View SMP5007_4792079.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SMP50 / SMTPA / TPA
TrisilTM for telecom equipment protection
Features

Bidirectional crowbar protection Voltage range from 62 V to 320 V Low capacitance from 12 pF to 20 pF @ 50 V Low leakage current : IR = 2 A max Holding current: IH = 150 mA min Repetitive peak pulse current : IPP = 50 A (10/1000 s) SMB SMA (JEDEC DO-214AC) (JEDEC DO-214AA) SMTPA SMP50
Main applications
Telecommunication equipment such as:

Analog and digital line cards (xDSL, T1/E1, ISDN, ...) Terminals (phone, fax, modem, ...) and central office equipment
DO-15 TPA
Description
These Trisil series have been designed to protect telecommunication equipment against lightning and transient induced by AC power lines. They are available in SMA, SMB and DO-15 packages.
Order codes
Part Number SMP50-xxx TPAxxx SMTPAxxx See Ordering Information on page 9 Marking
Benefits
Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. They are used to help equipment to meet various standards such as UL1950, IEC950 / CSA C22.2, UL1459 and FCC part 68. Trisils have UL94 V0 approved resin. SMA and SMB packages are JEDEC registered (DO-214AC and DO-214AA). Trisils are UL497B approved (file: E136224).
TM: TRISIL is a trademark of STMicroelectronics
Schematic Diagram
June 2007
Rev 3
1/11
www.st.com 11
Characteristics
SMP50 / SMTPA / TPA
1
Characteristics
Table 1. Compliant with the following standards
Peak Surge Voltage (V) 2500 1000 5000 1500 6000 1500 8000 15000 4000 2000 4000 2000 4000 4000 1500 800 1000 Waveform Voltage 2/10 s 10/1000 s 2/10 s 2/10 s 10/700 s 1/60 ns 10/700 s 1.2/50 s 10/700 s 1.2/50 s 10/160 s 10/560 s 9/720 s Required peak current (A) 500 100 500 100 150 37.5 Current waveform 2/10 s 10/1000 s 2/10 s 2/10 s 5/310 s Minimum serial resistor to meet standard () 20 10 40 0 53 0 0 0 21.5 0 0 0 21.5 0 12.5 6.5 0
Standard GR-1089 Core First level GR-1089 Core Second level GR-1089 Core Intra-building ITU-T-K20/K21 ITU-T-K20 (IEC61000-4-2) VDE0433 VDE0878 IEC61000-4-5 FCC Part 68, lightning surge type A FCC Part 68, lightning surge type B
ESD contact discharge ESD air discharge 100 50 100 50 100 100 200 100 25 5/310 s 1/20 s 5/310 s 8/20 s 10/160 s 10/560 s 5/320 s
Table 2.
Symbol
Absolute ratings (Tamb = 25 C)
Parameter 10/1000 s 8/20 s 10/560 s 5/310 s 10/160 s 1/20 s 2/10 s 8/20 s t = 0.2 s t=1s t=2s t = 15 mn t = 16.6 ms t = 20 ms Value 50 150 55 65 75 100 100 2.5 16 11.5 10 3.5 6.2 6.5 -55 to 150 150 260 Unit
IPP
Repetitive peak pulse current (see Figure 1)
A
IFS ITSM
Fail-safe mode : maximum current(1) Non repetitive surge peak on-state current (sinusoidal) I2t value for fusing Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10 s.
kA
A
I2t Tstg Tj TL
1.
A2s C C
in fail safe mode, the device acts as a short circuit
2/11
SMP50 / SMTPA / TPA Table 3.
Symbol
Characteristics Thermal resistances
Value Parameter DO-15 SMA 120 30 SMB 100 20 C/W C/W Unit
Rth(j-a) Rth(j-l)
Junction to ambient (with recommended footprint or with Llead = 10 mm for DO-15) Junction to leads (Llead = 10 mm for DO-15)
100 60
Table 4.
Symbol VRM VBR VBO IRM IPP IBO IH VR IR C
Electrical characteristics - definitions (Tamb = 25C)
Parameter Stand-off voltage Breakdown voltage Breakover voltage Leakage current Peak pulse current Breakover current Holding current Continuous reverse voltage Leakage current at VR Capacitance
3/11
Characteristics Table 5. Electrical characteristics - values (Tamb = 25C)
Types IRM @ VRM max. A SMP50-62 / TPA62 SMTPA62 SMP50-68 / TPA68 SMTPA68 SMP50-100 / TPA100 SMTPA100 SMP50-120 / TPA120 SMTPA120 SMP50-130 / TPA130 SMTPA130 SMP50-180 / TPA180 SMTPA180 SMP50-200 / TPA200 SMTPA200 SMP50-220 / TPA220 SMTPA220 SMP50-240 / TPA240 SMTPA240 SMP50-270 / TPA270 SMTPA270 SMP50-320 / SMTPA320
2. See functional test circuit 1(Figure 9.) 3. See test circuit 2(Figure 10.) 4. See functional holding current test circuit 3(Figure 11.) 5. VR = 50 V bias, VRMS = 1 V, F = 1 MHz 6. VR = 2 V bias, VRMS = 1 V, F = 1 MHz
SMP50 / SMTPA / TPA
IR @ VR(1) max.
Dynamic VBO(2) max.
Static VBO @ IBO(3) max. V 82 90 133 160 173 240 267 293 320 360 400 800 max. mA
IH(4) min. mA
C(5) typ. pF 20 20 16 16 14
C(6) typ. pF 40 40 35 30 30 25 25 25 25 25 25
V 56 61 90 108 117
A
V 62 68 100 120 130
V 85 93 135 160 173 235 262 285 300 350 400
2
162 180 198 216 243 290
5
180 200 220 240 270 320
150
14 12 12 12 12 12
1. IR measured at VR guarantee VBR min VR
Figure 1.
Pulse waveform (10/1000 s)
Repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s)
Figure 2.
ITSM(A)
30 25 20 15 10 5
Non repetitive surge peak on-state current versus overload duration
% I PP 100
F=50Hz
50
0 tr tp
t
t(s)
0 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3
4/11
SMP50 / SMTPA / TPA
Characteristics
Figure 3.
On-state voltage versus on-state current (typical values)
Figure 4.
Relative variation of holding current versus junction temperature
IT(A)
50
2.0 1.8
IH[Tj] / IH[Tj=25C]
20
Tj=25C
1.6 1.4
10
1.2 1.0
5
0.8 0.6
2
0.4
VT(V)
1 0 1 2 3 4 5 6 7 8 9 10
0.2 0.0 -40 -20 0 20
Tj(C)
40 60 80 100 120
Figure 5.
Relative variation of breakover voltage versus junction temperature
Figure 6.
Relative variation of leakage current versus reverse voltage applied (typical values)
VBO[Tj] / VBO[Tj=25C]
1.10
2000 1000
IRM[Tj] / IRM[Tj=25C]
VR=VRM
1.05
100
1.00
270 V
10
0.95
62 V
Tj(C)
0.90 -40 -20 0 20 40 60 80 100
1 25 50
Tj(C)
75 100 125
Figure 7.
Figure 8. Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4, SCu = 35 m, recommended pad layout)
2.5
Relative variation of junction capacitance versus reverse voltage applied (typical values)
Zth(j-a)(C/W)
1E+2
C[VR] / C[VR=50V]
Tj=25C F=1MHz VRMS=1V
2.0
SMTPA / TPA
1E+1
1.5
SMP50
1.0
1E+0
0.5
tp(s)
1E-1 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.0 1 2 5 10
VR(V)
20 50 100 300
5/11
Characteristics Figure 9. Test circuit 1 for Dynamic IBO and VBO parameters
100 V / s, di /dt < 10 A / s, Ipp = 50 A
SMP50 / SMTPA / TPA
2
45 66 470
83 0.36 nF
46 H
U
10 F
KeyTek 'System 2' generator with PN246I module
1 kV / s, di /dt < 10 A / s, Ipp = 10 A
26 H
250 12
47
46 H
U
60 F
KeyTek 'System 2' generator with PN246I module
Figure 10. Test circuit 2 for IBO and VBO parameters
K ton = 20ms R1 = 140 R2 = 240 220V 50Hz Vout VBO measurement
DUT
1/4 IBO measurement
TEST PROCEDURE
Pulse test duration (tp = 20ms): for Bidirectional devices = Switch K is closed for Unidirectional devices = Switch K is open VOUT selection: Device with VBO > 200V VOUT = 250 VRMS, R1 = 140 Device with VBO 200V VOUT = 480 VRMS, R2 = 240
Figure 11. Test circuit 3 for dynamic IH parameters
R
Surge generator
VBAT = - 48 V
D.U.T
This is a GO-NOGO test which allows to confirm the holding current (IH) level in a functional test circuit.
TEST PROCEDURE
1/ Adjust the current level at the IH value by short circuiting the AK of the D.U.T. 2/ Fire the D.U.T. with a surge current IPP = 10A, 10/1000s. 3/ The D.U.T. will come back off-state within 50ms maximum.
6/11
SMP50 / SMTPA / TPA
Ordering information scheme
2
Ordering information scheme
SMP
Series SMP = Trisil surface mount in SMA SMTP = Trisil surface mount in SMB TP = Trisil in DO-15 Repetitive Peak Pulse Current A or 50 = 50 A Voltage 62 = 62 V
50
-
xxx
3
Package information
Epoxy meets UL94, V0 SMA dimensions
Dimensions Ref.
E1
Table 6.
Millimeters Min. Max. 2.45 0.20 1.65 0.40 2.90 5.35 4.60 1.50
Inches Min. 0.075 0.002 0.049 0.006 0.089 0.189 0.156 0.030 Max. 0.094 0.008 0.065 0.016 0.114 0.211 0.181 0.059
D
A1 A2 b
1.90 0.05 1.25 0.15 2.25 4.80 3.95 0.75
E
c
A1
D E
b
C L
A2
E1 L
Figure 12. Footprint, dimensions in mm (inches)
1.4 (0.055) 2.63 (0.103) 1.4 (0.055)
1.64 (0.064)
5.43 (0.214)
7/11
Package information Table 7. SMB dimensions
SMP50 / SMTPA / TPA
Dimensions Ref.
E1
Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059
D
A1 A2 b
1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75
E
c
A1
E E1
b
C L
A2
D L
Figure 13. Footprint, dimensions in mm (inches)
1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086)
5.84 (0.300)
Table 8.
DO-15 dimensions
Dimensions
C A C
Ref.
Millimeters Min. Max. 6.75 3.53 31 0.88
Inches Min. 0.238 0.116 1.024 0.028 Max. 0.266 0.139 1.220 0.035
A
D B
6.05 2.95 26 0.71
B C D
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
8/11
SMP50 / SMTPA / TPA
Ordering Information
4
Ordering Information
Part Number SMP50-62 SMP50-68 SMP50-100 SMP50-120 SMP50-130 SMP50-180 SMP50-200 SMP50-220 SMP50-240 SMP50-270 SMP50-320 SMTPA62 SMTPA68 SMTPA100 SMTPA120 SMTPA130 SMTPA180 SMTPA200 SMTPA220 SMTPA240 SMTPA270 SMTPA320 TPA62 TPA62RL TPA68 TPA68RL TPA100 TPA100RL TPA120 TPA130 TPA130RL TPA180 TPA180RL TPA200 TPA200RL TPA220 TPA220RL TPA240 TPA240RL TPA270 TPA270RL Marking V06 V07 V10 V12 V13 V18 V20 V22 V24 V27 V32 U01 U05 U13 U17 U19 U25 U27 U31 U35 U39 U47 TPA62 TPA68 TPA100 TPA120 TPA130 TPA180 TPA200 TPA220 TPA240 TPA270 DO-15 0.40 g 1000 6000 1000 6000 1000 6000 1000 1000 6000 1000 6000 1000 6000 1000 6000 1000 6000 1000 6000 Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel SMB 0.11 g 2500 Tape & reel SMA 0.068 g 5000 Tape & reel Package Weight Base qty Delivery mode
9/11
Revision History
SMP50 / SMTPA / TPA
5
Revision History
Date 16-Nov-2004 Revision 1 Description of Changes SMP50, SMTPA and TPA datasheets merge. Reformatted to current standards. Updated IPP value in Table 2 . Added part numbers SMP50-320 and SMTPA320. Updated dimensions and footprint for SMA and footprint for SMB. Corrected typographical error in part number. Added dimensions in inches to footprint illustrations.
30-Mar-2007
2
12-Jun-2007
3
10/11
SMP50 / SMTPA / TPA
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
(c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
11/11

▲Up To Search▲

Price & Availability of SMP5007

	To Download SMP5007 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .