p r oduct details dimension a dimension b dimension c dimension d inter f ace m a terial finish n o tes: d imension c = heat sink height from bottom of the base to the top of the ?n ?eld. a ts-59003-c1-r0 is a subsitute item available utilizing an equivalent phase change material (chomerics t766). thermal performance data are provided for reference onl y . actual performance may vary by application. a ts reserves the right to update or change its products without notice to improve th e design or performance. contact a ts to learn about custom options available. 1) 2) 3) 4) 5) t he r mal p er f o r mance f or mo r e in f o r m a tion, to ?nd a distributor or to place an o r de r , visit ww w .q a ts.com or call: 781.769.2800 (no r th america); +31 (0) 3569 84715 (eu r ope). a ts p art # a ts-59003-c2-r0 f e a tu r es & bene?ts custom high p er f o r mance cooling solutions w/ maxigrip? atta c hment rev2_111708 a ir v elocit y t hermal r esis t ance ft/min m/s c/w (unducted flow) c/w (ducted flow) 200 1.0 300 1.5 400 2.0 500 2.5 600 3.0 700 3.5 800 4.0 3.8 3 2.6 2.3 2.1 2 1.9 2.4 32 mm 50 mm 12 mm 71.3 mm black-anodized s aint - gobain c 1 100f designed for flip-chip processors such as freescale mpcs maxigrip? attachment applies stead y , even pressure to the component and does not require holes in the pcb comes preassembled with high performance, phase changing, thermal interface material ? ? ? c a b d *image above is for illustration purposes onl y .
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