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| Surface Mount Lensed High Performance Chip LEDs Technical Data SunPower Series HSMA-L640 HSMC-L640 HSMJ-L640 HSML-L640 Features * High Brightness AlInGaP Material * Four Colors Available * Compatible with IR Solder Process * Narrow Viewing Angle * Small 3.0 x 1.5 mm Package * Available in 8 mm Tape on 7" (180 mm) Diameter Reels Description The HSMx-L640 is a Chip LED with an integrated lens. The lens concentrates the emitted light into a narrow viewing angle, which has the effect of doubling the on-axis intensity. These LEDs are optimum for light piping, backlighting buttons and switches, and applications, where as much flux as possible is required on axis. These LEDs utilize aluminum indium gallium phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors are 590 nm Amber, 605 nm Orange, 615 nm Red-Orange, and 626 nm Red. The 3.0 x 1.5 mm package closely matches industry standard sizes for chip capacitors which makes it compatible with automated pick and place equipment. This package is compatible with IR and convective reflow soldering processes. Applications * * * * Keypad Backlighting Light Piping LCD Backlighting Front Panel Indicator Device Selection Guide Amber 590 nm HSMA-L640 Orange 605 nm HSML-L640 Red-Orange 615 nm HSMJ-L640 Red 626 nm HSMC-L640 2 Package Dimensions 1.5 1.5 0.6 1.3 3 2 1.8 1.6 CATHODE MARK TOLERANCES: 0.2 mm Notes: 1. Dimensions are in millimeters. 2. Tolerance, 0.2 mm Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current[3][4][5] Power Dissipation Reverse Current VF = 5 V Operating Temperature Range Storage Temperature Range[6] Value 30 81 100 -30 to +85 -40 to +100 Units mA mW A C C Notes: 3. Derate linearly as shown in Figure 4. 4. Drive currents between 1 mA and 30 mA are recommended for best long term performance. 5. Operating at currents below 1 mA is not recommended. Please contact your Agilent representative for further information. 6. Maximum temperature for tape and reel packaging is 60C. Optical Characteristics at TA = 25C Luminous Intensity IV (mcd) @IF 20 mA[7] Min. Typ. 63 130 63 130 63 100 63 100 Peak Wavelength peak (nm) Typ. 592 609 621 635 Color, Dominant Wavelength d[8] (nm) Typ. 590 605 615 626 Viewing Angle 21/2 Degrees[9] Typ. 70 70 70 70 Part Number HSMA-L640 HSML-L640 HSMJ-L640 HSMC-L640 Color Amber Orange Red / Orange Red Notes: 7. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern. 8. The dominant wavelength, d, is derived from the CIE Chromaticity diagram, and represents the perceived color of the device. 9. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3 Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) @ I F = 20 mA Typ. Max. 2.02 2.4 1.98 2.4 1.94 2.4 1.90 2.4 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 Capacitance C (pF) VF = 0 f = 1 MHz Typ. 40 40 40 40 Part Number HSMA-L640 HSML-L640 HSMJ-L640 HSMC-L640 Color Amber Orange Red / Orange Red Thermal Resistance RJ-PIN (C/W) 500 500 500 500 1.0 AMBER RELATIVE INTENSITY ORANGE RED/ORANGE RED 0.5 0 550 600 WAVELENGTH - nm 650 700 Figure 1. Relative Intensity vs. Wavelength. 5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 mA) IF - FORWARD CURRENT - mA 100 50 20 10 5 2 1 0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4 3 2 1 0 0 5 10 15 20 25 VF - FORWARD VOLTAGE - V IF - FORWARD CURRENT - mA Figure 2. Forward Current vs. Forward Voltage. Figure 3. Relative Luminous Intensity vs. DC Forward Current. 4 35 IF - FORWARD CURRENT - mA 30 25 20 15 10 5 0 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum DC Current vs. Ambient Temperature. Luminous Intensity Bin Limits[10] Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Minimum (mcd) 0.10 0.16 0.25 0.40 0.63 1.00 1.60 2.50 4.00 6.30 10.00 16.00 25.00 40.00 63.00 100.00 160.00 250.00 400.00 630.00 1000.00 1600.00 2500.00 Maximum (mcd) 0.20 0.32 0.50 0.80 1.25 2.00 3.20 5.00 8.00 12.50 20.00 32.00 50.00 80.00 125.00 200.00 320.00 500.00 800.00 1250.00 2000.00 3200.00 5000.00 Note: 10. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information of currently available bins. 5 Amber Color Bins[10], [11] Bin ID A B C D H J Minimum (nm) 581.5 584.0 586.5 589.0 591.5 594.0 Maximum (nm) 585.0 587.5 590.0 592.5 595.0 597.5 Orange Color Bins[10], [11] Bin ID A B C D H Minimum (nm) 596.1 599.1 602.1 605.1 608.1 Maximum (nm) 600.9 603.9 606.9 609.9 612.9 Red-Orange Color Bins[10], [11] Bin ID A B Minimum (nm) 610.0 615.0 Maximum (nm) 617.0 621.0 Red Color Bins[10], [11] Bin ID A Minimum (nm) 621.0 Maximum (nm) 632.0 Notes: 10. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information of currently available bins. 11. Dominant wavelength. All products are shipped with one IV bin and one color bin per reel. 6 20 30 40 50 10 0 1.0 0.6 60 70 80 90 1.0 0.4 0.2 0.8 0.6 0.4 0.2 0 10 20 30 40 50 60 70 80 90 100 DEGREES RELATIVE INTENSITY Figure 5. Intensity vs. Angle. 1.6 4.4 10 SEC. MAX. 240C MAX. RELATIVE INTENSITY 1.6 0.8 TEMPERATURE 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. PWB CAMBER DIRECTION TOLERANCES: 0.2 mm Figure 6. Recommended SMT Reflow Soldering Profile. Figure 7. Recommended Solder Patterns. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling Orientation. 7 2 0.5 O 21 0.8 O 13.0 0.2 +1 O 60 - 0 11.4 1.0 +0 O 180 - 3 9 0.3 Figure 9. Reel Dimensions. 4 0.1 1.7 0.1 1.5 +0.1 0 CATHODE 0.2 0.05 1.75 0.1 3.5 0.05 3.35 0.1 8 0.3 1.8 2 0.05 4 0.1 USER DIRECTION OF FEED CENTER HOLE Figure 10. Tape Dimensions. END START Storage Condition: 5 to 30 C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours. THERE SHALL BE A MINIMUM OF 40 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 40 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 150 mm-360 mm MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. www.semiconductor.agilent.com Data subject to change. Copyright (c) 2000 Agilent Technologies, Inc. Obsoletes 5968-9898E 5980-2424E (8/00) |
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