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| MASW2000 GaAs SPDT Switch DC - 3.0 GHz Features * * * * Low Insertion Loss: 0.5 dB Typical @ 2 GHz Fast Switching Speed: 22 ns Typical Reflective/Absorptive Configuration Ultra Low DC Power Consumption Rev. V4 Pad Layout A1 B2 RF B1 A2 Description M/A-COM's MASW2000 is a use-configuratble, high isolation SPDT switch. It can be absorptive or reflective based on user requirements5. Designed on M/A-COM's mature 1-micron MESFET process, this parts is ideal for modules or other packaging for use in the Cellular, GPS, LAN and infrastructure markets. GND GND RF1 RL1 RL2 RF2 Ordering Information1 Part Number MASW2000 1. Die quantity varies. Package Die Bond Pad Dimensions Bond Pad RF RF1, RF2 A1, A2, B1, B2 GND1, GND2 Dimension Inches (mm) 0.004 x 0.004 (0.100 x 0.100) 0.009 x 0.009 (0.225 x 0.225) 0.004 x 0.004 (0.100 x 0.100) 0.009 x 0.004 (0.225 x 0.105) 0.004 x 0.005 (0.100 x 0.125) 0.056 x 0.056 x 0.010 (1.40 x 1.40 x 0.25) Absolute Maximum Ratings 2 Parameter Control Voltage (A1/B2 or A2/B1) Input RF Power Operating Temperature Storage Temperature RL1, RL2 DIE Size Absolute Maximum -8.5 VDC +34 dBm +175C -65C to +175C RL1 Schematic RF RL2 RF2 2. Exceeding any one or combination of these limits may cause permanent damage to this device. RF1 A1 B1 B2 A2 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2000 GaAs SPDT Switch DC - 3.0 GHz Electrical Specifications 3,4: TA = 25C, Z0 = 50, -55C to +85C Parameter Test Conditions DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 3.0 GHz DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 3.0 GHz DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 3.0 GHz DC - 2.0 GHz DC - 3.0 GHz 10% to 90% RF and 90% to 10% RF 50% control to 90% RF, and 50% control to 10% RF In-Band 0.05 GHz, 0/-5 V 0.5 - 3.0 GHz, 0/-5 V 0.05 GHz, 0/-8 V 0.5 - 3.0 GHz, 0/-8 V Two Tone, +5 dBm/Tone, 5 MHz Spacing, >50 MHz 0.05 GHz 0.5 - 3.0 GHz Two Tone, +5 dBm/Tone, 5 MHz Spacing, >50 MHz 0.05 GHz 0.5 - 3.0 GHz Rev. V4 Units dB dB dB dB dB dB dB dB Ratio Ratio Ratio Ratio Ratio Ratio ns ns mV dBm dBm dBm dBm dBm dBm dBm dBm Min. -- -- -- -- 43 35 27 24 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. -- -- -- -- -- -- -- -- -- -- -- -- -- -- 22 27 25 24 26 26 32 +63 +80 +43 +53 -- 60 -- Max. 0.5 0.6 0.8 1.0 -- -- -- -- 1.20:1 1.20:1 1.20:1 1.40:1 1.20:1 1.40:1 -- -- -- -- -- -- -- -- -- -- -- 5 -- 500 Insertion Loss Isolation Reflective VSWR 5 Absorptive VSWR 6 Trise, Tfall Ton, Toff Transients Input P1dB IP2 IIP3 3. 4. 5. 6. VIN Low 0 to -0.2 RF -- All specifications apply with 50-ohm impedance connected to allV ports, 0 and -5 VDC A control voltages. Control Voltage VIN A -- Loss changes 0.0025 dB/C (From -55C to +85C). High, -5 V (Complementary Logic) A -- V For reflective operation RL1/RL2 are unconnected.IN High, -8 V For absorptive operation RL1 connects to RF1 and RL2 connects to RF2. Handling Procedures Please observe the following precautions to avoid damage: Truth Table 7 Control Inputs A1/B2 A2/B1 VIN Low VIN Hi Condition of Switch RF1 On Off RF2 Off On Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 2 VIN Hi VIN Low 7. For normal SPDT operation A1 is connected to B2 and A2 is connected to B1. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2000 GaAs SPDT Switch DC - 3.0 GHz Typical Performance Curves Insertion Loss 2.0 Rev. V4 Isolation 100 Reflective Absorbtive 1.5 75 1.0 50 0.5 25 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) Frequency (GHz) VSWR 2.00 Input Output 1.75 1.50 1.25 1.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2000 GaAs SPDT Switch DC - 3.0 GHz Handling Procedures Permanent damage to the MASW2000 may occur if the following precautions are not adhered to: A. Cleanliness - The MASW2000 should be handled in a clean environment. DO NOT attempt to clean assembly after the MASW2000 is installed. B. Static Sensitivity - All die handling equipment and personnel should be DC grounded. C. Transients - Avoid instrument and power supply transients while bias is connected to the MASW2000. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply voltage to either control port A1/B2 or A2/B1 only when the other is grounded. Neither port should be allowed to "float". E. General Handling - It is recommended that the MASW2000 chip be handled along the long side of the die with a sharp pair of bend tweezers. DO NOT touch the surface of the chip with fingers or tweezers. Rev. V4 Bonding A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermosonic bonding with a nominal stage temperature of 150C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels necessary to achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended. Mounting The MASW2000 is back-metallized with Pd/Ni/Au (100/1,000/10,000A) metallization. It can be diemounted using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255C and a tool temperature of 265C. When hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290 C. B. DO NOT expose the MASW2000 to a temperature greater than 320C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MASW2000 into position. A thin epoxy fillet should be visible around the perimeter of the die. B. Cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy is recommended but is not required. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. |
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