12 - mar. - 2008 doc. no : qw0905-l rev. : date : a209b-1/x5eg-pf a data sheet la209b-1/x5eg-pf led array pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
1.9typ - + 0.5 typ 3.0 0.5 le45840/f181-pf lg45840/f181-pf 3.2 2.54typ 1.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. + 0.5 typ 1.5 max 29.5 0.5 - 1.9 4.0 1.9 ligitek electronics co.,ltd. property of ligitek only 17.3 e e 1.5 g 2.1 1.0 e e 4.6 2.2 0.5 2.54 e package dimensions la209b-1/x5eg-pf part no. 18.3 3.2 0.3 1/6 page
tstg note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. -40 ~ +100 typical electrical & optical characteristics (ta=25 ) storage temperature page 2/6 absolute maximum ratings -40 ~ +85 30 forward current i f operating temperature reverse current @5v t opr ir peak forward current duty 1/10@10khz power dissipation 120 i fp pd100 parameter g symbol absolute maximum ratings at ta=25 30 ma 10 a 120 ma 100 mw e unit ligitek electronics co.,ltd. property of ligitek only forward voltage @ ma(v) min. 1.7 1.7 green la209b-1/x5eg-pf gap green diffused56530 emitted part nomaterial peak wave length pnm lens color spectral halfwidth nm 78 8 2.6 4.5 2.6 12 8.078 viewing angle 2 1/2 (deg) typ. max.min. luminous intensity @10ma(mcd) 20 gaasp/gap orangeorange diffused 63545 part no. la209b-1/x5eg-pf
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 wavelength (nm) 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 10 1.0 1000 e chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 0.5 forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 700750 3/6 page part no. la209b-1/x5eg-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 4/6 page part no. la209b-1/x5eg-pf
dip soldering preheat: 120 c max preheat time: 120seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 25 0 0 2 /sec max 100 preheat 200 250 time(sec) 5 /sec max 260 c3sec max 120 260 temp( c) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 5/6 part no. la209b-1/x5eg-pf
1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test solder resistance test thermal shock test high temperature high humidity test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test reliability test: test item 6/6 page this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 description test condition reference standard ligitek electronics co.,ltd. property of ligitek only part no. la209b-1/x5eg-pf
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