 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TIM3742-16UL TECHNICAL DATA FEATURES n HIGH POWER P1dB=42.5dBm at 3.7GHz to 4.2GHz n HIGH GAIN G1dB=10.5dB at 3.7GHz to 4.2GHz n BROAD BAND INTERNALLY MATCHED FET n HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS ( Ta= 25C ) CHARACTERISTICS Output Power at 1dB Compression Point Power Gain at 1dB Compression Point Drain Current Gain Flatness Power Added Efficiency 3rd Order Intermodulation Distortion Drain Current Channel Temperature Rise IDS2 Tch IDS1 G G1dB VDS= 10V dB A dB % Two-Tone Test Po= 31.5dBm (Single Carrier Level) (VDS X IDS + Pin - P1dB) X Rth(c-c) SYMBOL P1dB CONDITIONS UNIT dBm MIN. 41.5 9.5 -44 TYP. MAX. 42.5 10.5 4.4 37 -47 4.4 5.0 0.6 5.0 80 f = 3.7 to 4.2GHz add IM3 dBc A C Recommended gate resistance(Rg) : Rg= 100 (MAX.) ELECTRICAL CHARACTERISTICS ( Ta= 25C ) CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance SYMBOL gm VGSoff IDSS VGSO CONDITIONS VDS= 3V IDS= 6.0A VDS= 3V IDS= 60mA VDS= 3V VGS= 0V IGS= -200A UNIT mS V A V C/W MIN. -1.0 -5 TYP. MAX. 3600 -2.5 10.5 1.5 -4.0 1.8 Rth(c-c) Channel to Case u The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use, No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. Rev. Jun. 2006 TIM3742-16UL ABSOLUTE MAXIMUM RATINGS ( Ta= 25C ) CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 C) Channel Temperature Storage SYMBOL VDS VGS IDS PT Tch Tstg UNIT V V A W C C RATING 15 -5 14 83.3 175 -65 to +175 PACKAGE OUTLINE (2-16G1B) 0.70.15 4 - C1.0 (1) Unit in mm 2.5 MIN. (1) Gate (2) Source (3) Drain (2) (2) (3) 20.40.3 0.1 -0.05 24.5 MAX. 16.4 MAX. +0.1 2.5 MIN. 2.60.3 17.40.4 8.00.2 0.2 MAX. 1.40.3 HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260C. 2 2.40.3 5.5 MAX. TIM3742-16UL RF PERFORMANCE Output Power vs. Frequency 45 44 Po (dBm) 43 42 41 40 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 4.3 4.4 Frequency (GHz) VDS= 10V IDS 4.4A Pin= 32.0dBm Output Power vs. Input Power 45 44 43 42 P o (d Bm) 41 40 39 Aadd 38 37 36 25 27 29 31 33 35 20 10 0 f= 3.95GHz VDS= 10V IDS 4.4A 90 80 Po 70 60 50 40 30 Aadd (%) P i n ( dB m ) 3 TIM3742-16UL Power Dissipation vs. Case Temperature 100 80 60 PT (W) 40 20 0 0 40 80 Tc (*Z ) 120 160 200 IM3 vs. Output Power Characteristics - 20 VDS= 10V IDS 4.4A f= 3.95GHz f= 5MHz - 30 IM3 (dBc) - 40 - 50 - 60 27 29 31 33 35 37 Po(dBm), Single Carrier Level 4 |
Price & Availability of TIM3742-16UL
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |