lvg3330/p1/trs-xn doc. no : qw0905- rev. : date : - 2008 25 - dec. lvg3330/p1/trs-xn a data sheet ligitek electronics co.,ltd. property of ligitek only tape and reel type led lamps lead-free parts pb
t note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 25.0min 12.8 0.5 + - 1.0min 0.5 typ 2.54typ 5.9 5.0 7.6 8.6 1.5max d h1 p2 w2 p1 p w3 w1 f + - h h2 w0 l part no. lvg3330/p1/trs-xn package dimensions ligitek electronics co.,ltd. property of ligitek only page 1/6 lvg3330/p1
green diffused lvg3330/p1/trs-xn green gap2.6 30 1.7 565 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. emitted typical electrical & optical characteristics (ta=25 ) part nomaterial viewing angle 2 1/2 (deg) spectral halfwidth nm peak wave length pnm forward voltage @ ma(v) luminous intensity @20ma(mcd) lens color min.max. typ. min. 20 reverse current @5v operating temperature storage temperature power dissipation peak forward current duty 1/10@10khz forward current ir10 a -40 ~ +85 -40 ~ +100 t opr tstg pd i fp 100 mw 120 ma i f 30 ma absolute maximum ratings at ta=25 parameter ratings symbol vg unit part no. lvg3330/p1/trs-xn ligitek electronics co.,ltd. property of ligitek only page 2/6 509036
28.6 30.0 13.8 34.9 78.2 minimum remark:trs=tape and reel straight leads mm arbor hole diameter d3 iside reel flange thickness overall reel thickness t1 quantity/reel t2 core diameter reel diameter hub recess inside diameter d1 d2 d dimensions symbol information ? description symbol tape width adhesive tape position center of component location adhesive tape width feed hole location overall taped package thickness lead location feed hole to overall component height lead length after component height feed hole pitch front-to-rear deflection feed hole to bottom of component component lead pitch trs-10n0.72 18.40.76 19.4 inchmminch d1 d2 0.5438.11.5 1.1850.01.97 1000pcs 57.22.25 t2 t1 marking 1.371024.02 88.0 1.133.46 3.0838014.96 d package dimensions ? maxmum specification d3 w2 w3 ------- ------- 17.5 04.0 19.0 0.69 0 0.75 0.16 w0 ------- ------- w114.5 8.5 p2 ------- ------- t ------- 5.1 15.5 9.75 0.57 0.33 0.61 0.38 1.42 7.7 ------- 0.2 0.06 0.3 w0 ------- ------- p14.4 p12.4 h2 ------- ------- l ------- 5.8 13.0 0.17 0.49 0.23 0.51 36 11.0 ------- 0.43 1.42 ------- ------- h ------- 0.08 2.0 h1 trs-5n22.50.8923.50.93 trs-8n24.5 trs-9n 19.0 trs-7n trs-6n 24.0 19.9 0.961.0 25.5 20.0 0.750.79 25.0 20.9 0.94 0.78 0.98 0.82 trs-3n25.5 trs-4n 27.5 trs-2n trs-1n 21.5 17.5 1.026.51.04 28.5 1.081.12 18.5 22.5 0.85 0.69 0.89 0.73 ------- f2.33.0 0.090.12 tape feed hole diameter dimensions symbol information ? symbol items part no. lvg3330/p1/trs-xn option code ------- d3.8 mm 0.154.20.17 mm inchinch minimum symbol specifications maximum ligitek electronics co.,ltd. property of ligitek only 3/6 page
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 part no.lvg3330/p1/trs-xnpage4/6
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max 260 c3sec max 120 60 seconds max preheat 25 0 0 2 /sec max 50 260 temp( c) time(sec) 100 150 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile part no. lvg3330/p1/trs-xn page 5/6
1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec thermal shock test solder resistance test high temperature high humidity test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 part no. lvg3330/p1/trs-xn 6/6 page the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test item test condition description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only
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