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SPATM Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
HF
RoHS
Pb
GREEN
SP6001 Lead-Free/Green Series
Description The Littelfuse SP6001 SPA series integrates 4, 6 and 8 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting 30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers.
Pinout
Features frequencies from 800MHz to 3GHz attenuation (TYP) at 1GHz 30kV contact, 30kV air package (TYP 0.5mm height)
1
4 GND
UDFN-08
8
5
SP6001-04UTG-1
1
6
UDFN-12
12
GND
7
SP6001-06UTG-1
1
8
UDFN-16
16
GND
9
SP6001-08UTG-1
Functional Block Diagram
Applications
SP6001-04UTG-1
1
Cd Cd
SP6001-06UTG-1
8 1
Cd Cd
portable electronics
12
interfaces for handsets
11 10
device
2
Cd Cd
7 6
Cd Cd
2
Cd Cd
portable electronics
3
3
Cd Cd
4
Cd Cd
5
4
Cd Cd
9 8
Cd Cd
5 6
Cd Cd
7
(c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
87 Revised: March 25, 2010
SP6001 Lead-Free/Green Series
Lead-Free/Green SP6001
SPATM Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
Absolute Maximum Ratings
Symbol TOP TSTOR Operating Temperature Storage Temperature Parameter Value -40 to 85 -60 to 150 Units C C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units C C C
Electrical Characteristics (TOP=25C)
Parameter Reverse Standoff Voltage Breakdown Voltage Reverse Leakage Current Resistance Diode Capacitance1,2 Line Capacitance1,2 ESD Withstand Voltage1 Cutoff Frequency3 Symbol VRWM VBR I RA CD CL VESD F-3dB IR=1mA VRWM=5V IR=10mA VR=2.5V,f=1MHz VR=2.5V,f=1MHz IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Above this frequency, appreciable attenutation occurs 19 30 30 115 85 7 .0 7 .8 0.1 100 12 24 29 Test Conditions Min Typ Max 6.0 8.5 1.0 115 Units V V A pF pF kV kV MHz
Notes: 1 Parameter is guaranteed by design and/or device characterization.
2 3
Total line capacitance is two times the diode capacitance (CD). 50 source and 50 load termination
SP6001 Lead-Free/Green Series
88 Revised: March 25, 2010
(c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
SPATM Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
Insertion Loss (S21)
CH1 S 21 log MAG 5 dB/ REF 0 dB 1 _:-5.8807 dB
Analog Crosstalk (S41)
CH1 S log MAG 10 dB/ REF 0 dB
Cor Smo 1
Cor Del Smo
1
x2 Start
x2
3.000 000MHz
Stop 6 000.000.000MHz
START
3.000 000 MHz
Stop 6 000.000 000 MHz
Line Capacitance vs. DC Bias
50
40
Capacitance (pF)
30
20
10
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DC Bias (V)
(c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
89 Revised: March 25, 2010
SP6001 Lead-Free/Green Series
Lead-Free/Green SP6001
SPATM Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
Application Example
PCB Connector for LCD Display D1 D2 IC D3 D4
SP6001-04UTG-1
Baseband
Camera Module D1 D2 D3 D4
SP6001-08UTG-1
Baseband
IC D5 D6 D7 D8
Soldering Parameters
Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb - Free assembly 150C 200C 60 - 180 secs 3C/second max 3C/second max 217C 60 - 150 seconds 250+0/-5 C 20 - 40 seconds 6C/second max 8 minutes Max. 260C
Peak Temperature (TP) Time within 5C of actual peak Temperature (tp) Ramp-down Rate Time 25C to peak Temperature (TP) Do not exceed
SP6001 Lead-Free/Green Series
90 Revised: March 25, 2010
(c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
SPATM Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
Package Dimensions - UDFN-08
D
Symbol
A
UDFN-08 Millimeters Min A
A3 A1
Inches Min 0.018 0.000 Max 0.022 0.002
Max 0.550 0.050
E
0.450 0.000
A1 A3 b D
0.127 REF 0.150 1.600 1.100 1.250 0.300 0.250 1.800 1.300 1.450 0.500
0.005 REF 0.006 0.063 0.043 0.049 0.012 0.010 0.071 0.051 0.057 0.020
E2
D2
K
D2 E E2 e
0.400 BSC 0.200 0.150 0.350
0.016 BSC 0.008 0.006 0.000 0.014
L
K L
e
b
Package Dimensions - UDFN-12
UDFN-12
D
A
Symbol
Millimeters Min Max 0.550 0.050 Min 0.018 0.000
Inches Max 0.022 0.002
A
A3 A1
0.450 0.000
E
A1 A3 b
0.127 REF 0.150 2.400 1.900 1.250 0.300 0.250 2.600 2.100 1.450 0.500
0.005 REF 0.006 0.094 0.075 0.049 0.012 0.010 0.102 0.083 0.057 0.020
D2
E2
D D2 E E2
L
e K
0.400 BSC 0.200 0.150 0.350
0.016 BSC 0.008 0.006 0.000 0.014
e
b
L
(c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
91 Revised: March 25, 2010
SP6001 Lead-Free/Green Series
Lead-Free/Green SP6001
K
SPATM Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
Package Dimensions - UDFN-16
D
Symbol Millimeters Min
E
UDFN-16 Inches Min 0.01 0.00 Max 0.02 0.00
Max 0.55 0.05
A A1 A3 b
0.45 0.00
0.127 REF 0.15 3.20 2.70 1.25 0.30 0.25 3.40 2.90 1.45 0.50
0.00 REF 0.00 0.12 0.10 0.04 0.01 0.00 0.13 0.11 0.05 0.01
A
A1 E2 A3
D D2
D2
E E2 e K
K
0.40 BSC 0.20 0.15 0.35
0.01 BSC 0.00 0.00 0.01
L
L
e
b
Part Numbering System
Product Characteristics
Lead Plating Lead Material Lead Coplanarity Subsitute Material Body Material Flammability
Notes : 1. All dimensions are in millimeters
SP 6001 - 0x U T G - 1
Silicon Protection Array Series Number of Channels
04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 08 = 8 Channel UDFN-16
Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0
G= Green T= Tape & Reel Package
UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) UDFN-16 (3.3x1.35mm)
Part Marking System
2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr.
JHx
JH4 JH6 JH8
Ordering Information
Part Number SP6001-04UTG-1 SP6001-06UTG-1 SP6001-08UTG-1 Package uDFN-08 uDFN-12 uDFN-16 Size 1.7x1.35mm 2.5x1.35mm 3.3x1.35mm
4. All specifications comply to JEDEC SPEC MO-223 Issue A
Product Series J = SP6001 Assembly Site
4 = UDFN-08 6 = UDFN-12 8 = UDFN-16
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13.
Marking JH4 JH6 JH8
Min. Order Qty. 3000 3000 3000
SP6001 Lead-Free/Green Series
92 Revised: March 25, 2010
(c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
SPATM Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
Embossed Carrier Tape & Reel Specification - UDFN-08
D
P2
t E
Symbol E F D1
Millimetres Min 1.65 3.45 1.00 1.50 min 3.90 4.10 Max 1.85 3.55 Min 0.065 0.136 0.040
Inches Max 0.073 0.140 -
W
D P
0.059 min 0.154 0.161
F
10P W
40.0 +/- 0.20 7 .70 1.95 1.55 1.90 0.95 0.30 max 8.30 2.05 1.75 2.1 1.15
1.575 +/- 0.008 0.303 0.077 0.061 0.075 0.037 0.327 0.081 0.069 0.083 0.045
D1 AO
BO
P
P2 A0 B0 K0 t
0.012 max
Embossed Carrier Tape & Reel Specification - UDFN-12
KO
P2
oD /
Symbol
Millimetres Min 1.65 3.45 0.55 1.50 min 3.90 4.10 Max 1.85 3.55 0.65 Min 0.065 0.136 0.021
Inches Max 0.073 0.140 0.025
t
E
E F D1
W
D
0.059 min 0.154 0.161
BO
P 10P W P2
40.0 +/- 0.20 7 .90 1.95 1.33 2.63 0.58 0.22 max 8.30 2.05 1.53 2.83 0.78
1.575 +/- 0.008 0.311 0.077 0.052 0.103 0.023 0.327 0.081 0.060 0.111 0.031
oD / A0
P
A0 B0 K0 t
0.009 max
K0
(c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
93 Revised: March 25, 2010
SP6001 Lead-Free/Green Series
Lead-Free/Green SP6001
F
SPATM Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
Embossed Carrier Tape & Reel Specification - UDFN-16
P1 P0 P2 + + + + + E F W + + + + + D0
Symbol A0 B0 D0 E F K0 P0 P1
Millimetres Min 1.55 3.50 1.40 1.65 5.45 0.85 3.90 1.95 3.90 0.26 11.90 Max 1.75 3.70 1.60 1.85 5.55 1.05 4.10 2.05 4.10 0.30 12.30 Min 0.06 0.13 0.05 0.06 0.21 0.03 0.15 0.07 0.15 0.01 0.46
Inches Max 0.06 0.14 0.06 0.07 0.21 0.04 0.16 0.08 0.16 0.01 0.48
O 1.00 0.05
P2 T
T 12 MAX A0 K0 B0
W
12 MAX
SP6001 Lead-Free/Green Series
94 Revised: March 25, 2010
(c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.

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