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| CM1300 4 Channel EMI Filter Network Features * * * * * * * * * * Functionally and pin compatible with CSPRC032A OptiguardTM coated for improved reliability at assembly 4 EMI filter lines per device Filters attenuate to -30dB at 3GHz CSP package minimizes cross-talk 9-bump 2.485mm X 0.985mm Chip Scale Package (CSP), 0.5mm pitch 0.30mm Eutectic solder bumps Ultra small foot print suitable for portable devices Silicon substrate Lead-free version available Product Description The CM1300 is a 4-channel low pass EMI filter (R-C-R configuration) in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California Micro Devices' unique thin film technology provides a minimum of - 25dB of attenuation over this frequency band. The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. The pin-out for the device features a signal `flow through' design, allowing optimal signal routing. The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/ Ag/Cu for lead-free finish) and are 0.30 mm in diameter. The CM1300 incorporates OptiguardTM coating which results in improved reliability at assembly. The device is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Applications * * * * * * EMI filtering for RF sections of wireless devices Cellular phones Cordless phones Internet appliances PDAs Laptop computers Electrical Schematic A1 50 R 50 CR 43pF GND 50 CR 43pF GND B1 A2 50 R B2 B3 GND A4 50 R 50 CR 43pF B4 GND A5 50 R 50 CR 43pF GND (c) 2003 California Micro Devices Corp. All rights reserved. 11/11/03 B5 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 1 CM1300 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) BOTTOM VIEW (Bumps Up View) Orientation Marking (see note 2) 1 A B 2 3 4 5 A5 B5 A4 B4 B3 A2 B2 A1 B1 M003 CM1300 Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. Ordering Information PART NUMBERING INFORMATION Standard Finish Ordering Part Bumps 9 Package CSP Number1 CM1300-03CS Part Marking M003 Lead-free Finish 2 Ordering Part Number1 CM1300-03CP Part Marking M003 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range Power Rating per Resistor RATING -55 to +150 25 UNITS C mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C (c) 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 11/11/03 CM1300 ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL ILEAK R C TOLR TOLC TCR TCC FC PARAMETER Leakage Current, An or Bn to GND Resistance Capacitance Resistor Absolute Tolerance Capacitor Absolute Tolerance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Filter Cutoff Frequency , ZSOURCE=0 ZLOAD= ZSOURCE=50 ZLOAD=50 , R=50 C=43pF; , 74 82 MHz MHz R = 50 C=43pF CONDITIONS VIN=6.0V 45 34 50 43 MIN TYP MAX 1 55 52 +10 +20 +150 +500 UNITS A pF % % ppm/C ppm/C Note 1: Electrical Operating Characteristics are guaranteed over the Operating Temperature Range unless otherwise specified. Filter Performance CM1213 Filter Typical Measured Frequency Response (S21) Measurement The measurement is done with 50-source and 50-load impedance using a HP8753C Network Analyzer with a HP85047A S-parameter Test Set. CH1 S21 1og MAG 1 5 dB/ REF 0 dB Cor 2 H1d 1: -5.8017 dB 1.000 000 MHz 2: -8.8028 dB 82.026 MHz 3: -37.303 dB 1.82 GHz 4: -32.903 dB 3GHZ 3 dB 4 START .300 000 MHz STOP 3 000.000 000 MHz Frequency (c) 2003 California Micro Devices Corp. All rights reserved. 11/11/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 3 CM1300 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 1. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 2. Eutectic (SnPb) Solder Ball Reflow Profile (c) 2003 California Micro Devices Corp. All rights reserved. Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 11/11/03 CM1300 Mechanical Details The CM1300 devices are packaged in custom Chip Scale Packages (CSP). CM1300 9-bump CSP Mechanical Specifications The CM1300 devices are packaged in a 9-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams BOTTOM VIEW A1 C1 B1 B2 PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min 0.940 2.440 0.495 0.495 Nom 0.985 2.485 0.500 0.500 Max 1.030 2.530 0.505 0.505 Min Custom CSP 9 Inches Nom Max 0.0370 0.0388 0.0406 0.0961 0.0978 0.0996 0.0195 0.0197 0.0199 0.0195 0.0197 0.0199 3 2 1 OptiGuardTM Coating 5 4 A2 B A C2 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115 0.600 0.394 0.670 0.445 0.739 0.495 0.0236 0.0264 0.0291 0.0155 0.0175 0.0195 3500 pieces Controlling dimension: millimeters B A D1 0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS SIDE VIEW # per tape and reel Package Dimensions for CM1300 9-bump Chip Scale Package CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 2.62 X 1.12 X 0.762 Po Top Cover Tape PART NUMBER CM1300 PKG. SIZE (mm) 2.485 X 0.985 X 0.695 TAPE WIDTH W 8mm REEL DIA. 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Ao W Ko Bo For tape feeder reference only including draft. Concentric around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 4. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 11/11/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 5 |
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