single digit led display (0.39 inch) LSD3B64S-XX-PF data sheet doc. no : qw0905- rev. : a date : - 2008 ligitek electronics co.,ltd. property of ligitek only 13 - jun. LSD3B64S-XX-PF lead-free parts pb
ligitek electronics co.,ltd. property of ligitek only part no. package dimensions note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.2(0.047") pin no.1 LSD3B64S-XX-PF ligitek f h k jb n e c d m l g1 g2 a pin 1 pin 9 pin 10 pin 18 23.6 (0.929") 7.0 (0.276") 1.0(0.039") 5.0 0.5 7.52(0.296") LSD3B64S-XX-PF 9.9 (0.39") 10.0 (0.39") 2.54*8 =20.32 (0.8") page1/8
internal circuit diagram ligitek electronics co.,ltd. property of ligitek only part no. n lmdp j g2 h f cde g1 k b a 1815118635142116109712 LSD3B64S-XX-PF LSD3B64S-XX-PF 4. 13. 17 page2/8
ligitek electronics co.,ltd. property of ligitek only electrical connection part no. cathode l 10 pin no. 1 pin no.LSD3B64S-XX-PF cathode dp cathode c 11 12 14 13 16 17 18 15 2 3 5 4 7 8 9 6 common anode LSD3B64S-XX-PF cathode f cathode j cathode h common anode common anode cathode g1 cathode e cathode n cathode d cathode m cathode g2 cathode b cathode k cathode a 3/8 LSD3B64S-XX-PFpage
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. part selection and application information(ratings at 25) orange gaasp/gap parameter absolute maximum ratings at ta=25 forward current per chip power dissipation per chip peak forward current per chip (duty 1/10,0.1ms pulse width) solder temperature 1/16 inch below seating plane for 3 seconds at 260 storage temperature operating temperature reverse current per any chip 20 ma i f 80 80 -25 ~ +85 -25 ~ +85 t opr tstg pd ir i fp 10 mw a ma ligitek electronics co.,ltd. property of ligitek only ratings symbol unit se page4/8 LSD3B64S-XX-PF part no materialemitted chip (nm) p ( nm) common cathode or anode 61045 max. 2.6 1.72.1 min. typ. 0.81.35 min. typ. electrical vf(v)iv(mcd) iv-m 2:1 common anode part no.LSD3B64S-XX-PF
ligitek electronics co.,ltd. property of ligitek only if=20ma test condition if=20ma if=20ma if=10ma vr=5v volt vf forward voltage per chip luminous intensity matching ratio reverse current any chip spectral line half-width peak wavelength luminous intensity per chip iv-m ir p iv a nm mcd nm test condition for each parameter parameter symbol unit page5/8 part no.LSD3B64S-XX-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 se chip page 6/8 part no.LSD3B64S-XX-PF
note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 25 0 120 temp( c) 260 50 preheat 2 /sec max 100 5 /sec max 260 c3sec max 150 time(sec) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c ligitek electronics co.,ltd. property of ligitek only page 7/8 part no. 60 seconds max LSD3B64S-XX-PF
reference standard mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test item operating life test reliability test: test condition 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. high temperature high humidity test high temperature storage test low temperature storage test thermal shock test solder resistance test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.t.sol=260 5 2.dwell time= 10 1sec. ligitek electronics co.,ltd. property of ligitek only solderability test this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec part no. LSD3B64S-XX-PF page8/8
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