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M50224FP 1.5 Channel Motor Driver*with DC/DC Control REJ03F0070-0100Z Rev.1.0 Sep.19.2003 Description M50224FP is the semiconductor integrated circuit which builds in the Motor drive circuit and DC/DC circuit suitable for the camera etc. 1.5 H bridges, the DC/DC circuit of 5VDC/DC, and AE operation circuit were built in one tip by adoption of a detailed CMOS process. The reduction in power consumption and the miniaturization are considered as the high composition of the flexibility realized with one chip. Features * * * * * * Minute CMOS process acceptance.Low consumption 1.5 full swing voltage drive H Bridge circuit built-in (PWM drive correspondence) DC/DC circuit built-in of 5V One AE operation circuit built-in AE (A sensor corresponds to amorphous and SPD) Low voltage incorrect operation prevention circuit thermole shutdown circuit built-in A thermometer, with a power save function Application motor driver for cameras etc Recommend Operating Condition Supply voltage range........ VB:1.6V to 3.5V Rated supply voltage VB:3.0V Rev.1.0, Sep.19.2003, page 1 of 9 M50224FP Pin Configuration 1 VB CA CB OUT3 OUT2 OUT1 PG BCIN PGBC VDD 10 20 VDDH DGND VA VK AEOUT SEL1 SEL2 SEL3 SML1 SML2 11 Outline : 20P2F Block Diagram A control input pin is the inverter input of a 100Kohm pull down. H -- it is active and functions Circuit operation selection SEL1 SEL2 SEL3 AE output Thermometer output AEOUT Motor control signal SML1 SML2 CPU for control LOGIC VDD OSC VDD H ( VB+3.5V) 0.36uF VDD H DGND BIAS TSD LOGIC VDDH Charge Pump CA 0.012 uF CB LOGIC VA PD T Proportion REFERENCE GAIN AMP I/V TRANSFORM AMP IS CANCEL GAIN AMP AMP VDD 100uF VDD VDD (5.0V) LOGIC COMPARATOR 2.2 10uF VK 10 uF REFERENCE BCIN 1.25V: Tcon 47uH PGBC OUT3 RON: (op+Under) Zoom: Max 1.1 Film : Max 1.1 OUT2 M2 CH2 Film OUT1 M1 CH1 Zoom PG VB tantalum capacitor - indispensable VB 1.6V ~ 3.5V * The constant of external parts is an example. 10uF Rev.1.0, Sep.19.2003, page 2 of 9 M50224FP Absolute Maximum Ratings (Ta=25C, unless otherwise noted) Parameter Supply voltage1 Supply voltage2 Supply voltage3 Voltage between BCIN and PGBC Power dissipation Thermal derating Pin input Voltage Operating temperature Storage temperature Symbol VB VDD VDDH VDSS Pd K Vin Topr Tstg Ratings 3.5 6.5 VB+4.5 15 1000 -8.0 0 to VDD+0.3 -10 to 50 -40 to 150 Unit V V V V mW mW/C V C C Remark Note1 Note1 Note1 Note1 (VGS=0V) Note2 (Ta=25C) Note2 (Ta25C) Note3 note1: As a principle,do not provide reversely note2: Glass epoxy circuit board:70mm x70mm x1.6mm 1layer circuit board Cu Share 10% note3: As a principle,do not provide over supply voltage or under ground voltage Thermal Derating (Maximum Rating) THERMAL DERATING (MAXIMUM RATING) 1200 - 8.0 mW/C 1000 1000 Remark Calculation of power dissipation Case : Iout x Iout x On resistance[transistor] . *Please refer to the above figure in the case that surroundings temperature exceeded 25C *Please add the radiation board, if it is necessary. Rev.1.0, Sep.19.2003, page 3 of 9 POWER DISSIPATION Pd(mW) 800 600 400 200 800 0 20 40 60 80 100 120 140 160 Ta (C) AMBIENT TEMPERATURE M50224FP I/O Circuit Diagram * SEL1, SEL2, SEL3, SML1, SML2 VDD * OUT1, OUT2, OUT3 VB OUT3 100 OUT1 OUT2 100K * BCIN, PGBC BCIN * CA VDDH 100 PGBC * CB VDD * VA VDD 100 * VK VDD * AEOUT VDD - - Rev.1.0, Sep.19.2003, page 4 of 9 M50224FP Electrical Characteristics (Ta =25C, VB=3.0V, VDD=5.0V, unless otherwise noted) Limits Parameter Voltage range of operation Current at the time of standby Consumption current Symbol VB IB1 IDD1 Test condition MIN 2.0 TYP 3.0 0.1 MAX 3.5 5 Unit V A mA Note SEL1:L SEL2:L SEL3:L Only a DC/DC circuit is turned ON. SEL1:H SEL2:L SEL3 :L DC/DC+AE+MD circuit ON SEL1:H SEL2:L SEL3 :H VIN=VDD=5.0V - Usual consuming current 1 Usual consuming current 2 Hi level input current Lo level input current Input pull down resistance Hi level input voltage Lo level input voltage Oscillation frequency DUTY Operating start Voltage Operating stop Voltage Output voltage Input stability Load stability Maximum output current Oscillation frequency DUTY Operating start Voltage Output voltage Operating voltage ON Resistance RVON 1 Maximum output current Continual maximum output current Turn on time Turn off time Output rise time Tr Output fall time Tf IDD2 IIH IIL RIND VIH VIL fosc DUTY Vstart1 Vstop1 Vout Vout1 Vout2 Iout fosc2 DUTY2 Vstart2 Vout2 VBDCM RVON 1 Iomax Iocont TvON TvOFF Tr Tvf 25 -1.0 50 50 100 63 75 5.0 227 50 5.0 VB+3.3 0.75 0.5 0.1 0.3 0.01 100 200 VDD VDD x0.3 82 2.0 1.0 5.3 100 100 320 5.3 VB+4.5 3.5 1.1 2 0.5 1.0 0.2 mA A A K V V kHz % V V V mV mV mA kHz % V V V A mA s s s s Note4 Note3 Note2 Note1 Rev.1.0, Sep.19.2003, page 5 of 9 Input terminal DC/DC Circuit Charge pump circuit VDD=4.5 to 5.5V VDD=4.5 to 5.5V VDD=5.0V VDD=5.0V VB voltage VB voltage VDD voltage VB=2.0V to 3.3V IDD=50mA VB=2.85V IDD=100mA VB=2.85V VDD4.5V VDD=5.0V VDD=5.0V VDD voltage VDDH voltage VB voltage Io=0.5A, VB=3V, VDD=5V, VDDH=5.5V T < ***S VDDx0.7 0 44 4.7 100 150 4.5 VB+2.6 1.6 1.8 500 Motor driver(1, 2) RM=5.0 Fig. 1 - M50224FP (Ta =25C, VB=3.0V, VDD=5.0V, unless otherwise noted) Limit Parameter Temperature output absolute value Temperature output power supply voltage change 1 Temperature output power supply voltage change 2 Temperature output voltage load change The amount of temperature output change Input range Light measurement output absolute value The amount of change per two step Output linearity 1 Output linearity 2 Output linearity 3 Output linearity 4 Power supply response thermole shutdown temperature Symbol VTE dVTE1 VDD=5.5V Test condition MIN . -45 TYP 2713 MAX 3392 45 Unit mV mV Note T S D Note1: Note2: Note3: Note4: Note5: A shipment test is not performed although the TSD circuit characteristic presents reference data. Rev.1.0, Sep.19.2003, page 6 of 9 AE circuit (Thermometer) dVTE2 VDD=4.5V -45 - 45 mV dVTE3 dVTE4 Io=-0.2mA The Amount of Change (-10 to 50C) -20 -22.7 -22.0 20 -19.1 mV mV IA VAE IA=10nA 50p 1914 120u A mV AE circuit (Light measurement circuit) dEVA1 DEVS1 DEVS2 DEVS3 DEVS4 Trs TTSD IA=10nA -> 40nA IA=50pA to 1.6nA IA=1.6nA to 410nA IA=410nA to 13.1A IA=13.1A to 120A IA=50pA Tip temperature in case H bridge output turns off -30 -23 -23 -30 - -242 150 30 23 23 30 50 mV % % % % ms C Note5 Input terminal : 11 to15 PIN L=47H, C=100uF Since it is a power supply only for the insides of IC, please do not connect a charge pump circuit to others. The sum of upper and lower sides side ON resistance. ON resistance is changed with VB, VDD, and VDDH voltage. M50224FP 100% SML 50% 0% tON tOFF 50% tON tOFF 100% 90% 50% I DR 0% tf 100% 90% 50% 10% 10% - 10% - 50% - 90% - 100% tr tf - 10% - 50% tr - 90% Fig 1 H bridge part switching characteristic waveform SEL Truth value table SEL1 L H H H H L L L *1. SEL2 L L L H H L H H SEL3 L L H H L H H L The contents of control Standby Only a DC/DC circuit is turned ON (*note) DC/DC + AE circuit ON + motor1 contorol (AEOUT: right out) DC/DC + AE circuit ON + motor2 contorol(AEOUT: right out) DC/DC + AE circuit ON + shutter contorol(AEOUT : temperature out) Only AE circuit ON (AEOUT: right out) Only AE circuit ON (AEOUT: right out) Only AE circuit ON (AEOUT : temperature out) SEL1:DC/DC and Charge pump contorol (L=OFF, H=ON) * Note (INPUT) H SEL1 SEL2 SEL3 (OUTPUT) L H L H L 5V VDD VB VB+2.5V Rippuru width changes with IDD and VB. VDDH 0V MIN:10mS MIN:10mS MD Operation OK MIN:10mS MD Operation OK AE Operation OK Rev.1.0, Sep.19.2003, page 7 of 9 M50224FP Motor control Truth value table INPUT SEL1 MOTOR1 Control H H H MOTOR2 Control H H H H Shutter Control H H H H H *: SEL2 L L L L H H H H H H H H SEL3 H H H H H H H H L L L L SML1 L H L H L H L H L H L H SML2 L L H H L L H H L L H H MOTOR1 Standby Forward Rotation Reverse Brake Standby Standby Standby Standby Standby Standby Standby Standby MOTOR2 Standby Standby Standby Standby Standby Forward Rotation Reverse Brake Standby Standby Standby Standby Shutter Standby Standby Standby Standby Standby Standby Standby Standby Standby Forward Rotation Reverse Brake MOTOR Each output OUT1 OFF L H H OFF OFF OFF OFF OFF OFF OFF OFF OUT2 OFF H L H OFF H L H OFF OFF OFF OFF OUT3 OFF OFF OFF OFF OFF L H H OFF L H H Please pass through the Brake or Stand-by mode by all means in case of moving from forward rotation to Reverse rotation or from Reverse rotation to forward rotation by the motor control. (ex.) Forward rotation -> Brake -> Reverse rotation,Reverse rotation -> Stand-by -> Forward rotation Rev.1.0, Sep.19.2003, page 8 of 9 M50224FP 20P2F-A MMP JEDEC Code -- e b2 11 Plastic 20pin 255mil SSOP Weight(g) -- Lead Material Cu Alloy EIAJ Package Code SSOP20-P-255-0.65 20 Package Dimensions HE E L1 L Rev.1.0, Sep.19.2003, page 9 of 9 F Recommended Mount Pad Symbol 1 10 A G D A2 e b A1 x M y c A A1 A2 b c D E e HE L L1 z Z1 x y Detail F b2 e1 I2 z Detail F Z1 e1 Dimension in Millimeters Min Nom Max 1.45 -- -- 0.2 0.1 0 -- 1.15 -- 0.32 0.22 0.17 0.2 0.15 0.13 6.6 6.5 6.4 4.5 4.4 4.3 -- 0.65 -- 6.6 6.4 6.2 0.7 0.5 0.3 -- 1.0 -- -- 0.325 -- -- -- 0.475 -- -- 0.13 0.1 -- -- -- 0 10 -- 0.35 -- -- 5.8 -- -- 1.0 -- I2 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. 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