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www..com PHOTOCOUPLER PS8103 HIGH-SPEED (200 kbps) ANALOG OUTPUT TYPE 5-PIN SOP PHOTOCOUPLER -NEPOC Series- DESCRIPTION The PS8103 is an optically coupled isolator containing a GaAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. This is a plastic SOP (Small Out-line Package) type for high density applications. FEATURES * Wide operating VCC range (VCC = -0.5 to +15 V) * Small package (5-pin SOP) * High isolation voltage (BV = 2 500 Vr.m.s.) * High-speed response (tPHL, tPLH = 5 s MAX. (@RL = 4.1 k)) * Ordering number of taping product: PS8103-F3, F4: 2 500 pcs/reel * Pb-Free product * Safety standards * UL approved: File No. E72422 1 2 PIN CONNECTION (Top View) 5 4 3 1. Anode 2. Cathode 3. GND 4. VO 5. VCC APPLICATIONS * Computer and peripheral manufactures * General purpose inverter * Substitutions for relays and pulse transformers * Power supply The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PN10261EJ02V0DS (2nd edition) Date Published February 2005 CP(K) Printed in Japan The mark shows major revised points. (c) NEC Compound Semiconductor Devices, Ltd. 2003, 2005 www..com PS8103 PACKAGE DIMENSIONS (UNIT: mm) 3.4 +0.3 -0.1 7.00.3 4.4 2.60.2 0.15 +0.10 -0.05 0.10.1 1.27 0.4 +0.10 -0.05 0.25 M 0.50.3 MARKING 8103 N234 No. 1 pin Mark Initial of NEC (Engraved mark) N Assembly Lot *1 N 2 34 Week Assembled Year Assembled (Last 1 Digit) Rank Code *1 Bar : Pb-Free 2 Data Sheet PN10261EJ02V0DS www..com PS8103 ORDERING INFORMATION Part Number Order Number Solder Plating Specification PS8103 PS8103-F3 PS8103-F4 PS8103-A PS8103-F3-A PS8103-F4-A Pb-Free *2 Packing Style Safety Standard Approval Application Part Number PS8103 *1 Magazine case 100 pcs Embossed Tape 2 500 pcs/reel Standard products (UL approved) *1 For the application of the Safety Standard, following part number should be used. *2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Diode Forward Current Reverse Voltage Power Dissipation Detector *1 Symbol IF VR PD VCC VO IO *2 Ratings 50 5 50 -0.5 to +15 -0.5 to +15 8 80 2 500 -40 to +100 -55 to +125 Unit mA V mW V V mA mW Vr.m.s. C C Supply Voltage Output Voltage Output Current Power Dissipation PC BV TA Tstg Isolation Voltage *3 Operating Ambient Temperature Storage Temperature *1 Reduced to 0.5 mW/C at TA = 25C or more. *2 Applies to output pin VO. Reduced to 0.8 mW/C at TA = 25C or more. *3 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together. Data Sheet PN10261EJ02V0DS 3 www..com PS8103 ELECTRICAL CHARACTERISTICS (TA = 25C) Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Detector High Level Output Current High Level Output Current Low Level Output Voltage High Level Supply Current Low Level Supply Current Coupled Current Transfer Ratio (IC/IF) *1 11 Symbol VF IR Ct IOH (1) IOH (2) VOL ICCH ICCL CTR IF = 16 mA VR = 3 V Conditions MIN. TYP. 1.2 MAX. 1.5 10 Unit V A pF V = 0 V, f = 1 MHz IF = 0 mA, VCC = VO = 5.5 V IF = 0 mA, VCC = VO = 15 V IF = 16 mA, VCC = 4.5 V, IOL = 1.1 mA IF = 0 mA, VO = open, VCC = 15 V IF = 16 mA, VO = open, VCC = 15 V IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 10 30 7 500 100 0.1 0.01 150 23 0.4 1 800 30 nA A V A % Isolation Resistance Isolation Capacitance Propagation Delay Time (H L) (L H) (H L) (L H) *2 RI-O CI-O tPHL VI-O = 1 kVDC, RH = 40 to 60% V = 0 V, f = 1 MHz IF = 16 mA, VCC = 5 V, RL = 4.1 k, CL = 15 pF 10 0.4 1 5 pF s Propagation Delay Time *2 tPLH 2 5 Propagation Delay Time *2 tPHL IF = 16 mA, VCC = 5 V, RL = 20 k, CL = 15 pF 1 15 Propagation Delay Time *2 tPLH 7 15 *1 CTR rank L : 15 to 30 (%) N : 10 to 30 (%) *2 Test circuit for propagation delay time Pulse input (IF) (Pulse width = 100 s, Duty cycle = 1/10) Input (Monitor) 47 tPHL tPLH 0.1 F VCC = 5 V RL = 4.1/20 k VO (Monitor) CL = 15 pF Input 50% 5V Output 1.5 V VOL CL includes probe and stray wiring capacitance. USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity. 4 Data Sheet PN10261EJ02V0DS www..com PS8103 TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 120 100 80 60 40 20 60 Diode Power Dissipation PD (mW) 50 40 30 20 10 0 25 50 75 100 0 25 50 75 100 Ambient Temperature TA (C) Ambient Temperature TA (C) FORWARD CURRENT vs. FORWARD VOLTAGE 100 1 000 High Level Output Current IOH (nA) HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE IF = 0 mA Forward Current IF (mA) 10 TA = +100C +50C +25C 100 VCC = VO = 15 V 5.5 V 10 1 0C -25C 0.1 1 0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 -25 0 25 50 75 100 Forward Voltage VF (V) Ambient Temperature TA (C) CURRENT TRANSFER RATIO vs. FORWARD CURRENT Current Transfer Ratio CTR (%) NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE Normalized Current Transfer Raio CTR 40 35 30 25 20 15 10 5 0 0.5 1 5 10 VCC = 4.5 V, VO = 0.4 V 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 100 Normalized to 1.0 at TA = 25C, IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 50 Forward Current IF (mA) Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. Data Sheet PN10261EJ02V0DS 5 www..com PS8103 OUTPUT CURRENT vs. OUTPUT VOLTAGE 10 IF = 25 mA 20 mA 6 15 mA 4 10 mA 5 mA Output Voltage VO (V) OUTPUT VOLTAGE vs. FORWARD CURRENT 6 5 4 3 2 1 Output Current IO (mA) 8 RL = 4.1 k 20 k 2 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20 Output Voltage VO (V) Forward Current IF (mA) PROPAGATION DELAY TIME vs. FORWARD CURRENT VCC = 5 V Propagation Delay Time tPHL, tPLH (s) Propagation Delay Time tPHL, tPLH (s) PROPAGATION DELAY TIME vs. LOAD RESISTANCE 10 VCC = 5 V, IF = 16 mA tPLH 15 10 tPLH (RL = 20 k) 1 tPHL 5 tPHL (RL = 4.1 k) tPHL (RL = 20 k) tPLH (RL = 4.1 k) 0 5 10 15 20 25 0.1 1 10 Load Resistance RL (k) 100 Forward Current IF (mA) Normalized Propagation Delay Time tPHL, tPLH NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 3.0 2.5 2.0 1.5 1.0 0.5 0 -50 Normalized to 1.0 at TA = 25C, IF = 16 mA, VCC = 5 V, RL = 2.2 k, 20 k tPLH tPHL -25 0 25 50 75 100 Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. 6 Data Sheet PN10261EJ02V0DS www..com PS8103 TAPING SPECIFICATIONS (UNIT: mm) Outline and Dimensions (Tape) 1.750.1 7.40.1 2.00.05 4.00.1 1.5+0.1 -0 3.45 MAX. 1.550.1 12.00.2 5.50.1 3.90.1 8.00.1 3.00.1 0.30.05 Tape Direction PS8103-F3 PS8103-F4 Outline and Dimensions (Reel) 2.00.5 2.00.5 13.00.2 R 1.0 21.00.8 3302.0 13.00.2 1001.0 13.51.0 17.51.0 Packing: 2 500 pcs/reel 11.9 to 15.4 Outer edge of flange Data Sheet PN10261EJ02V0DS 7 www..com PS8103 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T (C) (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100C 8 Data Sheet PN10261EJ02V0DS www..com PS8103 (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10261EJ02V0DS 9 www..com 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL's liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability. |
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