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agilent HSDL-9001 miniature surface-mount ambient light photo diode data sheet description the HSDL-9001 is a low cost analog-output ambient light photo diode in lowest cost miniature quad-flat-no lead (qfn) lead-free surface mount package. it consists of a photodiode, which peaks in human luminosity curve at 550 nm. hence, it provides an excellent responsivity that is close to the response of human eyes, as shown in figure 2. it provides a design-alternative to the hsdl-9000 digital-output features excellent responsivity which peaks in the human luminosity curve at 550 nm close responsivity to the human eye miniature qfn surface-mount package height ?0.60 mm width ?2.00 mm depth ?1.50 mm infinite ambient light detection threshold control guaranteed temperature performance ?0 c to 85 c ? cc supply 2.7 to 3.6 v lead-free package applications detection of ambient light to control display backlighting mobile devices ?mobile phones, pdas computing devices ?notebooks, webpads consumer devices ?tvs, video cameras, digital still cameras daylight and artificial light exposed devices ambient light photo sensor with infinite ambient light detection threshold control. both the hsdl-9000 and HSDL-9001 are ideal for applications in which the measurement of ambient light is used to control display backlighting. mobile appliances such as the mobile phones and pdas that draw heavy current from the display backlighting will benefit from incorporating the hsdl-9000 and HSDL-9001 in their designs to reduce the power consumption significantly.
2 ordering information part number packaging type package quantity HSDL-9001 tape and reel 2-pin qfn package 2500 typical application circuit figure 1. typical application for HSDL-9001. i/o pins configuration table pin symbol i/o description notes 1 k o cathode 2 a i anode regulated, 2.7 to 3.6 volts figure 2. relative spectral response vs. wavelength. application support information the application engineering group is available to assist you with the application design associated with HSDL-9001 infrared transceiver module. you can contact them through your local sales representatives for additional details. + r f i l v o = -i l x r f r f c1 HSDL-9001 ? + k a ? 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 350 450 550 650 750 wavelength ? nm normalized responsivity 850 950 1050 hsdl-9000 silicon eye
3 absolute maximum ratings parameter symbol min. max. units storage temperature t s ?0 85 c operating temperature t a ?0 85 c supply voltage v cc 2.7 3.6 v recommended operating conditions parameter symbol min. max. units operating temperature t a ?0 85 c supply voltage v cc 2.7 3.6 v electrical & optical specifications specifications (min. & max. values) hold over the recommended operating conditions unless otherwise noted. unspecified test conditions may be anywhere in their operating range. all typical values (typ.) are at 25 c with v cc at 3.0 v unless otherwise noted. parameter symbol min. typ. max. units conditions active area diameter a d 0.65 mm 2 peak wavelength sensitivity p 550 nm v cc = 0 v light current i ph 125 na v cc = 3 v, e v = 100 lux [1] dark current i d 5nav b = 3 v breakdown voltage v b 15 v i b = 10 a switching time t r ,t f 2msv cc = 3 v, e v = 500 lux, r = 500 k ? [2] notes: 1. illuminance by cie standard light source (incandescent lamp). 2. fluorescent light is used as light source. however, white led is substituted in mass production. figure 3a. dark current vs. temperature. figure 3b. luminance vs. photocurrent. figure 4. switching characteristics. ambient temperature ( c) dark current (na) 0 100.0 10.0 1.0 0.1 10 20 30 40 50 60 70 80 90 100 luminance, e v (lux) photocurrent, iph (na) 0 700 600 500 400 300 200 100 0 100 200 300 400 500 600 700 load resistance (k ? ) switching time (ms) 0 80 70 60 50 40 30 20 10 0 500 1000 1500 2000 2500
4 HSDL-9001 package outline 0.6 0.1 1.2 0.1 0.4 0.1 0.8 0.1 1.5 0.1 2.0 0.1 package identification pin symbol 1 cathode 2 anode
5 HSDL-9001 tape and reel dimensions 1.13 0.1 3.5 0.05 2.72 0.1 2.39 0.1 4 0.1 0.75 0.1 0.25 0.02 4 0.5 2 0.5 progressive direction pin 2 : anode pin 1 : cathode empty (400 mm min.) (40 mm min.) (40 mm min.) leader parts mounted empty polarity 10.9 max 180 0.5 2.0 0.5 detail a detail a label label ? 13.0 0.2 24 0.5 ? 1.5 +0.1 0 62.5 0 -2.5 8.4 +2 0 8 +0.3 ? 0.1
6 moisture proof packaging all HSDL-9001 options are shipped in moisture proof package. once opened, moisture absorption begins. this part is compliant to jedec level 2a. baking conditions if the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. package temp. time in reels 60 c 20 hours in bulk 125 c 3 hours baking should only be done once. recommended storage conditions storage temperature 10 c to 30 c relative humidity below 60% rh time from unsealing to soldering after removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. if times longer than four weeks are needed, the parts must be stored in a dry box. figure 5. baking conditions chart. units in a sealed moisture-proof package package is opened (unsealed) environment less than 30 c, and less than 60% rh package is opened less than 672 hours perform recommended baking conditions no baking is necessary yes no no yes
7 figure 6. reflow graph. reflow profile the reflow profile is a straight- line representation of a nominal temperature profile for a con- vective reflow solder process. the temperature profile is divided into four process zones, each with different ? t/ ? time tempera- ture change rates. the ? t/ ? time rates detailed in the above table. the temperatures are measured at the component to printed circuit board connections. in process zone p1 , the pc board and i/o pins are heated to a temperature of 160 c to activate the flux in the solder paste. the temperature ramp up rate, r1, is limited to 4 c per second to allow for even heating of both the pc board and hsdl- 9001 i/o pins. process symbol ? t maximum ? t/ ? time heat up p1, r1 25 c to 160 c4 c/s solder paste dry p2, r2 160 c to 200 c 0.5 c/s solder reflow p3, r3 200 c to 255 c (260 c at 10 seconds max.) 4 c/s p3, r4 255 c to 200 c6 c/s cool down p4, r5 200 c to 25 c6 c/s process zone p2 should be of sufficient time duration (60 to ?20 seconds) to dry the solder paste. the temperature is raised to a level just below the liquidus point of the solder, usually 200 c (392 f). process zone p3 is the solder reflow zone. in zone p3, the temperature is quickly raised above the liquidus point of solder to 255 c (491 f) for optimum results. the dwell time above the liquidus point of solder should be between 20 and 60 seconds. it usually takes about 20 seconds to assure proper coalescence of the solder balls into liquid solder and the formation of good solder connections. beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. the temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200 c (392 f), to allow the solder within the connections to freeze solid. process zone p4 is the cool down after solder freeze. the cool down rate, r5, from the liquidus point of the solder to 25 c (77 f) should not exceed ? c per second maximum. this limitation is necessary to allow the pc board and transceiver? castellation i/o pins to change dimensions evenly, putting minimal stresses on the HSDL-9001. 0 t-time (seconds) t ? temperature ? ( c) 230 200 160 120 80 50 150 100 200 250 300 180 220 255 p1 heat up p2 solder paste dry p3 solder reflow p4 cool down 25 r1 r2 r3 r4 r5 60 sec. max. above 217 c max. 260 c
8 appendix a : smt assembly application note 1.0 solder pad, mask and metal stencil aperture figure 7. stencil and pcba. 1.1 recommended land pattern figure 8. recommended land pattern. 0.45 1.15 0.9 0.9 0.5 0.6 1.2 pin symbol 1 cathode 2 anode 2 1 mounting centre units: mm metal stencil for solder paste printing land pattern pcba stencil aperture solder mask
9 1.2 recommended metal solder stencil aperture it is recommended that only a 0.152 mm (0.006 inches) thick stencil be used for solder paste printing. this is to ensure adequate printed solder paste volume and no shorting. aperture opening for shield pad is as per land pattern. 1.3 adjacent land keepout and solder mask areas adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. there should be no other smd components within this area. the minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm . note: wet/liquid photo- imageable solder resist/mask is recommended. figure 10. adjacent land keepout and solder mask areas. figure 9. solder stencil aperture. 3.3 1.9 0.2 min. units: mm aperture as per land dimension 2.30 0.9 0.152
10 optical window dimensions to ensure that the performance of the HSDL-9001 will not be affected by improper window design, there are some con- straints on the dimensions and design of the window. there is a constraint on the minimum size of the window, which is placed in front of the photodiode, so that it will not affect the angular response of the HSDL-9001. this minimum dimension that is recommended will ensure at least a 35 light reception cone. if a smaller window is required, a light pipe or light guide can be used. a light pipe or light guide figure 12. recommended window design. appendix b: optical window design for HSDL-9001 is a cylindrical piece of transparent plastic which makes use of total internal reflection to focus the light. the thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. figure 12 illustrates the two types of window that we have recommended which could either be a flat window or a flat window with light pipe. window detector flat window with light pipe flat window
11 the table and figure below show the recommended dimensions of the window. these dimension values are based on a window thickness of 1.0 mm with a refractive index 1.585. the window should be placed directly on top of the photodiode to achieve better performance and if a flat window with a light wd: working distance between window front panel & HSDL-9001 d1: window diameter t: thickness l: length of light pipe d2: light pipe diameter z: distance between window rear panel and HSDL-9001 pipe is used, dimension d2 should be 1.5 mm (same size as the pin) to optimize the performance of HSDL-9001. recommended dimension for optical window flat window flat window with light pipe (l = 0.0) (d2 = 1.5; z = 0.5) zd1 d1l 1.5 0.5 2.25 2.0 1.0 3.25 2.5 1.5 4.25 3.0 5.00 5.00 2.5 1.5 all dimensions are in mm. wd (t+l+z) figure 13. recommended window dimensions. d1 photodiode HSDL-9001 z l wd top view d2 d1 t
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152 (domestic/interna- tional), or 0120-61-1280 (domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ?2005 agilent technologies, inc. obsoletes 5989-0615en january 21, 2005 5989-2299en recommended plastic material material number visible light transmission refractive index makrolon lq2647 87% 1.587 makrolon lq3147 87% 1.587 makrolon lq3187 85% 1.587 the recommended plastic material for use as a window is available from bayer ag and bayer antwerp n. v. (europe), bayer corp. (usa) and bayer polymers co., ltd. (thailand). optical window material the material of the window is recommended to be polycarbonate. the surface finish of the plastic should be smooth, without any texture.

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