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| www..com VND600P-E Double channel high-side solid state relay Features Type VND600P-E RDS(on) 35 m IOUT 25 A (1) VCC 36 V 1. Per channel with all the output pins connected to the PCB. CMOS-compatible input Proportional load current sense Shorted load protection Undervoltage and overvoltage shutdown Overvoltage clamp Thermal shutdown Current limitation Protection against loss of ground and loss of VCC Very low standby power dissipation Reverse battery protected SO-16L Description The VND600P-E is a double chip device designed in STMicroelectronicsTM VIPowerTM M0-3 technology. The device is intended for driving any type of load with one side connected to ground. The active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device integrates an analog current sense output which delivers a current proportional to the load current. The device automatically turns off in the case where the ground pin becomes disconnected. Table 1. Device summary Package SO-16L Order codes Tube VND600P-E Tape and reel VND600PTR-E July 2010 Doc ID 17749 Rev 1 1/26 www.st.com 1 www..com Contents VND600P-E Contents 1 2 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 2.2 2.3 2.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16 3.1.1 3.1.2 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 16 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 17 3.2 3.3 3.4 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 18 4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.1 SO-16L thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.1 5.2 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-16L packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2/26 Doc ID 17749 Rev 1 www..com VND600P-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 VCC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Current sense (9 V VCC 16 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO-16L mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Doc ID 17749 Rev 1 3/26 www..com List of figures VND600P-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Current and voltage conventions(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input low-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Maximum turn-off current versus inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SO-16L PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 19 Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Thermal fitting model of a quad channel HSD in SO-16L . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SO-16L package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-16L tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 SO-16L tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4/26 Doc ID 17749 Rev 1 www..com VND600P-E Block diagram and pin description 1 Block diagram and pin description Figure 1. Block diagram VCC OVERVOLTAGE VCC CLAMP UNDERVOLTAGE PwCLAMP 1 DRIVER 1 INPUT 1 LOGIC INPUT 2 GND DRIVER 2 ILIM1 Vdslim1 IOUT1 K Ot1 OUTPUT 1 CURRENT SENSE 1 OUTPUT 2 Ot2 PwCLAMP 2 Ot1 ILIM2 Vdslim2 IOUT2 OVERTEMP. 1 OVERTEMP. 2 Ot2 K CURRENT SENSE 2 Figure 2. Configuration diagram (top view) VCC N.C. GND INPUT 2 INPUT 1 C. SENSE 1 C. SENSE 2 VCC 1 16 VCC OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 1 OUTPUT 1 8 9 OUTPUT 1 VCC Table 2. Suggested connections for unused and not connected pins Current sense N.C. X Through 1 K resistor X Output X Input X Through 10 K resistor Connection / pin Floating To ground Doc ID 17749 Rev 1 5/26 www..com Electrical specifications VND600P-E 2 Electrical specifications Figure 3. Current and voltage conventions(1) IS1 VCC1 IIN1 INPUT1 VIN1 IIN2 VIN2 INPUT2 VCC1 VCC2 IOUT1 OUTPUT1 ISENSE1 IOUT2 OUTPUT2 VSENSE1 VOUT1 IS2 VF1 (*) VCC2 CURRENT SENSE 1 VOUT2 ISENSE2 VSENSE2 GROUND1 CURRENT SENSE 2 GROUND2 IGND1 IGND2 1. VFn = VCCn - VOUTn during reverse battery condition. 2.1 Absolute maximum ratings Stressing the device above the rating listed in the "Absolute maximum ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document. Table 3. Symbol VCC - VCC - Ignd IOUT - IOUT IIN VCSENSE DC supply voltage Reverse DC supply voltage DC reverse ground pin current DC output current Reverse DC output current DC input current Current Sense maximum voltage Electrostatic discharge (human body model: R = 1.5 K; C = 100 pF) - INPUT - CURRENT SENSE - OUTPUT - VCC Absolute maximum ratings Parameter Value 41 - 0.3 - 200 Internally limited - 21 +/- 10 -3 + 15 Unit V V mA A A mA V V VESD 4000 2000 5000 5000 V V V V 6/26 Doc ID 17749 Rev 1 www..com VND600P-E Table 3. Symbol Electrical specifications Absolute maximum ratings (continued) Parameter Maximum switching energy (L = 0.12 mH; RL= 0 ; Vbat = 13.5 V; Tjstart = 150 C; IL = 40 A) Power dissipation TC 25 C Junction operating temperature Case operating temperature Storage temperature Value Unit EMAX Ptot Tj Tc Tstg 136 8.3 Internally limited - 40 to 150 - 55 to 150 mJ W C C C 2.2 Thermal data Table 4. Symbol Rthj-lead Rthj-amb Thermal data (per island) Parameter Thermal resistance junction-lead Thermal resistance junction-ambient 2 Value 15 65(1) 48(2) Unit C/W C/W 1. When mounted on a standard single-sided FR-4 board with 0.5cm of Cu (at least 35 m thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. 2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 m thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. Doc ID 17749 Rev 1 7/26 www..com Electrical specifications VND600P-E 2.3 Electrical characteristics Values specified in this section are for 8 V < VCC < 36 V; -40 C < Tj < 150 C, unless otherwise stated. Table 5. Symbol VCC VUSD VOV(1) Power Parameter Operating supply voltage Undervoltage shutdown Overvoltage shutdown IOUT = 5 A; Tj = 25 C; Test conditions Min. 5.5 3 36 35 70 120 41 48 12 12 55 40 25 6 0 -75 50 0 5 3 Typ. 13 4 Max. Unit 36 5.5 V V V m m m V A A mA A A A A RON VCLAMP( 1) On-state resistance IOUT = 5 A; Tj = 150 C; IOUT = 3 A; VCC = 6 V Clamp voltage ICC = 20 mA Off-state; VCC = 13 V; VIN = VOUT = 0 V IS Supply current Off-state; VCC = 13 V; VIN = VOUT = 0 V; Tj = 25 C On-state; VCC = 13V; VIN = 5 V; IOUT = 0 A; RSENSE = 3.9 k IL(off1) IL(off2) IL(off3) IL(off4) Off-state output current Off-state output current Off-state output current Off-state output current VIN = VOUT = 0 V VIN = 0V; VOUT = 3.5 V VIN = VOUT = 0 V; VCC = 13 V; Tj = 125 C VIN = VOUT = 0 V; VCC = 13 V; Tj = 25 C 1. VCLAMP and VOV are correlated. Typical difference is 5 V. Table 6. Symbol td(on) td(off) Switching (VCC = 13 V) Parameter Turn-on delay time Turn-off delay time Test conditions RL = 2.6 (see Figure 4) RL = 2.6 (see Figure 4) Min. Typ. 30 30 See Figure 10 See Figure 12 Max. Unit s s V/s V/s dVOUT/dt(on) Turn-on voltage slope RL = 2.6 (see Figure 4) dVOUT/dt(off) Turn-off voltage slope RL = 2.6 (see Figure 4) Table 7. Symbol VF VCC output diode Parameter Forward on voltage Test conditions -IOUT = 2.3 A; Tj = 150 C Min. -- Typ. -- Max. 0.6 Unit V 8/26 Doc ID 17749 Rev 1 www..com VND600P-E Table 8. Symbol VIL IIL VIH IIH VI(hyst) VICL Electrical specifications Logic inputs Parameter Input low-level voltage Low-level input current Input high-level voltage High-level input current Input hysteresis voltage Input clamp voltage IIN = 1 mA IIN = - 1 mA VIN = 3.25 V 0.5 6 6.8 -0.7 8 VIN = 1.25 V 1 3.25 10 Test conditions Min. Typ. Max. 1.25 Unit V A V A V V V Table 9. Symbol K1 dK1/K1 Current sense (9 V VCC 16 V) Parameter IOUT/ISENSE Current sense ratio drift Test conditions IOUT = 0.5 A; VSENSE = 0.5 V; Tj = -40 C...150 C IOUT = 0.5A; VSENSE = 0.5V; Tj = -40 C...150 C IOUT = 5 A; VSENSE = 4 V; Tj = - 40 C Tj = 25 C...150 C IOUT = 5 A; VSENSE = 4 V; Tj = -40 C...150 C IOUT = 15 A; VSENSE = 4 V; Tj = -40 C Tj = 25C...150 C IOUT = 15 A; VSENSE = 4 V; Tj = -40 C...150 C VCC = 5.5 V; IOUT = 2.5 A; RSENSE = 10 k VCC > 8 V, IOUT = 5 A; RSENSE = 10 k Min. 3300 - 10 Typ. 4400 Max. 6000 + 10 % Unit K2 IOUT/ISENSE 4200 4400 -6 4900 4900 6000 5750 +6 % dK2/K2 Current sense ratio drift K3 IOUT/ISENSE 4200 4400 -6 2 4 4900 4900 5500 5250 +6 % V V dK3/K3 Current sense ratio drift VSENSE Max analog sense output voltage VSENSEH Sense voltage in V = 13 V; RSENSE = 3.9 k overtemperature condition CC 5.5 V Analog sense output VCC = 13 V; Tj > TTSD; RVSENSEH impedance in overtemperature condition output open tDSENSE Current sense delay response To 90 % ISENSE(1) 400 500 s 1. Current sense signal delay after positive input slope. Doc ID 17749 Rev 1 9/26 www..com Electrical specifications Table 10. Symbol TTSD TR Thyst Ilim Vdemag VON VND600P-E Protections(1) Parameter Shutdown temperature Reset temperature Thermal hysteresis Current limitation Turn-off output clamp voltage Output voltage drop limitation VCC = 13 V 5 V < VCC < 36 V IOUT = 2 A; VIN = 0 V; L = 6 mH IOUT = 0.5 A; Tj = -40 C...150 C Test conditions Min. 150 135 7 25 15 40 70 70 VCC - 41 VCC - 48 VCC - 55 50 Typ. 175 Max. 200 Unit C C C A A V mV 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and number of activation cycles. Table 11. Truth table Conditions Input L H L H L H L H L H H L H L Output L H L L L L L L L L L H H L Sense 0 Nominal 0 VSENSEH 0 0 0 0 0 (Tj Normal operation Overtemperature Undervoltage Overvoltage Short circuit to GND Short circuit to VCC Negative output voltage clamp 10/26 Doc ID 17749 Rev 1 www..com VND600P-E Table 12. ISO T/R 7637/1 Test pulse 1 2 3a 3b 4 5 I - 25 V(1) + 25 V(1) (1) Electrical specifications Electrical transient requirements Test level II - 50 V(1) + 50 V - 50 V (1) III - 75 V(1) + 75 V (1) (1) IV - 100 V(1) + 100 V - 150 V (1) Delays and impedance 2 ms, 10 0.2 ms, 10 0.1 s, 50 0.1 s, 50 100 ms, 0.01 400 ms, 2 - 25 V (1) - 100 V (1) + 25 V(1) -4 V(1) (1) + 50 V(1) -5V (1) (2) + 75 V(1) -6V (1) (2) + 100 V(1) -7V (1) (2) + 26.5 V + 46.5 V + 66.5 V + 86.5 V 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device. Figure 4. Switching characteristics VOUT 80% dVOUT/dt(on) tr ISENSE 90% 10% 90% dVOUT/dt(off) tf t INPUT tDSENSE t td(off) td(on) t Doc ID 17749 Rev 1 11/26 www..com Electrical specifications Figure 5. IOUT/ISENSE VND600P-E IOUT/ISENSE versus IOUT 6500 6000 max.Tj=-40C 5500 5000 4500 4000 3500 3000 max.Tj=25...150C typical value min.Tj=25...150C min.Tj=-40C 0 2 4 6 8 IOUT (A) 10 12 14 16 12/26 Doc ID 17749 Rev 1 www..com VND600P-E Figure 6. Waveforms NORMAL OPERATION INPUT LOAD CURRENT SENSE Electrical specifications UNDERVOLTAGE VCC INPUT LOAD CURRENT SENSE OVERVOLTAGE VOV VUSD VUSDhyst VCC INPUT LOAD CURRENT SENSE VCC > VUSD VOVhyst SHORT TO GROUND INPUT LOAD CURRENT LOAD VOLTAGE SENSE SHORT TO VCC INPUT LOAD VOLTAGE LOAD CURRENT SENSE ISENSE= VSENSEH RSENSE TTSD TR Doc ID 17749 Rev 1 13/26 www..com Electrical specifications VND600P-E 2.4 Figure 7. 2.5 2.25 2 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 Electrical characteristics curves Off-state output current Figure 8. Iih (uA) 5 4.5 High-level input current IL(off1) (uA) Off state Vcc=36V Vin=Vout=0V 4 3.5 3 2.5 2 1.5 1 0.5 0 Vin=3.25V -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Figure 9. Vicl (V) 10 9.5 9 8.5 8 7.5 Input clamp voltage Figure 10. Turn-on voltage slope dVout/dt(on) (V/ms) 700 650 Iin=1mA 600 550 500 450 Vcc=13V Rl=1.3Ohm 7 6.5 6 5.5 5 -50 -25 0 25 50 75 100 125 150 175 400 350 300 250 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Figure 11. Vov (V) 50 48 46 44 42 40 38 36 34 32 30 -50 Overvoltage shutdown Figure 12. Turn-off voltage slope dVout/dt(off) (V/ms) 600 550 Ri=6.5Ohm 500 450 400 350 300 250 200 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) 14/26 Doc ID 17749 Rev 1 www..com VND600P-E Figure 13. ILIM vs Tcase Ilim (A) 20 18 16 14 12 10 8 6 4 2 0 -50 -25 0 25 50 75 100 125 150 175 10 0 5 10 15 20 50 40 30 20 Electrical specifications Figure 14. On-state resistance vs VCC Ron (mOhm) 80 70 Vcc=13V 60 Iout=5A Tc= 150C Tc= 25C Tc= - 40C 25 30 35 40 Tc (C) Vcc (V) Figure 15. Input high-level Vih (V) 3.6 3.4 3.2 Figure 16. Input hysteresis voltage Vhyst (V) 1.5 1.4 1.3 1.2 3 2.8 2.6 2.4 1.1 1 0.9 0.8 0.7 2.2 2 -50 -25 0 25 50 75 100 125 150 175 0.6 0.5 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Figure 17. On-state resistance vs Tcase Ron (mOhm) 100 90 80 70 60 50 40 30 Figure 18. Input low-level Vil (V) 2.6 2.4 Iout=5A Vcc=8V & 36V 2.2 2 1.8 1.6 1.4 20 10 0 -75 -50 -25 0 25 50 75 100 125 150 175 1.2 1 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Doc ID 17749 Rev 1 15/26 www..com Application information VND600P-E 3 Application information Figure 19. Application schematic +5V Rprot INPUT1 VCC1 VCC2 Dld Rprot Rprot C. SENSE 1 INPUT2 OUTPUT1 C Rprot C. SENSE 2 OUTPUT2 GND1 GND2 RSENSE1,2 VGND RGND DGND 3.1 3.1.1 GND protection network against reverse battery Solution 1: resistor in the ground line (RGND only) This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1. 2. RGND 600 mV / (IS(on)max) RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. Power Dissipation in RGND (when VCC < 0: during reverse battery situations) is: PD = (-VCC)2/ RGND This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not shared by the device ground then the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift varies depending on how many devices are ON in the case of several highside drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see below). 16/26 Doc ID 17749 Rev 1 www..com VND600P-E Application information 3.1.2 Solution 2: diode (DGND) in the ground line A resistor (RGND = 1 k) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (600 mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift not varies if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected. 3.2 Load dump protection Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 3.3 MCU I/Os protection If a ground protection network is used and negative transient are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/O pins to latch-up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak = -100 V and Ilatchup 20 mA; VOHC 4.5 V 5 k Rprot 65 k. Recommended values: Rprot =10 k. Doc ID 17749 Rev 1 17/26 www..com Application information VND600P-E 3.4 Maximum demagnetization energy (VCC = 13.5 V) Figure 20. Maximum turn-off current versus inductance(1) ILMAX (A) 100 A B 10 C 1 0.01 0.1 1 L(mH) 10 100 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t 1. Values are generated with RL =0 . In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. 18/26 Doc ID 17749 Rev 1 www..com VND600P-E Package and PCB thermal data 4 4.1 Package and PCB thermal data SO-16L thermal data Figure 21. SO-16L PC board(1) 1. Layout condition of Rth and Zth measurements (PCB FR4 area = 41 mm x 48 mm, PCB thickness = 2 mm, Cu thickness = 35 m, Copper areas: 0.5 cm2, 6 cm2). Figure 22. Rthj-amb vs PCB copper area in open box free air condition 70 65 60 55 50 45 40 RTH j-amb (C/W) 0 1 2 3 4 5 6 7 PCB Cu heatsink area (cm^2) Doc ID 17749 Rev 1 19/26 www..com Package and PCB thermal data Figure 23. Thermal impedance junction ambient single pulse VND600P-E ZT H (C/W) 1000 100 Footprint 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 T ime (s) 10 100 1000 Equation 1: pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T Figure 24. Thermal fitting model of a quad channel HSD in SO-16L Tj_1 Pd1 C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Tj_2 C1 C2 R1 Pd2 R2 T_amb 20/26 Doc ID 17749 Rev 1 www..com VND600P-E Table 13. Thermal parameters Area / island (cm2) R1 (C/W) R2 (C/W) R3 (C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C) Package and PCB thermal data Footprint 0.05 0.3 2.2 12 15 37 0.001 5E-03 0.02 0.3 1 3 6 22 5 Doc ID 17749 Rev 1 21/26 www..com Package and packing information VND600P-E 5 5.1 Package and packing information ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 25. SO-16L package dimensions 22/26 Doc ID 17749 Rev 1 www..com VND600P-E Table 14. SO-16L mechanical data Package and packing information mm. DIM. Min. A a1 a2 b b1 C c1 D E e e3 F L M S 8 (max.) 7.4 0.5 10.1 10.0 1.27 8.89 7.6 1.27 0.75 0.35 0.23 0.5 45 (typ.) 10.5 10.65 0.1 Typ. Max. 2.65 0.2 2.45 0.49 0.32 Doc ID 17749 Rev 1 23/26 www..com Package and packing information VND600P-E 5.2 SO-16L packing information Figure 26. SO-16L tube shipment (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) All dimensions are in mm. A C B 50 1000 532 3.5 13.8 0.6 Figure 27. SO-16L tape and reel shipment (suffix "TR") Reel dimensions Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 16.4 60 22.4 Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 16 4 12 1.5 1.5 7.5 6.5 2 End All dimensions are in mm. Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components 24/26 Doc ID 17749 Rev 1 www..com VND600P-E Revision history 6 Revision history Table 15. Date 20-Jul-2010 Document revision history Revision 1 Initial release. Changes Doc ID 17749 Rev 1 25/26 www..com VND600P-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 26/26 Doc ID 17749 Rev 1 |
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