage during insertion and ejection. Same insertion and ejection position applied for both cards.
Applications
For desktop PCs, notebook PCs and personal digital assistants For home audio equipment (TVs and set top boxes) For audio systems For digital camcorders For digital still cameras For headphone players
Typical Specifications
Items Applicable media Mounting type Specifications
SD Memory Card, MultiMediaCardTM, Memory StickTM Surface mounting type
500V AC 1minute 1,000M 100m 500m min. max. max.
Performance
Insertion and removal cycle
10,000cycles SD Memory Card 12,000cycles Memory StickTM
Product Line
Media ejection structure
Push-push type Reverse mount
Mounting system
Standard mount
Feature
Standoff mm
0
Packing system
Product No.
SCDB1C0105
Drawing No.
1 2
With boss
Tray SCDB2A0200
38
Combine Type Connector(for SD Memory Card, MultiMediaCardTM, Memory StickTM) SCDB Series
Dimensions
No. Standard mount
32.2 31 4.5 No.!0 No.!9 0.65 No.!4 No.!3 No.!2 No.!1 No.!0 o1.5 32.3 27 13.5 1.5 16.6 14.15 5.525
Unit:mm
Style PC board mounting hole dimensions Viewed from the mounting face side
9 No.!5 No.!6 No.!7 No.!8 No.!9
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM
No.@1
10-1
46.15
No.@1: Card detect switch 18.7 35 Card lock position 8.05
6.25
No.@2 1.2 Over travel 28
11 13.45 11.65
10.65
2.9
No.@0
1.55 Hole 23.05 23.55 24.55 25.35
o2
17 19.2
o1.55 Positioning boss hole
28.5 20.8
18.5
1
No.@2:Common
For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM
7
6.95 5 No.@3:Ground No.8 Connector center Card eject travel No.9 Card center No.i No.u No.y No.t 9-1 16 2 8 29.6 33.2 No part mounting Land area No pattern area No.@0:Write protect detect switch No.o No.q No.w No.e No.r
Reverse mount
No.!9 31 No.!0
No.@1 No.@2
2-o1.5
No.!5 No.!6 No.!7 No.!8 No.!9
32.3 13.5(1.5G9) 10-1 16.6 14.15 5.525 No.!4 No.!3 No.!2 No.!1 No.!0
For CMOS Camera Module
16.4
4.1
46.15
35 Card inserting
19.7 18.85 17.3
Ground
No.5 12.6 12.3 No.@0
0.55
Over travel (1.2)
(5)
4.5
Card center Connector center 24.1 22.5 21.5
Card eject travel
2.85
2.25
1.55
(0.35)
No.4 Land area No part mounting
6-0.9
Ground No.9 No.1 No.2 No.3
1 4-0.9
No.4
28.6 25.5 24.2 22.9 21.6 20.3 19
(hole)
27 30.8 33.9
27 PC board surface
1.6 3.2 19.65 20.95 22.25 23.55 25.15 No.8 No.7 No.6 No.5 No.@0
2
7
6.4 8.2
o1 (h .55 ol e)
28
2
1.55
39
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition Reference
1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T . 3. Temperature profile Surface of products
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type
240 (max.) Temperature (C ) 230 (min.) 200 180 150 100 Time (s) Pre-heating 90 30 sec. 10 sec.(max.)
Room temperature
Heating time
For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
sec.
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.
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