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| Custom High Performance Cooling Solutions w/ maxiGRIPTM Attachment ATS PART # ATS-59004-C2-R0 Features & Benefits Designed for flip-chip processors such as Freescale MPCs maxiGRIPTM attachment applies steady, even pressure to the component and does not require holes in the PCB Comes preassembled with high performance, phase changing, thermal interface material B A C D Thermal Performance AIR VELOCITY *Image above is for illustration purposes only. THERMAL RESISTANCE FT/MIN 200 300 400 500 600 700 800 M/S 1.0 1.5 2.0 2.5 3.0 3.5 4.0 C/W (UNDUCTED FLOW) 3.2 2.46 2 1.7 1.5 1.3 1.2 C/W (DUCTED FLOW) 1.9 Product Details DIMENSION A 32 mm NOTES: 1) 2) 3) 4) 5) DIMENSION B 50 mm DIMENSION C 12 mm DIMENSION D 80.2 mm INTERFACE MATERIAL SAINT-GOBAIN C1100F FINISH BLACK-ANODIZED Dimension C = heat sink height from bottom of the base to the top of the fin field. ATS-59004-C1-R0 is a subsitute item available utilizing an equivalent phase change material (Chomerics T766). Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. Contact ATS to learn about custom options available. For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV2_111408 |
Price & Availability of ATS-59004-C2-R0
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