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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT ROUND TYPE LED LAMPS Pb Lead-Free Parts LUY3333H-PF DATA SHEET DOC. NO : REV. DATE : : QW0905- LUY3333H-PF A 23 - May - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333H-PF Page 1/5 Package Dimensions 5.0 5.9 7.6 8.6 1.5 MAX 25.0MIN 1/4 0.5 TYP 2.54TYP 1.0MIN Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0X -30X 30X -60X 60X 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333H-PF Page 2/5 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol UY(H) Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 50 100 130 10 2000 -20 ~ +80 -30 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT g A V J J Typical Electrical & Optical Characteristics (Ta=25 J) COLOR PART NO MATERIAL Emitted Lens Dominant wave length f D nm Spectral Forward halfwidth voltage f nm @20mA(V) Luminous intensity @ 20mA(mcd) Viewing angle 2c 1/2 (deg) Min. Max. Min. 590 20 1.7 Typ. 17 LUY3333H-PF AlGaInP/GaP Yellow Water Clear 2.6 3400 6200 Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333H-PF Page 3/5 Typical Electro-Optical Characteristics Curve UY(H) CHIP Fig.1 Forward Current vs. Forward Voltage 1000 Fig.2 Relative Intensity vs. Forward Current 3.0 Forward Current(mA) 100 10 1.0 Relative Intensity Normalize @20mA 1.0 2.0 3.0 4.0 5.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 0.1 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25J Forward Voltage@20mA Normalize @25J 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature(J) Ambient Temperature(J) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333H-PF Page 4/5 Wave soldering Profile Temp(XC) 245XC 5sec Max 245X 120X 3X/sec max 5X/sec max Soldering Soldering Iron:30W Max Temperature 300XC Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) X52 120 Seconds Max Preheat Dip Soldering Preheat: 120XC Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3XC/sec(max) Ramp-Down:-5XC/sec(max) Solder Bath:245XC Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) Wave Soldering Profile (Pb Free) Temp(XC) 265XC 5sec Max 265X Soldering Soldering Iron:30W Max Temperature:350 XCMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) 140X 3X/sec max Preheat 5X/sec max X52 120 Seconds Max Dip Soldering Preheat: 140XC Max Preheat time: 120seconds Max Time(sec) Ramp-up 3XC/sec(max) Ramp-Down:-5XC/sec(max) Solder Bath:265XC Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333H-PF Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J&-40JO 5J (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 J O 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 J O 5J 2.Dwell time=5 O 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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