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19-0564; Rev 0; 7/06
KIT ATION EVALU ABLE AVAIL
High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod
General Description
The MAX2023 low-noise, high-linearity, direct upconversion/downconversion quadrature modulator/demodulator is designed for single and multicarrier 1500MHz to 2300MHz DCS 1800/PCS 1900 EDGE, cdma2000 (R) , WCDMA, and PHS/PAS base-station applications. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based double-conversion systems. In addition to offering excellent linearity and noise performance, the MAX2023 also yields a high level of component integration. This device includes two matched passive mixers for modulating or demodulating in-phase and quadrature signals, two LO mixer amplifier drivers, and an LO quadrature splitter. On-chip baluns are also integrated to allow for single-ended RF and LO connections. As an added feature, the baseband inputs have been matched to allow for direct interfacing to the transmit DAC, thereby eliminating the need for costly I/Q buffer amplifiers. The MAX2023 operates from a single +5V supply. It is available in a compact 36-pin thin QFN package (6mm x 6mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40C to +85C temperature range.
Features
o 1500MHz to 2300MHz RF Frequency Range o Scalable Power: External Current-Setting Resistors Provide Option for Operating Device in Reduced-Power/Reduced-Performance Mode o 36-Pin, 6mm x 6mm TQFN Provides High Isolation in a Small Package Modulator Operation: o Meets GSM Spurious Emission of -75dBc at 600kHz Offset at POUT = +6dBm o +23.5dBm Typical OIP3 o +61dBm Typical OIP2 o +16dBm Typical OP1dB o -54dBm Typical LO Leakage o 48dBc Typical Sideband Suppression o -165dBc/Hz Output Noise Density o Broadband Baseband Input of 450MHz Allows a Direct Launch DAC Interface, Eliminating the Need for Costly I/Q Buffer Amplifiers o DC-Coupled Input Allows Ability for Offset Voltage Control Demodulator Operation: o +38dBm Typical IIP3 o +59dBm Typical IIP2 o +30dBm Typical IP1dB o 9.5dB Typical Conversion Loss o 9.6dB Typical NF o 0.025dB Typical I/Q Gain Imbalance o 0.56 I/Q Typical Phase Imbalance
MAX2023
Applications
Single-Carrier DCS 1800/PCS 1900 EDGE Base Stations Single and Multicarrier WCDMA/UMTS Base Stations Single and Multicarrier cdmaOneTM and cdma2000 Base Stations Predistortion Transmitters and Receivers PHS/PAS Base Stations Fixed Broadband Wireless Access Military Systems Microwave Links Digital and Spread-Spectrum Communication Systems Video-on-Demand (VOD) and DOCSIS Compliant Edge QAM Modulation Cable Modem Termination Systems (CMTS)
cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group.
Ordering Information
PART MAX2023ETX TEMP RANGE -40C to +85C PINPACKAGE 36 Thin QFN-EP* (6mm x 6mm) 36 Thin QFN-EP* (6mm x 6mm) 36 Thin QFN-EP* (6mm x 6mm) 36 Thin QFN-EP* (6mm x 6mm) PKG CODE T3666-2 T3666-2 T3666-2 T3666-2
MAX2023ETX-T -40C to +85C MAX2023ETX+ -40C to +85C MAX2023ETX+T -40C to +85C
*EP = Exposed paddle. +Denotes lead-free package. T = Tape-and-reel package. 1
_______________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX2023
ABSOLUTE MAXIMUM RATINGS
VCC_ to GND ........................................................-0.3V to +5.5V BBI+, BBI-, BBQ+, BBQ- to GND..................-4V to (VCC + 0.3V) LO, RF to GND Maximum Current ......................................30mA RF Input Power ...............................................................+30dBm Baseband Differential I/Q Input Power ..........................+20dBm LO Input Power...............................................................+10dBm RBIASLO1 Maximum Current .............................................10mA RBIASLO2 Maximum Current .............................................10mA RBIASLO3 Maximum Current .............................................10mA JA (without air flow) ......................................................34C/W JA (2.5m/s air flow) .........................................................28C/W JC (junction to exposed paddle) ...................................8.5C/W Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering 10s, leaded) .....................+245C Lead Temperature (soldering 10s, lead free) ..................+260C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q inputs terminated into 100 differential, LO input terminated into 50, RF output terminated into 50, 0V common-mode input, R1 = 432, R2 = 562, R3 = 300, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.) (Note 1)
PARAMETER Supply Voltage Supply Current (Note 2) CONDITIONS MIN 4.75 255 TYP 5.00 295 MAX 5.25 345 UNITS V mA
AC ELECTRICAL CHARACTERISTICS (Modulator)
(MAX2023 Typical Application Circuit, when operated as a modulator, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source, 0V common-mode input, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 300, TC = -40C to +85C. Typical values are at VCC = +5V, VBBI = VBBQ = 2.66VP-P differential, fIQ = 1MHz, PLO = 0dBm, TC = +25C, unless otherwise noted.) (Note 1)
PARAMETER BASEBAND INPUT Baseband Input Differential Impedance BB Common-Mode Input Voltage Range Baseband 0.5dB Bandwidth LO INPUT LO Input Frequency Range LO Input Drive LO Input Return Loss RF OUTPUT Output IP3 POUT = 0dBm, fBB1 = 1.8MHz, fBB2 = 1.9MHz fLO = 1750MHz fLO = 1850MHz fLO = 1950MHz +24.2 +23.5 +22 +61 +15.9 +14.3 +12.5 +5.6 dBm dBm dBm dBm 1500 -3 15 2300 +3 MHz dBm dB fI/Q = 1MHz VBBI = VBBQ = 1VP-P differential 55 3.5 450 V MHz CONDITIONS MIN TYP MAX UNITS
Output IP2
POUT = 0dBm, fBB1 = 1.8MHz, fBB2 = 1.9MHz, fLO = 1850MHz fLO = 1750MHz CW tone (Note 3) fLO = 1850MHz fLO = 1950MHz
Output P1dB Output Power
2
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod
AC ELECTRICAL CHARACTERISTICS (Modulator) (continued)
(MAX2023 Typical Application Circuit, when operated as a modulator, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source, 0V common-mode input, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 300, TC = -40C to +85C. Typical values are at VCC = +5V, VBBI = VBBQ = 2.66VP-P differential, fIQ = 1MHz, PLO = 0dBm, TC = +25C, unless otherwise noted.) (Note 1)
Output Power Variation Over Temperature Output-Power Flatness RF Return Loss Single Sideband Rejection POUT = +5.6dBm, fI/Q = 100kHz, TC = -40C to +85C fLO = 1850MHz, PRF flatness for fLO swept over 50MHz range fLO = 1850MHz No external calibration fLO = 1750MHz fLO = 1850MHz fLO = 1950MHz 200kHz offset Spurious Emissions POUT = +6dBm, fLO = 1850MHz, EDGE input 400kHz offset 600kHz offset 1.2MHz offset Error Vector Magnitude Output Noise Density Output Noise Floor LO Leakage EDGE input (Note 4) POUT = 0dBm (Note 5) Un-nulled, baseband inputs terminated in 50 fLO = 1750MHz fLO = 1850MHz fLO = 1950MHz RMS Peak 0.25 0.2 17 51 48 48 -37.2 -71.4 -84.7 -85 0.67 1.5 -174 -165 -59 -54 -48 dBm % dBm/Hz dBm/Hz dBc/ 30kHz dBc dB dB dB
MAX2023
AC ELECTRICAL CHARACTERISTICS (Demodulator)
(MAX2023 Typical Application Circuit when operated as a demodulator, VCC = +4.75V to +5.25V, GND = 0V, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 300, TC = -40C to +85C. Typical values are at VCC = +5V, PRF = 0dBm, fBB = 1MHz, PLO = 0dBm, fLO = 1850MHz, TC = +25C, unless otherwise noted.) (Note 1)
PARAMETER RF INPUT RF Input Frequency Conversion Loss Noise Figure Noise Figure Underblocking Conditions Input Third-Order Intercept Point Input Second-Order Intercept Point Input 1dB Compression Point I/Q Gain Mismatch I/Q Phase Mismatch fBLOCKER = 1950MHz, PBLOCKER = +11dBm, fRF = 1850MHz (Note 6) fRF1 = 1875MHz, fRF2 = 1876MHz, fLO = 1850MHz, PRF = PLO = 0dBm, fIM3 = 24MHz fRF1 = 1875MHz, fRF2 = 1876MHz, fLO = 1850MHz, PRF = PLO = 0dBm, fIM2 = 51MHz fBB = 25MHz fBB = 1MHz fBB = 1MHz fBB = 25MHz 1500 9.5 9.6 20.3 38 59 29.7 0.025 0.56 2300 MHz dB dB dB dBm dBm dBm dB Degrees CONDITIONS MIN TYP MAX UNITS
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX2023
Note 1: Note 2: Note 3: Note 4: TC is the temperature on the exposed paddle. Guaranteed by production test. VI/Q = 2.66VP-P differential CW input. No baseband drive input. Measured with the baseband inputs terminated in 50. At low output power levels, the output noise density is equal to the thermal noise floor. See Output Noise Density vs. Output Power plots in Typical Operating Characteristics. Note 5: The output noise vs. POUT curve has the slope of LO noise (Ln dBc/Hz) due to reciprocal mixing. Measured at 10MHz offset from carrier. Note 6: The LO noise (L = 10(Ln/10)), determined from the modulator measurements can be used to deduce the noise figure underblocking at operating temperature (TP in Kelvin), fBLOCK = 1 + (LCN - 1) TP / TO + LPBLOCK / (1000kTO), where TO = 290K, PBLOCK in mW, k is Boltzmann's constant = 1.381 x 10(-23) J/K, and LCN = 10(LC/10), LC is the conversion loss. Noise figure underblocking in dB is NFBLOCK = 10 x log (fBLOCK). Refer to Application Note 3632.
Typical Operating Characteristics
(MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source (modulator), VBBI = VBBQ = 2.6VP-P differential (modulator), PRF = +6dBm (demodulator), I/Q differential output drives 50 differential load (demodulator), 0V common-mode input/output, PLO = 0dBm, 1500MHz fLO 2300MHz, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 300, TC = -40C to +85C. Typical values are at VCC = +5V, fLO = 1850MHz, TC = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. TEMPERATURE (TC)
MAX2023 toc01
MODULATOR SINGLE-SIDEBAND SUPPRESSION vs. LO FREQUENCY
MAX2023 toc02
MODULATOR SINGLE-SIDEBAND SUPPRESSION vs. LO FREQUENCY
65 SIDEBAND REJECTION (dBc) 60 55 50 45 40 35 30 25 20 VCC = 4.75V VCC = 5.25V VCC = 5V
MAX2023 toc03
400 380 360 SUPPLY CURRENT (mA) 340 320 300 280 260 240 220 200 -40 -15 10 35 TEMPERATURE (C) 60 VCC = 4.75V VCC = 5V VCC = 5.25V
70 65 SIDEBAND REJECTION (dBc) 60 55 50 45 40 35 30 25 20 PLO = +3dBm PLO = 0dBm PLO = -3dBm
70
85
1.5
1.6
1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz)
2.2
2.3
1.5
1.6
1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz)
2.2
2.3
MODULATOR SINGLE-SIDEBAND SUPPRESSION vs. LO FREQUENCY
MAX2023 toc04
MODULATOR OUTPUT IP3 vs. LO FREQUENCY
MAX2023 toc05
MODULATOR OUTPUT IP3 vs. LO FREQUENCY
28 26 OUTPUT IP3 (dBm) 24 22 20 18 16 14 VCC = 4.75V, 5V, 5.25V f1 = 1.8MHz f2 = 1.9MHz
MAX2023 toc06
70 65 SIDEBAND REJECTION (dBc) 60 55 50 45 40 35 30 25 20 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 TC = -40C TC = +25C TC = +85C
30 28 26 OUTPUT IP3 (dBm) 24 22 20 18 16 14 12 10 TC = -40C TC = +85C f1 = 1.8MHz f2 = 1.9MHz 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 TC = +25C
30
12 10 2.3 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3
2.3
4
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod
Typical Operating Characteristics (continued)
(MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source (modulator), VBBI = VBBQ = 2.6VP-P differential (modulator), PRF = +6dBm (demodulator), I/Q differential output drives 50 differential load (demodulator), 0V common-mode input/output, PLO = 0dBm, 1500MHz fLO 2300MHz, 50 LO and RF system impedance, R1 = 432,
MODULATOR OUTPUT IP3 vs. LO FREQUENCY
MAX2023 toc07
MAX2023
MODULATOR OUTPUT IP3 vs. I/Q COMMON-MODE VOLTAGE
25.5 25.0 OUTPUT IP2 (dBm) OUTPUT IP3 (dBm) 24.5 24.0 23.5 23.0 22.5 22.0 55 50 -3.5 -2.5 -1.5 -0.5 0.5 1.5 2.5 I/Q COMMON-MODE VOLTAGE (V) 3.5 1.5 1.6 70 65 60 f1 = 1.8MHz f2 = 1.9MHz
MAX2023 toc08
MODULATOR OUTPUT IP2 vs. LO FREQUENCY
TC = +85C
MAX2023 toc09
30 28 26 OUTPUT IP3 (dBm) 24 22 20 18 16 14 12 10 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 PLO = -3dBm PLO = +3dBm PLO = 0dBm f1 = 1.8MHz f2 = 1.9MHz
26.0
80 75 TC = +25C
TC = -40C f1 = 1.8MHz f2 = 1.9MHz 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3
2.3
MODULATOR OUTPUT IP2 vs. LO FREQUENCY
MAX2023 toc10
MODULATOR OUTPUT IP2 vs. LO FREQUENCY
MAX2023 toc11
MODULATOR OUTPUT IP2 vs. I/Q COMMON-MODE VOLTAGE
67 66 OUTPUT IP2 (dBm) 65 64 63 62
MAX2023 toc12
80 VCC = 5.25V 75 OUTPUT IP2 (dBm) 70 65 60 VCC = 4.75V 55 50 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 f1 = 1.8MHz f2 = 1.9MHz VCC = 5V
80 75 PLO = -3dBm OUTPUT IP2 (dBm) 70 65 60 55 50 PLO = +3dBm f1 = 1.8MHz f2 = 1.9MHz 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 PLO = 0dBm
68
61 60 -3.5
f1 = 1.8MHz f2 = 1.9MHz -2.5 -1.5 -0.5 0.5 1.5 2.5 I/Q COMMON-MODE VOLTAGE (V) 3.5
2.3
2.3
MODULATOR OUTPUT POWER vs. INPUT POWER
MAX2023 toc13
MODULATOR OUTPUT POWER vs. INPUT POWER
18 16 OUTPUT POWER (dBm) 14 12 10 8 6 4 2 0 2 10 12 14 16 18 20 22 24 26 28 30 INPUT POWER (dBm) 1.5 PLO = -3dBm PLO = +3dBm PLO = 0dBm
MAX2023 toc14
MODULATOR OUTPUT POWER vs. LO FREQUENCY
MAX2023 toc15
20 18 16 OUTPUT POWER (dBm) 14 12 10 8 6 4 2 0 VCC = 4.75V, 5V, 5.25V
20
8 7 OUTPUT POWER (dBm) 6 5 TC = +25C 4 TC = +85C 3 TC = -40C
10 12 14 16 18 20 22 24 26 28 30 INPUT POWER (dBm)
1.6
1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz)
2.2
2.3
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX2023
Typical Operating Characteristics (continued)
(MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source (modulator), VBBI = VBBQ = 2.6VP-P differential (modulator), PRF = +6dBm (demodulator), I/Q differential output drives 50 differential load (demodulator), 0V common-mode input/output, PLO = 0dBm, 1500MHz fLO 2300MHz, 50 LO and RF system impedance, R1 = 432,
MODULATOR OUTPUT POWER vs. BASEBAND FREQUENCY
MAX2023 toc16
MODULATOR LO LEAKAGE vs. LO FREQUENCY
MAX2023 toc17
MODULATOR LO LEAKAGE vs. LO FREQUENCY
PRF = -1dBm, LO LEAKAGE NULLED AT TA = +25C TC = -40C
MAX2023 toc18 MAX2023 toc24 MAX2023 toc21
-5 -6 -7 OUTPUT POWER (dBm) -8 -9 -10 -11 -12 -13 -14 -15 0 10 20 30 40 50 60 BASEBAND FREQUENCY (MHz) fLO - fBB fLO + fBB PI/Q-COMBINED = 0dBm
-40 -50 LO LEAKAGE (dBm) -60 -70 -80 -90 PRF = -1dBm -100 PRF = -7dBm LO LEAKAGE NULLED AT PRF = -1dBm PRF = -40dBm PRF = +5dBm
-40 -50 LO LEAKAGE (dBm) -60 -70 -80 TC = +85C -90 TC = +25C -100
70
1.80
1.82
1.84 1.86 1.88 LO FREQUENCY (GHz)
1.90
1.80
1.82
1.84 1.86 1.88 LO FREQUENCY (GHz)
1.90
MODULATOR LO LEAKAGE vs. LO FREQUENCY
MAX2023 toc19
MODULATOR OUTPUT NOISE DENSITY vs. OUTPUT POWER
MAX2023 toc20
MODULATOR OUTPUT NOISE DENSITY vs. OUTPUT POWER
-150 PLO = -3dBm OUTPUT NOISE DENSITY (dBm/Hz) -155 -160 -165 -170 -175 -180 PLO = +3dBm PLO = 0dBm
-40 PLO = -3dBm -50 LO LEAKAGE (dBm) -60 -70 -80 PLO = +3dBm -90
OUTPUT NOISE DENSITY (dBm/Hz)
PRF = -1dBm, LO LEAKAGE NULLED AT PLO = 0dBm
-150 -155 -160 -165 TC = +85C -170 -175 -180 TC = -40C -23 -18 TC = +25C -13 -8 -3 2 OUTPUT POWER (dBm) 7
PLO = 0dBm -100 1.80 1.82 1.84 1.86 1.88 LO FREQUENCY (GHz) 1.90
12
-23
-18
-13 -8 -3 2 OUTPUT POWER (dBm)
7
12
DEMODULATOR CONVERSION LOSS vs. LO FREQUENCY
MAX2023 toc22
DEMODULATOR INPUT IP3 vs. LO FREQUENCY
MAX2023 toc23
DEMODULATOR INPUT IP3 vs. LO FREQUENCY
45 43 41 39 INPUT IP3 (dBm) 37 35 33 31 29 TC = -40C f1 = fLO + 25MHz f2 = fLO + 26MHz 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3 TC = +25C TC = +85C
12.0 11.5 CONVERSION LOSS (dB) 11.0 10.5 10.0 9.5 9.0 8.5 8.0 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 TC = +25C TC = -40C TC = +85C
45 43 41 39 INPUT IP3 (dBm) 37 35 33 31 29 27 25 f1 = fLO + 25MHz f2 = fLO + 26MHz 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 PLO = -3dBm PLO = 0dBm PLO = +3dBm
27 25 2.3
2.3
6
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX2023
Typical Operating Characteristics (continued)
(MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source (modulator), VBBI = VBBQ = 2.6VP-P differential (modulator), PRF = +6dBm (demodulator), I/Q differential output drives 50 differential load (demodulator), 0V common-mode input/output, PLO = 0dBm, 1500MHz fLO 2300MHz, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 300, TC = -40C to +85C. Typical values are at VCC = +5V, fLO = 1850MHz, TC = +25C, unless otherwise noted.)
DEMODULATOR INPUT IP2 vs. LO FREQUENCY
MAX2023 toc25
DEMODULATOR I/Q PHASE IMBALANCE vs. LO FREQUENCY
MAX2023 toc26
DEMODULATOR I/Q AMPLITUDE IMBALANCE vs. LO FREQUENCY
MAX2023 toc27
80 TC = +25C 75 INPUT IP2 (dBm) 70 TC = +85C 65 60 55 TC = -40C 50 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 f1 = fLO + 25MHz f2 = fLO + 26MHz
6 5 I/Q PHASE IMBALANCE (deg) 4 PLO = +3dBm 3 PLO = 0dBm 2 1 0 PLO = -3dBm PLO = -6dBm
0.07 I/Q AMPLITUDE IMBALANCE (dB) 0.06 PLO = +3dBm 0.05 0.04 0.03 0.02 0.01 0 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 PLO = -6dBm PLO = -3dBm PLO = 0dBm
2.3
1.5
1.6
1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz)
2.2
2.3
2.3
LO PORT RETURN LOSS
12 14 RETURN LOSS (dB) 16 18 20 22 24 26 28 30 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3 40 1.5 1.6 PLO = -6dBm PLO = +3dBm PLO = 0dBm PLO = -3dBm
MAX2023 toc28
RF PORT RETURN LOSS
MAX2023 toc29
10
10 15 RETURN LOSS (dB) 20 25 PLO = -6dBm, -3dBm, 0dBm, +3dBm 30 35
1.7 1.8 1.9 2.0 2.1 RF FREQUENCY (GHz)
2.2
2.3
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX2023
Pin Description
PIN 1, 5, 9-12, 14, 16-19, 22, 24, 27-30, 32, 34, 35, 36 2 3 4 6 7 8 13 15 20 21 23 25 26 31 33 EP NAME GND Ground FUNCTION
RBIASLO3 3rd LO Amplifier Bias. Connect a 300 resistor to ground. LO Input Buffer Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1F VCCLOA capacitors as close to the pin as possible. LO Local Oscillator Input. 50 input impedance. Requires a DC-blocking capacitor. RBIASLO1 1st LO Input Buffer Amplifier Bias. Connect a 432 resistor to ground. N.C. No Connection. Leave unconnected. RBIASLO2 2nd LO Amplifier Bias. Connect a 562 resistor to ground. I-Channel 1st LO Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1F VCCLOI1 capacitors as close to the pin as possible. I-Channel 2nd LO Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1F VCCLOI2 capacitors as close to the pin as possible. BBI+ Baseband In-Phase Noninverting Port BBIBaseband In-Phase Inverting Port RF RF Port. This port is matched to 50. Requires a DC-blocking capacitor. BBQBaseband Quadrature Inverting Port BBQ+ Baseband Quadrature Noninverting Port Q-Channel 2nd LO Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1F VCCLOQ2 capacitors as close to the pin as possible. Q-Channel 1st LO Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1F VCCLOQ1 capacitors as close to the pin as possible. Exposed Ground Paddle. The exposed paddle MUST be soldered to the ground plane GND using multiple vias.
Detailed Description
The MAX2023 is designed for upconverting differential in-phase (I) and quadrature (Q) inputs from baseband to a 1500MHz to 2300MHz RF frequency range. The device can also be used as a demodulator, downconverting an RF input signal directly to baseband. Applications include single and multicarrier 1500MHz to 2300MHz DCS/PCS EDGE, UMTS/WCDMA, cdma2000, and PHS/PAS base stations. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based double-conversion systems. The MAX2023 integrates internal baluns, an LO buffer, a phase splitter, two LO driver amplifiers, two matched double-balanced passive mixers, and a wideband quadrature combiner. The MAX2023's high-linearity mixers, in conjunction with the part's precise in-phase and quadrature channel matching, enable the device to possess excellent dynamic range, ACLR, 1dB compression point, and LO and sideband suppression characteristics. These features make the MAX2023 ideal for single-carrier GSM and multicarrier WCDMA operation.
8
LO Input Balun, LO Buffer, and Phase Splitter
The MAX2023 requires a single-ended LO input, with a nominal power of 0dBm. An internal low-loss balun at the LO input converts the single-ended LO signal to a differential signal at the LO buffer input. In addition, the internal balun matches the buffer's input impedance to 50 over the entire band of operation. The output of the LO buffer goes through a phase splitter, which generates a second LO signal that is shifted by 90 with respect to the original. The 0 and 90 LO signals drive the I and Q mixers, respectively.
LO Driver
Following the phase splitter, the 0 and 90 LO signals are each amplified by a two-stage amplifier to drive the I and Q mixers. The amplifier boosts the level of the LO signals to compensate for any changes in LO drive levels. The two-stage LO amplifier allows a wide input power range for the LO drive. The MAX2023 can tolerate LO level swings from -3dBm to +3dBm.
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod
I/Q Modulator
The MAX2023 modulator is composed of a pair of matched double-balanced passive mixers and a balun. The I and Q differential baseband inputs accept signals from DC to 450MHz with differential amplitudes up to 4VP-P. The wide input bandwidths allow operation of the MAX2023 as either a direct RF modulator or as an image-reject mixer. The wide common-mode compliance range allows for direct interface with the baseband DACs. No active buffer circuitry is required between the baseband DACs and the MAX2023 for wideband applications. The I and Q signals directly modulate the 0 and 90 LO signals and are upconverted to the RF frequency. The outputs of the I and Q mixers are combined through a balun to produce a singled-ended RF output. MAX5895 dual interpolating DAC. These DACs have ground-referenced differential current outputs. Typical termination of each DAC output into a 50 load resistor to ground, and a 10mA nominal DC output current results in a 0.5V common-mode DC level into the modulator I/Q inputs. The nominal signal level provided by the DACs will be in the -12dBm range for a single CDMA or WCDMA carrier, reducing to -18dBm per carrier for a four-carrier application. The I/Q input bandwidth is greater than 450MHz at -0.5dB response. The direct connection of the DAC to the MAX2023 ensures the maximum signal fidelity, with no performance-limiting baseband amplifiers required. The DAC output can be passed through a lowpass filter to remove the image frequencies from the DAC's output response. The MAX5895 dual interpolating DAC can be operated at interpolation rates up to x8. This has the benefit of moving the DAC image frequencies to a very high, remote frequency, easing the design of the baseband filters. The DAC's output noise floor and interpolation filter stopband attenuation are sufficiently good to ensure that the 3GPP noise floor requirement is met for large frequency offsets, 60MHz for example, with no filtering required on the RF output of the modulator. Figure 1 illustrates the ease and efficiency of interfacing the MAX2023 with a Maxim DAC, in this case the MAX5895 dual 16-bit interpolating-modulating DAC.
MAX2023 MAX2023
Applications Information
LO Input Drive
The LO input of the MAX2023 is internally matched to 50, and requires a single-ended drive at a 1500MHz to 2300MHz frequency range. An integrated balun converts the singled-ended input signal to a differential signal at the LO buffer differential input. An external DC-blocking capacitor is the only external part required at this interface. The LO input power should be within the -3dBm to +3dBm range. An LO input power of 0dBm is recommended for best overall peformance.
Baseband I/Q Input Drive
Drive the MAX2023 I and Q baseband inputs differentially for best performance. The baseband inputs have a 50 differential input impedance. The optimum source impedance for the I and Q inputs is 100 differential. This source impedance achieves the optimal signal transfer to the I and Q inputs, and the optimum output RF impedance match. The MAX2023 can accept input power levels of up to +20dBm on the I and Q inputs. Operation with complex waveforms, such as CDMA carriers or GSM signals, utilize input power levels that are far lower. This lower power operation is made necessary by the high peak-to-average ratios of these complex waveforms. The peak signals must be kept below the compression level of the MAX2023. The input common-mode voltage should be confined to the -3.5V to +3.5V DC range.
MAX5895 DUAL 16-BIT INTERP DAC BBI FREQ 50
MAX2023
50 RF MODULATOR
I/Q GAIN AND OFFSET ADJUST
LO
0 90
50
BBQ
FREQ
WCDMA Transmitter Applications
The MAX2023 is designed to interface directly with Maxim high-speed DACs. This generates an ideal total transmitter lineup, with minimal ancillary circuit elements required for widespread applications. Such DACs include the MAX5875 series of dual DACs, and the
50
Figure 1. MAX5895 DAC Interfaced with MAX2023 for cdma2000 and WCDMA Base Stations
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX2023
MAX5873 DUAL DAC MAX4395 QUAD AMP
MAX2021/MAX2023
MAX2058/MAX2059 RF DIGITAL VGAs
I 12 0 90 31dB 17dB 31dB
RFOUT
Q 12 SPI LOGIC
MAX9491 VCO + SYNTH
45, 80, OR 95MHz LO
LOOPBACK Rx OFF OUT (FEEDS BACK INTO Rx CHAIN FRONT-END)
SPI CONTROL
Figure 2. Complete Transmitter Lineup for GSM/EDGE DCS/PCS-Band Base Stations
The MAX5895 DAC has programmable gain and differential offset controls built in. These can be used to optimize the LO leakage and sideband suppression of the MAX2023 quadrature modulator.
cuit to meet the GSM system level noise requirements with no additional RF filters required, greatly simplifying the overall lineup. The output of the MAX2023 drives a MAX2059 RF VGA, which can deliver up to +15dBm of GSM carrier power and includes a very flexible digitally controlled attenuator with over 56dB of adjustment range. This accommodates the full static and dynamic power-control requirements, with extra range for lineup gain compensation.
GSM Transmitter Applications
The MAX2023 is an ideal modulator for a zero-IF (ZIF), single-carrier GSM transmitter. The device's wide dynamic range enables a very efficient overall transmitter architecture. Figure 2 illustrates the exceptionally simple complete lineup for a high-performance GSM/EDGE transmitter. The single-carrier GSM transmit lineup generates baseband I and Q signals from a simple 12-bit dual DAC such as the MAX5873. The DAC clock rate can be a multiple of the GSM system clock rate of 13MHz. The ground-referenced outputs of the dual DAC are filtered by simple discrete element lowpass filters to attenuate both the DAC images and the noise floor. The I and Q baseband signals are then level shifted and amplified by a MAX4395 quad operational amplifier, configured as a differential input/output amplifier. This amplifier can deliver a baseband power level of greater than +15dBm to the MAX2023, enabling very high RF output power levels. The MAX2023 will deliver up to +5dBm for GSM vectors with full conformance to the required system specifications with large margins. The exceptionally low phase noise of the MAX2023 allows the cir10
RF Output
The MAX2023 utilizes an internal passive mixer architecture that enables the device to possess an exceptionally low-output noise floor. With such architectures, the total output noise is typically a power summation of the theoretical thermal noise (kTB) and the noise contribution from the on-chip LO buffer circuitry. As demonstrated in the Typical Operating Characteristics, the MAX2023's output noise approaches the thermal limit of -174dBm/Hz for lower output power levels. As the output power increases, the noise level tracks the noise contribution from the LO buffer circuitry, which is approximately -165dBc/Hz. The I/Q input power levels and the insertion loss of the device determine the RF output power level. The input power is a function of the delivered input I and Q voltages to the internal 50 termination. For simple sinu-
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod
soidal baseband signals, a level of 89mVP-P differential on the I and the Q inputs results in a -17dBm input power level delivered to the I and Q internal 50 terminations. This results in an RF output power of -26.6dBm. become terminated in 25 (R/2). The RC network provides a path for absorbing the 2fLO and fLO leakage, while the inductor provides high impedance at fLO and 2fLO to help the diplexing process.
MAX2023
External Diplexer
LO leakage at the RF port can be nulled to a level less than -80dBm by introducing DC offsets at the I and Q ports. However, this null at the RF port can be compromised by an improperly terminated I/Q IF interface. Care must be taken to match the I/Q ports to the driving DAC circuitry. Without matching, the LO's second-order (2fLO) term may leak back into the modulator's I/Q input port where it can mix with the internal LO signal to produce additional LO leakage at the RF output. This leakage effectively counteracts against the LO nulling. In addition, the LO signal reflected at the I/Q IF port produces a residual DC term that can disturb the nulling condition. As demonstrated in Figure 3, providing an RC termination on each of the I+, I-, Q+, Q- ports reduces the amount of LO leakage present at the RF port under varying temperature, LO frequency, and baseband termination conditions. See the Typical Operating Characteristics for details. Note that the resistor value is chosen to be 50 with a corner frequency 1 / (2RC) selected to adequately filter the fLO and 2fLO leakage, yet not affecting the flatness of the baseband response at the highest baseband frequency. The common-mode fLO and 2fLO signals at I+/I- and Q+/Q- effectively see the RC networks and thus
RF Demodulator
The MAX2023 can also be used as an RF demodulator, downconverting an RF input signal directly to baseband. The single-ended RF input accepts signals from 1500MHz to 2300MHz with power levels up to +30dBm. The passive mixer architecture produces a conversion loss of typically 9.5dB. The downconverter is optimized for high linearity and excellent noise performance, typically with a +38dBm IIP3, an input P1dB of +29.7dBm, and a 9.6dB noise figure. A wide I/Q port bandwidth allows the port to be used as an image-reject mixer for downconversion to a quadrature IF frequency. The RF and LO inputs are internally matched to 50. Thus, no matching components are required, and only DC-blocking capacitors are needed for interfacing.
Power Scaling with Changes to the Bias Resistors
Bias currents for the LO buffers are optimized by fine tuning resistors R1, R2, and R3. Maxim recommends using 1%-tolerant resistors; however, standard 5% values can be used if the 1% components are not readily available. The resistor values shown in the Typical Application Circuit were chosen to provide peak performance for the entire 1500MHz to 2300MHz band. If desired, the current can be backed off from this nominal value by choosing different values for R1, R2, and R3. Contact the factory for additional details.
C = 2.2pF
50 I L = 11nH
MAX2023
RF MODULATOR
Layout Considerations
A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed paddle under the package. The PC board exposed paddle MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this paddle to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed paddle on the bottom of the device package to the PC board. The MAX2023 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com.
50
C = 2.2pF
LO
0 90
50 Q L = 11nH
50
C = 2.2pF
Figure 3. Diplexer Network Recommended for DCS 1800/ PCS 1900 EDGE Transmitter Applications
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX2023
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass all VCC_ pins with 22pF and 0.1F capacitors placed as close to the pins as possible, with the smallest capacitor placed closest to the device. To achieve optimum performance, use good voltagesupply layout techniques. The MAX2023 has several RF processing stages that use the various VCC_ pins, and while they have on-chip decoupling, off-chip interaction between them may degrade gain, linearity, carrier suppression, and output power-control range. Excessive coupling between stages may degrade stability.
Exposed Paddle RF/Thermal Considerations
The EP of the MAX2023's 36-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the IC is mounted be designed to conduct heat from this contact. In addition, the EP provides a low-inductance RF ground path for the device. The exposed paddle (EP) MUST be soldered to a ground plane on the PC board either directly or through an array of plated via holes. An array of 9 vias, in a 3 x 3 array, is suggested. Soldering the pad to ground is critical for efficient heat transfer. Use a solid ground plane wherever possible.
Pin Configuration/Functional Diagram
VCCLOQ1
GND
GND
VCCLOQ2
GND
GND 29
GND
GND
36 GND RBIASLO3 VCCLOA LO GND RBIASLO1 N.C. RBIASLO2 GND 1 2 3 4 5 6 7 8 9 10 GND
35
34
33
32
31
30
28 27 26 25 GND BBQ+ BBQGND RF GND BBIBBI+ GND
BIAS LO3
MAX2023
90 0
GND 24 23 22 21 20 19 18 GND
BIAS LO1
BIAS LO2
EP
11 GND
12 GND
13 VCCLOI1
14 GND
15 VCCLOI2
16 GND
17 GND
THIN QFN
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High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod
Typical Application Circuit
MAX2023 MAX2023
VCCLOQ1
VCC
C12 0.1F
C13 22pF VCCLOQ2
C10 22pF
C11 0.1F VCC
R3 300 GND RBIASLO3 VCC C2 0.1F C1 22pF C3 8pF VCCLOA LO GND RBIASLO1 R1 432 N.C. RBIASLO2 R2 562 GND 1 2 3 4 5 6 7 8 9
GND 36
GND 35
GND 34 33
GND 32
GND 30
GND 29 28
GND
31
BIAS LO3
MAX2023
27 26 25
GND BBQ+ BBQGND Q+ QC9 2pF RF
LO
90 0
24
23 RF BIAS LO1
22 21
GND BBIBBI+ GND II+
BIAS LO2
20 EP 19
10 GND VCC
11 GND
12 GND
13 VCCLOI1
14 GND
15 VCCLOI2
16 GND
17 GND
18 GND VCC
C5 0.1F
C6 22pF
C7 22pF
C8 0.1F
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT C1, C6, C7, C10, C13 C2, C5, C8, C11, C12 C3 C9 R1 R2 R3 VALUE 22pF 0.1F 8pF 2pF 432 562 300 DESCRIPTION 22pF 5%, 50V C0G ceramic capacitors (0402) 0.1F 10%, 16V X7R ceramic capacitors (0603) 8pF 0.25%, 50V C0G ceramic capacitor (0402) 2pF 0.1pF, 50V C0G ceramic capacitor (0402) 432 1% resistor (0402) 562 1% resistor (0402) 300 1% resistor (0402)
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information, go to www.maxim-ic.com/packages.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13
(c) 2006 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.
JACKSON
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