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ZMD-Standard April 2002 Package LQFP44 (10 x 10) Dimensions in millimetres Based on JEDEC JEP95: MS-026 1 Dimensions MDS 758 Supersedes Edition 12.99 Z A2 A 0,1 Detail Z bp 0,2 M 44 1 D HD Dimensions of Sub-Group B1 enom Amax bPmin bPmax HEmin HEmax HDmin HDmax LPmin 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,5 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 0,80 1,60 0,30 0,45 11,85 12,15 11,85 12,15 0,45 e HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* qmin qmax 0,05 0,15 1,35 1,45 0,09 0,20 9,75 10,25 9,75 10,25 0 7 * without mold-flas Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check signed Marx Date: 30.04.2002 Quality signed Gersdorf: Doc-No. QS-000758-HD-02 A1 Lp c G ZMD-Standard April 2002 Package LQFP44 (10 x 10) Dimensions in millimetres Based on JEDEC JEP95: MS-026 1 Dimensions MDS 758 Supersedes Edition 12.99 Z A2 A 0,1 Detail Z bp 0,2 M 44 1 D HD Dimensions of Sub-Group B1 enom Amax bPmin bPmax HEmin HEmax HDmin HDmax LPmin 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,5 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 0,80 1,60 0,30 0,45 11,85 12,15 11,85 12,15 0,45 e HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* qmin qmax 0,05 0,15 1,35 1,45 0,09 0,20 9,75 10,25 9,75 10,25 0 7 * without mold-flas Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check signed Marx Date: 30.04.2002 Quality signed Gersdorf: Doc-No. QS-000758-HD-02 A1 Lp c G |
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