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| AN1111R Features Package 3216 Reverse Mount type, Water clear epoxy Surface Mount IRED/Reverse Mount Type Product features Outer Dimension 3.2 x 1.6 x 1.1mm ( L x W x H ) Flat Lenz type Total Output Power : 2mW TYP. (IF=20mA) Reverse Mount type Lead-free soldering compatible RoHS compliant Peak Wavelength Half Intensity Angle Die materials Rank grouping parameter Assembly method Soldering methods 950nm 150 deg. GaAs Sorted by radiant intensity per rank taping Auto pick & place machine (Auto Mounter) Reflow soldering and manual soldering Please refer to Soldering Conditions about soldering. Taping and reel ESD 3,000pcs per reel in a 8mm width tape. (Standard) Reel diameter:180mm 2kV (HBM) Recommended Applications Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications 2007.8.31 Page 1 AN1111R Surface Mount IRED/Reverse Mount Type Absolute Maximum Ratings Item Power Dissipation Forward Current Pulse Forward Current Derating (Ta=25 or higher) Reverse Voltage Operating Temperature Storage Temperature 1 (Ta=25) Symbol Pd IF IFRM IF IFRM VR Topr Tstg Absolute Maximum Ratings 75 50 300 0.67 4 5 -30+85 -40+100 Unit mW mA mA mA/ mA/ V 1 IFRM Measurement condition : Pulse Width100s, Duty1/100 Electro-Optical Characteristics Item Symbol Characteristics TYP. MAX. MAX. MIN. TYP. TYP. TYP. TYP. TYP. MIN. TYP. TYP. 1.22 1.4 10 0.2 0.28 2 950 45 150 0.5 700 (Ta=25) Conditions IF=20mA VR =5V IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA DC5mA, -3db from 0.1MHz IF=20mA Unit Forward Voltage Reverse Current Radiant Intensity Total Output Power Peak Wavelength Spectral Half-width Half Intensity Angle Cut-off Frequency Response Time VF IR IE Po p 21/2 fc tr/tf V A mW/sr mW nm nm deg. MHz ns 2004.11.17 Page 2 AN1111R Surface Mount IRED/Reverse Mount Type Radiant Intensity Rank IEmW/sr Rank MIN. A B C 0.2 0.28 0.4 MAX. 0.4 0.56 0.8 IF = 20mA Condition (Ta=25) Please contact our sales staff concerning rank designation. 2005.5.26 Page 3 AN1111R Surface Mount IRED/Reverse Mount Type Technical Data Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25, IF = 50mA Spatial Distribution Example Condition : Ta = 25 Relative Intensity Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25 Duty Ratio vs. Pulse Forward Current Condition : Ta = 25, tw 100s Forward Current IF(mA) Forward Voltage : VF(V) Pulse Forward Current IFRM(A) Duty Ratio 2004.11.17 Page 4 AN1111R Surface Mount IRED/Reverse Mount Type Technical Data Ambient Temperature vs. Forward Current Ambient Temperature vs. Pulse Forward Current Condition : tw100s, Duty1/100 Pulse Forward Current IFRM(mA) Forward Current : IF (mA) Ambient Temperature : Ta() Ambient Temperature : Ta() Ambient Temperature vs. Forward Voltage Condition : IF = 50mA Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25, tw100s, Duty1/100 Pulse Forward Current IFRM(mA) Forward Voltage VF(V) Ambient Temperature : Ta () Pulse Forward Voltage : VFM(V) 2004.11.17 Page 5 AN1111R Surface Mount IRED/Reverse Mount Type Technical Data Ambient Temperature vs. Peak Wavelength Condition : IF = 50mA Forward Current vs. Relative Total Power Condition : - - Pulse, tw100s, Duty1/100, Ta = 25 Peak Wavelength p (nm) Ambient Temperature : Ta() Relative Total Power Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Condition : IF = 50mA Relative Total Power Ambient Temperature : Ta () 2004.11.17 Page 6 AN1111R Surface Mount IRED/Reverse Mount Type Package Dimensions (Unit: mm) Weight: (6.60)mg Recommended Soldering Pattern (Unit: mm) Taping Specification Quantity: 3,000pcs/ reel (standard) (Unit: mm) 2004.11.17 Page 7 AN1111R Surface Mount IRED/Reverse Mount Type Reflow Soldering Conditions 1) The above profile temperature gives the maximum temperature of the LED resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the LED from absorbing moisture. 3) Temperature fluctuation to the LED during the pre-heating process shall be minimized. Manual Soldering Conditions Iron tip temp. Soldering time and frequency 350 3s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.) 2007.8.31 Page 8 AN1111R Surface Mount IRED/Reverse Mount Type Reliability Testing Result Reliability Testing Result Room Temp. Operating Life Applicable Standard EIAJ ED4701/100(101) Testing Conditions Ta = 25, IF = Maxium Rated Current (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150180 120s Operating Heating 230 Min. Peak temperature 260 Minimum Rated Storage Temperature(30min) Normal Temperature(15min) Maximum Rated Storage Temperature(30min) Normal Temperature(15min) Ta = 602, RH = 905% Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 98.1m/s (10G), 100 2KHz sweep for 20min., XYZ each direction 2 Duration 1,000 h Failure 0/25 Resistance to Soldering Heat EIAJ ED4701/300(301) Twice 0/25 Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Vibration, Variable Frequency EIAJ ED4701/100(105) EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(403) 5 cycles 0/25 1,000 h 1,000 h 1,000 h 2h 0/25 0/25 0/25 0/10 Failure Criteria Items Radiant Intensity Forward Voltage Reverse Current Cosmetic Appearance Symbols IE VF IR - Conditions IF Value of each product Radiant Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V - Failure criteria Testing Min. Value Initial Value x 0.5 Testing Max. Value Spec. Max. Value x 1.2 Testing Max. Value Spec. Max. Value x 2.5 Occurrence of notable decoloration, deformation and cracking 2007.8.31 Page 9 AN1111R Surface Mount IRED/Reverse Mount Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the "Foreign Exchange and Foreign Trade Control Law," it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2007.8.31 Page 10 |
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