P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch
FEATURES * Convert surface-mount QFP packages to a 13x13 PGA footprint. * Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. * Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. * Consult factory for Panelized Form or for mounting of consigned chips. GENERAL SPECIFICATIONS * ADAPTOR BODY: FR-4 with 1-oz. Cu traces * PADS: Bare Cu protected with Entek(R) by Enthone or immersion white Sn to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling * PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M * PIN PLATING: 200 [5.08] Sn/Pb 93/7 per ASTM B579-73 over 100 [2.54] Ni per SAE AMS-QQ-N-290 * OPERATING TEMPERATURE: 221F [105C] MOUNTING CONSIDERATIONS
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice.
ORDERING INFORMATION
P/N 95132125 QFP-to-PGA 13x13 Adapter P/N 995132125-P QFP-to-PGA 13x13 Panilized Form P/N 132PGM13072-30 QFP-to-PGA 13x13 Wire Wrap
* SUGGESTED PCB HOLE SIZE: 0.028 0.003 [0.71 0.08] dia. * Will plug into standard PGA socket
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: 0.005 [0.13] UNLESS OTHERWISE SPECIFIED ROW-TO-ROW AND PIN-TO-PIN 0.003 [0.08] CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA TEL (215) 781-9956 * FAX (215) 781-9845 WWW.ARIESELEC.COM * INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18017 Rev. AA
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