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PA1162
RF Linear Hybrid Power Amplifier - 4 Watts 800 to 960 MHz
Features
* * * * LOW NOISE FIGURE: 2.0 dB (TYP.) HIGH GAIN: 28 dB (TYP.) HIGH P1dB: +35.5 dBm (TYP.) HIGH IP3: +50 dBm (TYP.) Rev. V4
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Description
The PA1162 is a discrete hybrid linear power amplifier design, which uses thick film solder manufacturing processes for accurate performance and high reliability. This 2 stage GaAs FET transistor design uses feedback loops for flat broadband linear performance, with very low noise figure. The model is particularly suited for power driver applications used in the base station & repeater infrastructure, and for commercial & military radios, where ultra high linearity is critical.
Ordering Information
Part Number
PA1162
Package
Flange Mount Carrier
Electrical Specifications: Z0 = 50, VCC = +12 VDC
Typical Parameter
Frequency Small Signal Gain (min)
Absolute Maximum Ratings
Parameter Absolute Maximum
-40C to +85C +70C +13 Vdc +15 dBm
Gurarnteed 0C to +70C
800-960 26.0
Units 25C
MHz dB 800-960 28.0
Storage Temperature Operation Base Temperature Max. DC VOltage
Gain Flatness (max) Noise Figure (max) Power Output @ 1.0 dB Comp. (min.) Output IP3 VSWR Input / Output (max.) DC Current @ +12 Volts (max.)
dB dB
+ 0.5 2.0
+ 1.0 Max. Continuous RF Input Power 3.5
dBm
+35.5
+34.0
Thermal Data: VCC = +12 VDC
Parameter Rating
+7.6C/W +75C
dBm
+50.0 2.0:1 2.3:1
Thermal Resistance jc Junction Temperature Rise Above Case Tjc
mA
825
900
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.4155721 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
PA1162
RF Linear Hybrid Power Amplifier - 4 Watts 800 to 960 MHz
Typical Performance Curves at +25C
GAIN
29.0
Rev. V4
Outline Drawing: Flange Mount Carrier *
G ain -
28.0
M/A-COM
820 840 860 880 900 920 940 960
27.0 800
FREQUENCY - MHZ
VSWR
2.0
I nput V SWR Out put V SWR
VSWR
1.5
WEIGHT: 18.8 grams (0.67 oz.) max
1.0
800
820
840
860
880
900
920
940
960
* DIMENSIONS ARE IN INCHES
FREQUENCY - MHZ
NOISE FIGURE Noise Figure - dB
2.2
Recommended Mounting Notes:
1.) Since the PA1162 is a high frequency design, it is important that a very good electrical ground exists and that low loss transmission lines connecting the RF terminals have a 50 ohm characteristic impedance. For example: for 0.062" thick G-10 fiberglass PCB material (1oz clad, both sides), a 50 ohm line microstrip is 0.100 inches wide. 2.) For the PWB, It is advisable to provide sufficient plated ground through holes for good transfer of the electrical ground plane from front to back to the PCB. The ground vias also serve as good thermal conductors to dissipate the heat generated by the PA module. For the DC transmission line portion, It is a good practice to add external bypass capacitors with >/= 0.1 uF, to prevent any RF feedback from circulating on the DC lines. 3.) The specified flatness over the entire length of the bottom surface of the PA1162 flange is within .0015". The cavity of the subsystem baseplate should be machined to a similar overall flatness so as to not cause any potential grounding discontinuities. Thermal grease can be used as an interface between the PA and subsystem floor to optimize the heat transfer efficiency. The baseplate needs to provide sufficient heatsinking for the PA module to operate normally. 4.) All interfacing RF, bias, and ground pins are an edge clip design on the side soldered onto the PWB of the PA1162. The pins are both mechanically and solder attached above and below the board. So they will be structurally held in place, even if the solder connection reflows. It is advisable that SN63 solder be used to spot reflow the pins to the mating circuit board. 5.) To avoid any chance of impedance mismatch on the RF interface connections, it is advisable to mount the PA module as close as possible against the side of the circuit board, to avoid any air gaps which could introduce unwanted parasitic effects.
2.0
1.8 800
820
840
860
880
900
920
940
960
FREQUENCY - MHz
Pow er O utput -
POWER OUTPUT* 36.0
35.0
34.0 800 820 840 860 880 900 920 940 960
FREQUENCY - MHz * @ 1.0 dB Gain Compression
THIRD ORDER INTERCEPT POINT *
Intercept Point - dBm
51.0
50.0
49.0 800
820
840
860
880
900
920
940
960
FREQUENCY - MHz * Output Pow er = +15 dBm
6.) Based on the outline dimensions of the PA module, the depth of the cavity along side the subsystem PWB, should be enough so that when the module is mounted in place, there should be a ~ .003" gap between the top side of the circuit board trace and the bottom side of the mating pin.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.4155721 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.

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